Process for preparing 2-arylbenzimidazole-5-sulfonic acids
    5.
    发明授权
    Process for preparing 2-arylbenzimidazole-5-sulfonic acids 失效
    制备2-芳基苯并咪唑-5-磺酸的方法

    公开(公告)号:US5473079A

    公开(公告)日:1995-12-05

    申请号:US122566

    申请日:1993-10-01

    CPC分类号: C07D235/18

    摘要: The invention relates to an improved process for preparing 2-arylbenzimidazole-5-sulfonic acids of the formula I, ##STR1## in which Ar is unsubstituted phenyl or phenyl substituted by one or more C.sub.1 -C.sub.6 alkyl or alkoxy groups andm is 1, 2 or 3,wherein o-phenylenediamine is reacted in the presence of sulfuric acid at between room temperature and 250.degree. C. with a benzoic acid derivative of the formula IIAr(--X).sub.m II in which Ar and m are as above, and X is COO-alkyl, where alkyl is n-alkyl having from 1 to 6 C atoms, COOH, COCl, COBr or CN, and new arylbenzimidazole acids of the formula Ia ##STR2##

    摘要翻译: PCT No.PCT / EP93 / 00179 Sec。 371日期:1993年9月30日 102(e)1993年9月30日PCT 1993年1月27日PCT PCT。 公开号WO93 / 15061 日本公开日1993年8月5日。本发明涉及一种制备式I的2-芳基苯并咪唑-5-磺酸的改进方法,其中Ar为未取代的苯基或被一个或多个C 1 -C 6烷基取代的苯基 或烷氧基,m为1,2或3,其中邻苯二胺在室温至250℃的硫酸存在下与式II Ar(-X)mII的苯甲酸衍生物反应,其中 Ar和m如上,X是COO-烷基,其中烷基是具有1至6个C原子的正烷基,COOH,COCl,COBr或CN,以及式Ia的新芳基苯并咪唑酸(Ia)

    Negative photoresists of the polyimide type containing 1,2-disulfones
    7.
    发明授权
    Negative photoresists of the polyimide type containing 1,2-disulfones 失效
    含有1,2-二砜的聚酰亚胺类型的负型光致抗蚀剂

    公开(公告)号:US4980268A

    公开(公告)日:1990-12-25

    申请号:US321432

    申请日:1989-03-09

    摘要: The invention relates to negative photoresists of the polyimide type essentially containing, in an organic solvent, in each case at least(a) one polyamide-acid or polyamide-acid derivative prepolymer which can be converted into a highly heat-resistant polyimide polymer,(b) a photoinitiator, and, if appropriate, further customary additives which contain, as the photoinitiator, a compound of the formula IR.sup.1 --SO.sub.2 --SO.sub.2 --R.sup.2 I in which R.sup.1 and R.sup.2 are as defined.

    摘要翻译: 本发明涉及聚酰亚胺类型的负型光致抗蚀剂,其基本上在有机溶剂中含有至少(a)一种聚酰胺酸或聚酰胺 - 酸衍生物预聚物,其可以转化为高耐热聚酰亚胺聚合物( b)光引发剂,以及如果合适的话,还含有作为光引发剂的式Ⅰ化合物R1-SO2-SO2-R2Ⅰ的其它常规添加剂,其中R 1和R 2如所定义。

    Photoresists suitable for forming relief structures of highly
heat-resistant polymers
    9.
    发明授权
    Photoresists suitable for forming relief structures of highly heat-resistant polymers 失效
    适用于形成高耐热聚合物浮雕结构的光刻胶

    公开(公告)号:US4540650A

    公开(公告)日:1985-09-10

    申请号:US531781

    申请日:1983-09-13

    CPC分类号: G03F7/027 C08F291/18

    摘要: Photoresists suitable for use for forming relief structures of highly heat-resistant polymers and which contain soluble polymeric precursors which carry radiation-reactive radicals bonded through carboxylic ester groups have an increased light-sensitivity when they also contain at least one radiation-reactive, polymerizable allyl compound which has a boiling point above 180.degree., the allyl group thereof being bonded via an oxygen, sulfur and/or nitrogen atom. The highly heat-resistant polymers which can be prepared by means of these photoresists have excellent chemical, electrical and mechanical properties.

    摘要翻译: 适用于形成高耐热性聚合物的浮雕结构的光刻胶,其含有可携带通过羧酸酯基团键合的辐射反应性基团的可溶性聚合物前体当它们还含有至少一种辐射反应性可聚合烯丙基 沸点高于180℃的化合物,其烯丙基通过氧,硫和/或氮原子键合。 可通过这些光致抗蚀剂制备的高耐热聚合物具有优异的化学,电学和机械性能。

    Process for the preparation of [2,2]-paracyclophane
    10.
    发明授权
    Process for the preparation of [2,2]-paracyclophane 失效
    制备[2,2] - 对环磷酰胺的方法

    公开(公告)号:US4532369A

    公开(公告)日:1985-07-30

    申请号:US546353

    申请日:1983-10-28

    申请人: Hartmut Hartner

    发明人: Hartmut Hartner

    CPC分类号: C07C1/323 C07C2103/92

    摘要: A process for the preparation of [2,2]-paracyclophane comprises contacting aqueous p-methylbenzyltrimethylammonium hydroxide with sodium hydroxide or potassium hydroxide, in the presence of dimethyl sulfoxide, and preferably in the further presence of an inert water-immiscible organic solvent.

    摘要翻译: 制备[2,2] - 对环烷酸的方法包括在二甲基亚砜存在下将对甲基苄基三甲基氢氧化铵与氢氧化钠或氢氧化钾的水溶液接触,优选在惰性的与水不混溶的有机溶剂的存在下进行。