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    Method for manufacturing a hybrid integrated component
    2.
    发明授权
    Method for manufacturing a hybrid integrated component 有权
    混合集成部件的制造方法

    公开(公告)号：US08941193B2

    公开(公告)日：2015-01-27

    申请号：US13869428

    申请日：2013-04-24

    申请人： Jens Frey ,  Frank Fischer

    发明人： Jens Frey ,  Frank Fischer

    IPC分类号： B81C3/00 ,  B81B1/00 ,  H01L29/84 ,  B81C1/00 ,  B81B7/00

    CPC分类号： B81C1/00269 ,  B81B7/007 ,  B81C1/00238 ,  B81C2203/0785

    摘要： A simple and cost-effective manufacturing method for hybrid integrated components including at least one MEMS element, a cap for the micromechanical structure of the MEMS element, and at least one ASIC substrate, using which a high degree of miniaturization may be achieved. The micromechanical structure of the MEMS element and the cap are manufactured in a layered structure, proceeding from a shared semiconductor substrate, by applying at least one cap layer to a first surface of the semiconductor substrate, and by processing and structuring the semiconductor substrate proceeding from its other second surface, to produce and expose the micromechanical MEMS structure. The semiconductor substrate is then mounted with the MEMS-structured second surface on the ASIC substrate.

    摘要翻译： 一种用于混合集成部件的简单和成本有效的制造方法，包括至少一个MEMS元件，用于MEMS元件的微机械结构的盖，以及至少一个ASIC基板，其可以实现高度的小型化。 MEMS元件和盖的微机械结构通过将至少一个盖层施加到半导体衬底的第一表面，并且通过加工和构造半导体衬底从共享半导体衬底开始，以分层结构制造，并且从 其另一个第二表面，以产生和暴露微机械MEMS结构。 然后将半导体衬底与MEMS结构的第二表面安装在ASIC衬底上。

    Method for manufacturing a cap for a mems component, and hybrid integrated component having such a cap
    3.
    发明申请
    Method for manufacturing a cap for a mems component, and hybrid integrated component having such a cap 有权
    用于制造用于mems组件的盖的方法，以及具有这种盖的混合集成部件

    公开(公告)号：US20140110800A1

    公开(公告)日：2014-04-24

    申请号：US14058806

    申请日：2013-10-21

    申请人： Johannes CLASSEN ,  Axel Franke ,  Jens Frey ,  Heribert Weber ,  Frank Fischer ,  Patrick Wellner

    发明人： Johannes CLASSEN ,  Axel Franke ,  Jens Frey ,  Heribert Weber ,  Frank Fischer ,  Patrick Wellner

    IPC分类号： B81C1/00 ,  B81B3/00

    CPC分类号： B81C1/00015 ,  B81B3/0018 ,  B81B7/0058

    摘要： A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.

    摘要翻译： 一种用于具有MEMS部件的混合垂直集成部件的盖的制造方法，具有较低的洞穴内部压力的相对较大的洞穴体积以及用于MEMS部件的微机械结构的可靠的过载保护。 在多步骤各向异性蚀刻中，在平盖基板中制造盖结构，并且包括至少一个安装框架，该安装框架具有至少一个安装表面和止动结构，在盖内侧具有至少一个止动表面， 掩模基板被掩模用于具有由不同材料制成的至少两个掩模层的多步各向异性蚀刻，并且选择掩模层的布局以及蚀刻步骤的数量和持续时间，使得安装表面，止动表面和 帽内侧位于帽结构的不同表面水平处。

    HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF
    4.
    发明申请
    HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF 有权
    混合集成组件及其制造方法

    公开(公告)号：US20130299924A1

    公开(公告)日：2013-11-14

    申请号：US13890450

    申请日：2013-05-09

    申请人： Heribert WEBER ,  Frank Fischer ,  Mirko Hattass ,  Yvonne Bergmann

    发明人： Heribert WEBER ,  Frank Fischer ,  Mirko Hattass ,  Yvonne Bergmann

    IPC分类号： B81B3/00 ,  B81C1/00

    CPC分类号： B81B3/0021 ,  B81B2201/025 ,  B81B2207/096 ,  B81C1/00238 ,  B81C1/00261 ,  B81C1/00301 ,  B81C2203/0792 ,  H01L2224/13 ,  H01L2224/48463 ,  H01L2224/73257 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A component system includes at least one MEMS element, a cap for a micromechanical structure of the MEMS element, and at least one ASIC substrate. The micromechanical structure of the MEMS element is implemented in the functional layer of an SOI wafer. The MEMS element is mounted face down, with the structured functional layer on the ASIC substrate, and the cap is implemented in the substrate of the SOI wafer. The ASIC substrate includes a starting substrate provided with a layered structure on both sides. At least one circuit level is implemented in each case both in the MEMS-side layered structure and in the rear-side layered structure of the ASIC substrate. In the ASIC substrate, at least one ASIC through contact is implemented which electrically contacts at least one circuit level of the rear-side layered structure and/or at least one circuit level of the MEMS-side layered structure.

