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    Components with porous metal cooling and methods of manufacture
    4.
    发明授权
    Components with porous metal cooling and methods of manufacture 有权
    具有多孔金属冷却的部件和制造方法

    公开(公告)号：US09003657B2

    公开(公告)日：2015-04-14

    申请号：US13718256

    申请日：2012-12-18

    Applicant: General Electric Company

    Inventor： Ronald Scott Bunker ,  Scott Andrew Weaver ,  Wayne Charles Hasz

    IPC: B21D53/78 ,  B21K3/04 ,  B23P15/02 ,  F02C7/12 ,  C23C4/02 ,  F01D5/18

    CPC classification number: F02C7/12 ,  B23P2700/06 ,  C23C4/02 ,  F01D5/183 ,  F05D2260/203 ,  Y02T50/672 ,  Y02T50/676 ,  Y10T29/49336 ,  Y10T29/49339 ,  Y10T29/49341 ,  Y10T29/49986

    Abstract: A manufacturing method includes providing a substrate with an outer surface and at least one interior space and machining the substrate to selectively remove a portion of the substrate and define one or more cooling supply holes therein. Each of the one or more cooling supply holes is in fluid communication with the at least one interior space. The method further includes disposing an open cell porous metallic layer on at least a portion of the substrate. The open cell porous metallic layer is in fluid communication with the one or more cooling supply holes. A coating layer is disposed on the open cell porous metallic layer. The coating layer having formed therein one or more cooling exit holes in fluid communication with the open cell porous metallic layer. The substrate, the one or more cooling supply holes, the open cell porous metallic layer and the cooling exit holes providing a cooling network for a component.

    Abstract translation: 一种制造方法包括：提供具有外表面和至少一个内部空间的基板，并加工所述基板以选择性地移除所述基板的一部分并在其中限定一个或多个冷却供应孔。 所述一个或多个冷却供应孔中的每一个与所述至少一个内部空间流体连通。 该方法还包括在基底的至少一部分上设置开孔多孔金属层。 开孔多孔金属层与一个或多个冷却供给孔流体连通。 在开孔多孔金属层上设置涂层。 涂层在其中形成有与开孔多孔金属层流体连通的一个或多个冷却出口孔。 衬底，一个或多个冷却供应孔，开孔多孔金属层和冷却出口孔为组件提供冷却网络。

    COMPONENTS WITH POROUS METAL COOLING AND METHODS OF MANUFACTURE
    6.
    发明申请
    COMPONENTS WITH POROUS METAL COOLING AND METHODS OF MANUFACTURE 有权
    具有多孔金属冷却的组件和制造方法

    公开(公告)号：US20140169943A1

    公开(公告)日：2014-06-19

    申请号：US13718256

    申请日：2012-12-18

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Ronald Scott Bunker ,  Scott Andrew Weaver ,  Wayne Charles Hasz

    IPC: F02C7/12 ,  B23P17/04

    CPC classification number: F02C7/12 ,  B23P2700/06 ,  C23C4/02 ,  F01D5/183 ,  F05D2260/203 ,  Y02T50/672 ,  Y02T50/676 ,  Y10T29/49336 ,  Y10T29/49339 ,  Y10T29/49341 ,  Y10T29/49986

    Abstract: A manufacturing method includes providing a substrate with an outer surface and at least one interior space and machining the substrate to selectively remove a portion of the substrate and define one or more cooling supply holes therein. Each of the one or more cooling supply holes is in fluid communication with the at least one interior space. The method further includes disposing an open cell porous metallic layer on at least a portion of the substrate. The open cell porous metallic layer is in fluid communication with the one or more cooling supply holes. A coating layer is disposed on the open cell porous metallic layer. The coating layer having formed therein one or more cooling exit holes in fluid communication with the open cell porous metallic layer. The substrate, the one or more cooling supply holes, the open cell porous metallic layer and the cooling exit holes providing a cooling network for a component.

    Abstract translation: 一种制造方法包括：提供具有外表面和至少一个内部空间的基板，并加工所述基板以选择性地移除所述基板的一部分并且在其中限定一个或多个冷却供应孔。 所述一个或多个冷却供应孔中的每一个与所述至少一个内部空间流体连通。 该方法还包括在基底的至少一部分上设置开孔多孔金属层。 开孔多孔金属层与一个或多个冷却供给孔流体连通。 在开孔多孔金属层上设置涂层。 涂层在其中形成有与开孔多孔金属层流体连通的一个或多个冷却出口孔。 衬底，一个或多个冷却供应孔，开孔多孔金属层和冷却出口孔为组件提供冷却网络。

    Capacitive sensor device and method of manufacture
    10.
    发明授权
    Capacitive sensor device and method of manufacture 有权
    电容式传感器装置及其制造方法

    公开(公告)号：US09417048B2

    公开(公告)日：2016-08-16

    申请号：US13665192

    申请日：2012-10-31

    Applicant: General Electric Company

    Inventor： David Richard Esler ,  Emad Andarawis Andarawis ,  Wayne Charles Hasz ,  Mahadevan Balasubramaniam

    IPC: F01D11/20 ,  G01B7/14

    CPC classification number: G01B7/14

    Abstract: A capacitive sensor device and a method of manufacture are provided. The capacitive sensor device includes at least one sensor tip that includes an electrode positioned at a first end of the sensor tip, and a stem member coupled to the electrode and extending toward a second end of the sensor tip. The device also includes a coaxial cable including a center conductor, the center conductor coupled to the sensor tip at the second end, and an insulation layer supporting the sensor tip between the first and second ends. The insulation layer includes a metallization on a portion surrounding the second end of the sensor tip. The device further includes a casing surrounding a portion of the coaxial cable, the metallization, and the coupling of the center conductor and the sensor tip, wherein a braze joint is formed between the casing and the metallization to form a hollow, hermetic cavity.

    Abstract translation: 提供了电容传感器装置和制造方法。 电容传感器装置包括至少一个传感器尖端，其包括位于传感器尖端的第一端处的电极，以及耦合到电极并朝向传感器尖端的第二端延伸的杆构件。 该装置还包括同轴电缆，该同轴电缆包括中心导体，中心导体在第二端处耦合到传感器尖端，以及绝缘层，其在第一和第二端之间支撑传感器尖端。 绝缘层包括在围绕传感器顶端的第二端的部分上的金属化。 该装置还包括围绕同轴电缆的一部分的壳体，金属化以及中心导体和传感器尖端的耦合，其中在壳体和金属化之间形成钎焊接头以形成中空的密封腔。

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