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    ISOLATOR DESIGN FOR VEHICLE WHEEL
    1.
    发明申请
    ISOLATOR DESIGN FOR VEHICLE WHEEL 审中-公开

    公开(公告)号：US20180186178A1

    公开(公告)日：2018-07-05

    申请号：US15741529

    申请日：2015-07-10

    Applicant: GM Global Technology Operations LLC

    Inventor： Ming LIU ,  Lei GAO

    IPC: B60B3/14

    CPC classification number: B60B3/145 ,  B60B7/066 ,  B60B2360/102 ,  B60B2360/106 ,  B60B2900/141

    Abstract: A number of variations may include a vehicle which may have a vehicle body and a vehicle hub operably coupled to the vehicle body. A vehicle wheel may be operably coupled to the vehicle hub. The vehicle wheel may be isolated from the vehicle hub by at least one isolation feature selected from the group consisting of: an extended flange portion of the vehicle wheel may be disposed between a pilot hole and the vehicle hub, a multiple piece cover portion may fully cover the pilot hole, a drain slot may be disposed on the vehicle wheel and the drain slot may have a slope of at least five degrees, or an enhanced bushing may create a non-flat profile between the vehicle wheel and a fixation device.

    INVERTER MODULE FOR VEHICLE
    4.
    发明公开
    INVERTER MODULE FOR VEHICLE 审中-公开

    公开(公告)号：US20230291321A1

    公开(公告)日：2023-09-14

    申请号：US17706726

    申请日：2022-03-29

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Ming LIU ,  Muhammad Hussain ALVI ,  Chandra S. NAMUDURI

    IPC: H02M7/00 ,  H02M7/5387 ,  H02M7/5388 ,  H02P27/08

    CPC classification number: H02M7/003 ,  H02M7/53875 ,  H02M7/5388 ,  H02P27/08

    Abstract: A power module includes: a first substrate layer that is disposed on a first plane; a second substrate layer that is disposed on a second plane that is parallel to the first plane; first and second electrical conductors that are configured to be electrically connected to first and second direct current (DC) reference potentials, respectively, and that extend outwardly from the power module on a third plane that is parallel to the first and second planes; third, fourth, and fifth electrical conductors that are configured to be electrically connected to first, second, and third alternating current (AC) reference potentials, respectively, and that extend outwardly from the power module on a fourth plane that is parallel to the first, second, and third planes; and a plurality of dies of switches, respectively, disposed between the first and second substrate layers.

    3-D POWER MODULES WITH DOUBLE SIDED COOLING PER SEMICONDUCTOR DIE
    5.
    发明申请
    3-D POWER MODULES WITH DOUBLE SIDED COOLING PER SEMICONDUCTOR DIE 有权

    公开(公告)号：US20220310481A1

    公开(公告)日：2022-09-29

    申请号：US17215883

    申请日：2021-03-29

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Muhammad H. ALVI ,  Ming LIU ,  Rashmi PRASAD ,  Anthony M. COPPOLA

    IPC: H01L23/473 ,  H01L25/065 ,  H05K7/20

    Abstract: A power module is provided and includes first stack, second stack, and third stacks of layers, a heat pipe, and at least one cold plate or heat sink. The third stack of layers is disposed between the first stack of layers and the second stack of layers and includes a first semiconductor die, a second semiconductor die and a center spacer layer disposed between the first semiconductor die and the second semiconductor die. The heat pipe extends at least partially into the center spacer layer. The at least one cold plate or heat sink receives thermal energy from the first stack of layers and the second stack of layers. The second stack of layers, the third stack of layers, the heat pipe and the at least one cold plate or heat sink facilitate dual sided cooling of each of the first semiconductor die and the second semiconductor die.

    SYSTEMS AND METHODS FOR COOLING POWER ELECTRONICS USING A THERMOSYPHON
    7.
    发明公开
    SYSTEMS AND METHODS FOR COOLING POWER ELECTRONICS USING A THERMOSYPHON 审中-公开

    公开(公告)号：US20240130085A1

    公开(公告)日：2024-04-18

    申请号：US18127115

    申请日：2023-03-28

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Ming LIU ,  Jian Yao ,  Chengwu Duan ,  Chih-hung Yen ,  Anil K. Sachdev

    IPC: H05K7/20

    CPC classification number: H05K7/20336 ,  H05K7/203

    Abstract: A cooling system includes a housing including a base portion with sides and a bottom surface that define a cavity and a cover portion to enclose the base portion and including cooling members attached thereto. A shield is arranged in the cavity. A vertical member is arranged below the shield to define a first fluid chamber between one side of the vertical member and one side of the base portion and a second fluid chamber between an opposite side of the vertical member and another side of the base portion. The electronic components are arranged in the second fluid chamber. Cooling fluid is arranged in the cavity and has a fluid level below at least a portion of the shield. The housing is mounted at an inclined angle relative to horizontal or the housing is mounted parallel to horizontal and the shield is mounted at the inclined angle.

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