    摘要翻译： 组件系统包括至少一个MEMS元件，用于MEMS元件的微机械结构的盖以及至少一个ASIC基板。 MEMS元件的微机械结构在SOI晶片的功能层中实现。 MEMS元件面朝下安装，ASIC结构上的结构化功能层，并且帽被实现在SOI晶片的衬底中。 ASIC基板包括在两侧设置有分层结构的起始衬底。 在ASIC基板的MEMS侧分层结构和后侧层叠结构中，每种情况都至少实现一个电路电平。 在ASIC基板中，实现至少一个ASIC接触，其电接触后侧分层结构的至少一个电路电平和/或MEMS侧分层结构的至少一个电路电平。

    Method and device for locating tires mounted on a vehicle
    5.
    发明授权
    Method and device for locating tires mounted on a vehicle 有权
    用于定位安装在车辆上的轮胎的方法和装置

    公开(公告)号：US08362897B2

    公开(公告)日：2013-01-29

    申请号：US12526559

    申请日：2008-02-06

    申请人： Alexander Fink ,  Frank Fischer ,  Gregor Kuchler

    发明人： Alexander Fink ,  Frank Fischer ,  Gregor Kuchler

    IPC分类号： G08B1/08 ,  B60C23/00 ,  G01L3/00

    CPC分类号： B60C23/0416 ,  B60C23/007 ,  B60C23/008 ,  B60C23/0444

    摘要： A method and a device for locating tires mounted on a vehicle. High frequency signals are captured by way of a first transmit/receive device arranged on a vehicle, said high-frequency signals originating from a wheel electronic system arranged on the vehicle, said wheel electronic system interacting with tires of a first tire group that are mounted on the vehicle. A trigger signal having a frequency that is clearly lower than the frequency of the high frequency signal, is emitted by the first transmit/receive device. The first transmit/receive device is arranged on the vehicle in such a manner that the tires of the first tire group are mounted on the vehicle and the level of the first trigger signal is selected in such a manner that only one part of the wheel electronic system, which is associated with the tires of the first tire group, captures the first trigger signal and the high frequency signals which originate from the part of the wheel electronic system of the tires of the first wheel group that has captured the first trigger signal, contains information on the obtained first trigger signal.

    摘要翻译： 一种用于定位安装在车辆上的轮胎的方法和装置。 通过布置在车辆上的第一发射/接收装置捕获高频信号，所述高频信号源自布置在车辆上的车轮电子系统，所述车轮电子系统与安装的第一轮胎组的轮胎相互作用 在车上 具有明显低于高频信号频率的频率的触发信号由第一发射/接收装置发射。 第一发送/接收装置被布置在车辆上，使得第一轮胎组的轮胎安装在车辆上，并且以这样的方式选择第一触发信号的电平，使得只有一部分车轮电子 与第一轮胎组的轮胎相关联的系统捕获第一触发信号和源自已经捕获了第一触发信号的第一轮组的轮胎的车轮电子系统的部分的高频信号， 包含获得的第一触发信号的信息。

    Acoustic sensor element
    6.
    发明授权
    Acoustic sensor element 有权
    声学传感器元件

    公开(公告)号：US08089828B2

    公开(公告)日：2012-01-03

    申请号：US12598994

    申请日：2008-06-10

    申请人： Frank Fischer ,  Arnim Hoechst

    发明人： Frank Fischer ,  Arnim Hoechst

    IPC分类号： H04R19/04

    CPC分类号： H04R19/04 ,  H04R19/005

    摘要： A micromechanical acoustic sensor element, which has at least one diaphragm and at least one fixed counter element, the diaphragm being situated in a cavity between a substrate and the counter element and acting as movable electrode of a capacitor system, the counter element acting as first fixed counter electrode of this capacitor system, and at least one through hole being formed in the substrate for the application of sound pressure to the diaphragm. For fixation and strengthening purposes, the counter element is connected to the substrate via at least one support element. The support element is situated in the region of the cavity, and an opening is formed in the diaphragm for the support element.

    摘要翻译： 一种微机械声学传感器元件，其具有至少一个隔膜和至少一个固定的计数元件，所述隔膜位于基板和所述相对元件之间的空腔中，并且用作电容器系统的可移动电极，所述对置元件作为第一 该电容器系统的固定对置电极，以及至少一个通孔，形成在基板中，用于向隔膜施加声压。 为了固定和加强目的，计数元件通过至少一个支撑元件连接到基底。 支撑元件位于空腔的区域中，并且在用于支撑元件的隔膜中形成开口。

    Micromechanical structure for receiving and/or generating acoustic signals, method for producing a micromechanical structure, and use of a micromechanical structure
    9.
    发明授权
    Micromechanical structure for receiving and/or generating acoustic signals, method for producing a micromechanical structure, and use of a micromechanical structure 失效
    用于接收和/或产生声信号的微机械结构，用于产生微机械结构的方法，以及使用微机械结构

    公开(公告)号：US07902615B2

    公开(公告)日：2011-03-08

    申请号：US12084477

    申请日：2006-11-14

    申请人： Roman Schlosser ,  Stefan Weiss ,  Frank Fischer ,  Christoph Schelling

    发明人： Roman Schlosser ,  Stefan Weiss ,  Frank Fischer ,  Christoph Schelling

    IPC分类号： H01L29/84 ,  H04R19/00

    CPC分类号： H04R19/005

    摘要： A micromechanical structure and a method for producing a micromechanical structure are provided, the micromechanical structure being configured for receiving and/or generating acoustic signals in a medium at least partially surrounding the structure. The structure includes a first counterelement that has first openings and essentially forms a first side of the structure, a second counterelement that has second openings and essentially forms a second side of the structure, and an essentially closed diaphragm disposed between the first counterelement and the second counterelement.

    摘要翻译： 提供微机械结构和用于产生微机械结构的方法，所述微机械结构被配置为在至少部分地围绕所述结构的介质中接收和/或产生声信号。 该结构包括具有第一开口并且基本上形成该结构的第一侧面的第一反应体，具有第二开口并且基本上形成该结构的第二侧的第二反应体，以及设置在该第一反应体和该第二反应器之间的基本封闭的隔膜 反数