公开(公告)号：USD399775S

公开(公告)日：1998-10-20

申请号：US77276

申请日：1997-10-01

申请人： Fumikazu Masuda ,  Shunichiro Awa ,  Isamu Ikeda ,  Yoshihito Omura ,  Koichi Kondo ,  Hideo Sawada

设计人： Fumikazu Masuda ,  Shunichiro Awa ,  Isamu Ikeda ,  Yoshihito Omura ,  Koichi Kondo ,  Hideo Sawada

公开(公告)号：US08979521B2

公开(公告)日：2015-03-17

申请号：US13403477

申请日：2012-02-23

申请人： Koichi Kondo

发明人： Koichi Kondo

IPC分类号： B05C5/02 ,  B05C11/10

CPC分类号： B05C11/1002 ,  B05C5/0254

摘要： A slot nozzle assembly for extruding a fluid material includes a slot for extruding a fluid material, a plurality of material exit ports, and a plurality of material dispersion passages communicating with the slot and the plurality of material exit ports, respectively. The widths of the plurality of material dispersion passages in the longitudinal direction of the slot widen from the plurality of material exit ports toward the slot for extruding a fluid material essentially uniformly in the longitudinal direction of the slot.

摘要翻译： 用于挤出流体材料的狭槽喷嘴组件包括用于挤出流体材料的槽，多个材料出口，以及分别与槽和多个材料出口连通的多个材料分散通道。 多个材料分散通道在槽的纵向方向上的宽度从多个材料出口朝向狭槽加宽，用于在槽的纵向方向上基本均匀地挤出流体材料。

公开(公告)号：US08326550B2

公开(公告)日：2012-12-04

申请号：US12865450

申请日：2009-01-14

申请人： Tetsuya Shimakata ,  Koichi Kondo

发明人： Tetsuya Shimakata ,  Koichi Kondo

IPC分类号： G01L7/00 ,  G06F19/00

CPC分类号： G01L19/00

摘要： When the damping time constant Dτ is changed to Dτ=0, the sampling period Ts is automatically changed from 100 ms to 50 ms. The sampling time is automatically changed from 60 ms to 30 ms. Thus, when the damping time constant Dτ is changed to Dτ=0, a processing unit samples an electrical signal corresponding to the pressure difference of a fluid detected by a differential pressure sensor for the sampling time ts=30 ms in every sampling period Ts=50 ms, and finds the measurement value ΔP of the differential pressure by performing a variety of operation processing including a linearization operation and a square root operation on the sampled electrical signal. In the operation processing, the processing unit does not perform a damping operation.

摘要翻译： 当阻尼时间常数Dτ变为Dτ= 0时，采样周期Ts自动从100ms变为50ms。 采样时间自动从60 ms变为30 ms。 因此，当阻尼时间常数Dτ变为Dτ= 0时，处理单元对每个采样周期Ts = 30ms的采样时间ts = 30ms对由压差传感器检测的流体的压力差对应的电信号进行采样， 通过对采样的电信号进行包括线性化运算和平方根运算的各种运算处理，求出差压的测量值＆Dgr; P。 在操作处理中，处理单元不执行阻尼操作。

公开(公告)号：US08198175B2

公开(公告)日：2012-06-12

申请号：US13023165

申请日：2011-02-08

申请人： Kazuma Sekiya ,  Koichi Kondo

发明人： Kazuma Sekiya ,  Koichi Kondo

IPC分类号： H01L21/46 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L2221/68331 ,  H01L2221/68336 ,  H01L2224/32245 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00

摘要： A processing method for a package substrate having a base substrate partitioned by a plurality of crossing division lines to form a plurality of chip forming areas where a plurality of semiconductor chips are respectively formed and molded with resin. The package substrate has a resin surface and an electrode surface opposite to the resin surface. The processing method includes a warp correcting step of cutting the package substrate from the resin surface or the electrode surface along the division lines by using a cutting blade to form a cut groove, thereby correcting a warp of the package substrate, and a grinding step of grinding the resin surface of the package substrate in the condition where the electrode surface of the package substrate is held on a holding table after performing the warp correcting step, thereby reducing the thickness of the package substrate to a predetermined thickness.

摘要翻译： 一种用于封装基板的处理方法，其具有由多个交叉分割线分隔的基底基板，以形成多个芯片形成区域，其中分别形成多个半导体芯片并用树脂模制。 封装基板具有树脂表面和与树脂表面相对的电极表面。 处理方法包括：通过使用切割刀片切割切割槽来切割来自树脂表面或电极表面的封装基板的翘曲校正步骤，从而校正封装基板的翘曲，并且研磨步骤 在进行翘曲校正步骤之后，将封装基板的电极表面保持在保持台上的状态下研磨封装基板的树脂表面，从而将封装基板的厚度减小到预定厚度。

