公开(公告)号：US20080084678A1

公开(公告)日：2008-04-10

申请号：US11539893

申请日：2006-10-10

申请人： Gary R. Burhance ,  John C. Barron ,  Jorge L. Garcia ,  David J. Meyer

发明人： Gary R. Burhance ,  John C. Barron ,  Jorge L. Garcia ,  David J. Meyer

IPC分类号： H05K1/18

CPC分类号： H05K1/186 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0949 ,  H05K2201/10037

摘要： A printed circuit board and a method for imbedding a battery in the printed circuit board are disclosed. The method includes connecting the battery to a first inner pad and a second inner pad on an inner core layer and forming a first battery contact between a first outer pad and the first inner pad. The method also includes electrically isolating the first battery contact and forming a second battery contact between a second outer pad and the second inner pad.

摘要翻译： 公开了印刷电路板和将电池嵌入印刷电路板中的方法。 该方法包括将电池连接到内芯层上的第一内垫和第二内垫，并在第一外垫和第一内垫之间形成第一电池接触。 该方法还包括电隔离第一电池触点并在第二外垫和第二内垫之间形成第二电池触点。

公开(公告)号：US07375979B2

公开(公告)日：2008-05-20

申请号：US11089986

申请日：2005-03-25

申请人： Gary R. Burhance ,  John C. Barron ,  Peter J. Bartels

发明人： Gary R. Burhance ,  John C. Barron ,  Peter J. Bartels

IPC分类号： H05K1/11

CPC分类号： H05K1/0228 ,  H05K1/0245 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/097

摘要： A differential pair (200) is provided by routing a printed circuit board (202) having high density interconnect (HDI) substrate (204) with first and second metal layers (212, 218) such that a first runner (206) forms a zigzag pattern using the two metal layers while a second runner (208) forms a second zigzag pattern on the same two metal layers. The first and second zigzag patterns overlap so as to provide orthogonal signal flow.

摘要翻译： 差分对（200）通过将具有高密度互连（HDI）衬底（204）的印刷电路板（202）与第一和第二金属层（212,218）布线使得第一流道（206）形成之字形 图案使用两个金属层，而第二流道（208）在相同的两个金属层上形成第二之字形图案。 第一和第二之字形图案重叠以提供正交信号流。

公开(公告)号：US06928726B2

公开(公告)日：2005-08-16

申请号：US10626058

申请日：2003-07-24

申请人： James A. Zollo ,  John K. Arledge ,  John C. Barron ,  Gary R. Burhance ,  John Holley ,  Henry F. Liebman

发明人： James A. Zollo ,  John K. Arledge ,  John C. Barron ,  Gary R. Burhance ,  John Holley ,  Henry F. Liebman

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H05K3/30 ,  H05K1/16

CPC分类号： H05K1/185 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.

摘要翻译： 衬底组件（10）及其制造方法在衬底芯（22）的通孔（24）中具有至少一个嵌入组件（25），并且包括耦合到衬底芯的第一粘合剂层（20）和 第二粘合剂层（26）在衬底芯的顶表面的至少部分上和嵌入部件的部分之上。 衬底组件还可以包括粘附到衬底芯的底表面的第一导电层（18）和第二粘合剂层上的第二导电层（28）。 衬底组件还可以包括在嵌入部件的导电表面与第一导电层和第二导电层中的至少一个之间的互连（36）。 互连可以通过至少暂时暴露嵌入式部件的导电表面（32）的开口（34）形成。

公开(公告)号：US5771154A

公开(公告)日：1998-06-23

申请号：US833018

申请日：1997-04-03

申请人： Mitchell E. Goodman ,  John C. Barron ,  Robert B. Ford

发明人： Mitchell E. Goodman ,  John C. Barron ,  Robert B. Ford

IPC分类号： H04R1/00 ,  H05K7/20 ,  H05H7/20

CPC分类号： H04R1/00

摘要： A heatsink assembly (100) provides additional heat dissipation for a high-power integrated circuit package (102) contained within a communication product housing (130). There is an integral heatsink (104) protruding from the package. The heatsink frictionally mates with the first end (108) of a thermally conductive member (106). The second end (110) of the conductive member is magnetically-coupled to the rear surface (123) of a loudspeaker magnet (122). Tabs (111) extending away from the second end of the conductive member provide added mechanical support, preventing the second end from sliding against the rear surface of the magnet. Heat generated by the high-power device is transferred from the package heatsink, via the thermally conductive member, to the loudspeaker magnet such that heat is dissipated away from the package and toward the magnet.

摘要翻译： 散热器组件（100）为包含在通信产品外壳（130）内的大功率集成电路封装（102）提供额外的散热。 从包装件突出的整体散热器（104）。 散热器与导热构件（106）的第一端（108）摩擦配合。 导电构件的第二端（110）磁耦合到扬声器磁体（122）的后表面（123）。 远离导电构件的第二端延伸的突片111提供附加的机械支撑，防止第二端滑动抵靠磁体的后表面。 由大功率器件产生的热量通过导热部件从封装散热片传递到扬声器磁体，使得热量从封装和磁体中消散。