SYSTEMS AND METHODS FOR ALTERING MICROSTRUCTURES OF MATERIALS

    公开(公告)号:US20210214826A1

    公开(公告)日:2021-07-15

    申请号:US16739659

    申请日:2020-01-10

    IPC分类号: C22F1/00 C22F3/02

    摘要: Systems and methods for altering microstructures of materials are disclosed. The system may include at least one computing device in communication with a heating device and an electromagnetic device. The computing device(s) may be configured to alter a microstructure of a material forming a component by performing processes including heating the component using the heating device to a predetermined temperature. The predetermined temperature may be below a first phase-transformation temperature based on the material forming the component, and a second phase-transformation temperature based on the material forming the component, where the second phase-transformation temperature greater than the first phase-transformation temperature. The computing device(s) may also perform processes including intermittently magnetizing the heated component using the electromagnetic device for a predetermined number of cycles, and cooling the component after intermittently magnetizing the heated component.

    Systems and methods for altering microstructures of materials

    公开(公告)号:US11466935B2

    公开(公告)日:2022-10-11

    申请号:US16739659

    申请日:2020-01-10

    摘要: Systems and methods for altering microstructures of materials are disclosed. The system may include at least one computing device in communication with a heating device and an electromagnetic device. The computing device(s) may be configured to alter a microstructure of a material forming a component by performing processes including heating the component using the heating device to a predetermined temperature. The predetermined temperature may be below a first phase-transformation temperature based on the material forming the component, and a second phase-transformation temperature based on the material forming the component, where the second phase-transformation temperature greater than the first phase-transformation temperature. The computing device(s) may also perform processes including intermittently magnetizing the heated component using the electromagnetic device for a predetermined number of cycles, and cooling the component after intermittently magnetizing the heated component.