公开(公告)号：US20110256667A1

公开(公告)日：2011-10-20

申请号：US13088591

申请日：2011-04-18

申请人： Akihito Kawai ,  Koichi Kondo

发明人： Akihito Kawai ,  Koichi Kondo

IPC分类号： H01L21/78

CPC分类号： H01L21/304 ,  B24B1/00 ,  B24B7/228 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/16 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/75744 ,  H01L2224/75988 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2224/81

摘要： A manufacturing method for a stacked wafer configured by bonding a mother wafer having a plurality of first semiconductor device and a stacking wafer having a plurality of second semiconductor devices. The manufacturing method includes the steps of attaching a protective member to the front side of the stacking wafer to protect the second semiconductor devices, next grinding the back side of the stacking wafer, next bonding the front side of a reinforcing wafer through a bonding layer to the back side of the stacking wafer, next dividing the stacking wafer together with the reinforcing wafer into the plural second semiconductor devices, next bonding the front side of each second semiconductor device to the front side of the mother wafer to thereby connect the electrodes of each second semiconductor device to the electrodes of the corresponding first semiconductor device of the mother wafer, and finally grinding the reinforcing wafer bonded to the back side of each second semiconductor device to thereby remove the reinforcing wafer.

摘要翻译： 一种堆叠晶片的制造方法，其通过将具有多个第一半导体器件的母晶片和具有多个第二半导体器件的堆叠晶片接合而构成。 该制造方法包括以下步骤：将保护构件附接到堆叠晶片的前侧以保护第二半导体器件，接下来研磨堆叠晶片的背面，接下来通过粘合层将加强晶片的前侧粘合到 堆叠晶片的背面，接下来将堆叠晶片与增强晶片一起分割成多个第二半导体器件，接下来将每个第二半导体器件的前侧接合到母晶片的前侧，从而将每个 将第二半导体器件施加到母晶片的相应的第一半导体器件的电极，并且最后研磨结合到每个第二半导体器件的背面的加强晶片，从而去除加强晶片。

公开(公告)号：US20080132035A1

公开(公告)日：2008-06-05

申请号：US11998045

申请日：2007-11-28

申请人： Koichi Kondo

发明人： Koichi Kondo

IPC分类号： H01L21/304

CPC分类号： H01L21/3043 ,  H01L21/563 ,  H01L21/67207 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/28 ,  H01L2224/274 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082

摘要： An undefill material is provided on the surface of a wafer in such a manner as to cover bumps, then the wafer is irradiated with a laser beam from the surface thereof and along planned cutting lines so as to remove an insulation layer and the underfill material present over the planned cutting lines, and the debris generated in this instance are deposited on the underfill material and are thereby prevented from being deposited on the wafer surface and/or on the bumps. Subsequently, a surface layer of the underfill material is cut so as to make the bumps flush in height and to expose the tips of the bumps.

摘要翻译： 以覆盖凸块的方式在晶片的表面上提供未去金属材料，然后用激光束从其表面和沿着规划的切割线照射晶片，从而去除绝缘层和存在的底部填充材料 在这种情况下产生的碎屑沉积在底部填充材料上，从而防止沉积在晶片表面和/或凸块上。 随后，对底部填充材料的表面层进行切割，以使凸块高度齐平并露出凸点的尖端。

公开(公告)号：US4270923A

公开(公告)日：1981-06-02

申请号：US107179

申请日：1979-12-26

申请人： Koichi Kondo ,  Isamu Yoshida ,  Takashi Kobayashi

发明人： Koichi Kondo ,  Isamu Yoshida ,  Takashi Kobayashi

IPC分类号： G01N33/53 ,  G01N33/74 ,  G01N33/76

CPC分类号： G01N33/76 ,  Y10S436/814 ,  Y10S436/818 ,  Y10S436/825

摘要： By using a new pretreatment agent consisting essentially of a carboxylic acid-type cation exchange resin fiber or a siliconized glass fiber, the interfering components and the elements of turbidity present in a subject fluid for immunologic pregnancy test can be specifically removed without entailing a substantial loss of human chorionic gonadotropin contained in the subject fluid.

摘要翻译： 通过使用基本上由羧酸型阳离子交换树脂纤维或硅化玻璃纤维组成的新的预处理剂，可以特异性地除去存在于用于免疫妊娠试验的目标流体中的干扰成分和浊度元素，而不会引起实质损失 的人绒毛膜促性腺激素。

公开(公告)号：US08313413B2

公开(公告)日：2012-11-20

申请号：US12053837

申请日：2008-03-24

申请人： Hitoshi Nomasa ,  Koichi Kondo

发明人： Hitoshi Nomasa ,  Koichi Kondo

IPC分类号： B60W10/04 ,  B60W10/30

CPC分类号： B60W20/00 ,  B60K6/365 ,  B60K6/405 ,  B60K6/445 ,  B60W10/02 ,  B60W10/04 ,  B60W10/06 ,  B60W10/08 ,  B60W10/30 ,  F02D41/042 ,  F02N11/003 ,  F16H2037/0866 ,  Y02T10/6239 ,  Y02T10/6286 ,  Y10T477/23

摘要： A hybrid vehicle driving device is capable of causing a motor-powered travel of a hybrid vehicle in which only an electric motor is used as a drive force source, by driving the electric motor with electric power from an electric storage device while a rotational driving of an internal combustion engine has been stopped. A control device for the hybrid vehicle driving device includes a rotational drive portion that determines whether or not supply of a lubrication oil to at least a portion of the power transmission device by the lubrication oil supply device is necessary based on a travel distance in the motor-powered travel following a stop of the rotational driving of the internal combustion engine, and rotationally drives the internal combustion engine based on determination as to need for the supply of the lubrication oil.

摘要翻译： 混合动力车辆驱动装置能够通过利用来自蓄电装置的电力驱动电动马达来驱动仅使用电动机作为驱动力源的混合动力车辆的电动机行驶，同时旋转驱动 内燃机已停止。 用于混合动力车辆驱动装置的控制装置包括旋转驱动部，其基于电动机的行驶距离来判定是否需要通过润滑油供给装置向至少一部分动力传递装置供给润滑油 在停止内燃机的旋转驱动之后，驱动行驶，并且基于需要供给润滑油的判定旋转地驱动内燃机。

公开(公告)号：US20120219657A1

公开(公告)日：2012-08-30

申请号：US13403477

申请日：2012-02-23

申请人： Koichi Kondo

发明人： Koichi Kondo

IPC分类号： B29C47/30

CPC分类号： B05C11/1002 ,  B05C5/0254

摘要： Problem: To provide a slot nozzle assembly that can extrude a fluid material essentially uniformly in the longitudinal direction of the slot.Means of Solution: A slot nozzle assembly (1) for extruding a fluid material, that has a slot (9) for extruding a fluid material, a plurality of material exit ports 5b), and a plurality of material dispersion passages (7) communicating with the slot (9) and the plurality of material exit ports (5b) respectively; the widths of the plurality of material dispersion passages (7) in the longitudinal direction of the slot (9) widen from the plurality of material exit ports (5b) toward the slot (9).

摘要翻译： 问题：提供一种缝隙喷嘴组件，其能够在狭槽的纵向方向上基本均匀地挤压流体材料。 解决方案：一种用于挤出流体材料的狭缝喷嘴组件（1），其具有用于挤出流体材料的槽（9），多个材料出口5b）和多个材料分散通道（7），其连通 分别具有槽（9）和多个材料出口（5b）; 多个材料分散通道（7）在槽（9）的纵向方向上的宽度从多个材料出口（5b）向槽（9）宽。

公开(公告)号：US08152670B2

公开(公告)日：2012-04-10

申请号：US12623810

申请日：2009-11-23

申请人： Tetsuro Kuzuya ,  Ryuji Ibaraki ,  Kenji Odaka ,  Yuji Iwase ,  Tatsushi Takenaka ,  Tomoyuki Maruyama ,  Koichi Kondo

发明人： Tetsuro Kuzuya ,  Ryuji Ibaraki ,  Kenji Odaka ,  Yuji Iwase ,  Tatsushi Takenaka ,  Tomoyuki Maruyama ,  Koichi Kondo

IPC分类号： F16H3/72

CPC分类号： B60W20/40 ,  B60K1/02 ,  B60K6/365 ,  B60K6/445 ,  B60K6/547 ,  B60L2240/423 ,  B60W10/06 ,  B60W10/08 ,  B60W20/00 ,  B60W2710/0666 ,  B60W2710/083 ,  F16H3/728 ,  F16H2037/101 ,  F16H2200/2007 ,  F16H2200/2023 ,  F16H2200/2035 ,  Y02T10/6239 ,  Y02T10/6286 ,  Y02T10/642

摘要： A hybrid vehicle power transmission device provided with a power distribution mechanism composed of a planetary gear device for distributing motive power of a drive source to a motor and an output shaft is further provided with a damper device in a power transmission path between the power distribution mechanism and a first motor. Consequently, the damper device receives only reaction torque dealt by the first motor through the power distribution mechanism with respect to drive torque of an engine. Thus, since the torque transmitted to the damper device is smaller than the drive torque of the engine, the torque capacity of the damper device can be decreased and the size of the damper device can be reduced. As a result, the overall size of the power transmission device can be similarly reduced.

摘要翻译： 一种混合动力车辆动力传递装置，其具备由行星齿轮装置构成的动力分配机构，该行星齿轮装置用于将驱动源的动力分配给电动机和输出轴，在所述配电机构 和第一马达。 因此，阻尼器装置相对于发动机的驱动转矩仅通过动力分配机构仅接收由第一电动机施加的反作用转矩。 因此，由于传递到阻尼器装置的扭矩小于发动机的驱动扭矩，所以可以减小阻尼装置的扭矩容量，并且减小阻尼装置的尺寸。 结果，能够同样地减小动力传递装置的总体尺寸。