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公开(公告)号:US4771930A
公开(公告)日:1988-09-20
申请号:US879939
申请日:1986-06-30
CPC分类号: H01L24/85 , B23K20/005 , H01L24/78 , H01L2224/48472 , H01L2224/78302 , H01L2224/78313 , H01L2224/78318 , H01L2224/786 , H01L2224/851 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01065 , H01L2924/01082
摘要: A novel and improved monitoring and detecting circuit is provided for an automatic wedge wire bonder. The detecting circuit is initiated at the second wire bond while the bonding tool is pressing the bonding wire on the pad or electrode. If the fine wire is missing under the working face of the bonding tool, the sensing circuit initiates a signal which is detected by control means so as to initiate an interrupt signal stopping the operation of the wire bonder. Sensing of the presence or absence of a wire under the bonding wedge at a bond may take place at a first or a second wire bond. At the second wire bond, the novel sensing and detecting circuit is actuated to determine the amount of longation that takes place in the bonding wire between the bonding wedge and the wire clamps so as to correct the movement of the wire clamps when supplying a tail under the working face of the bonding tool and to ensure that a uniform tail length is supplied unaffected by the elongation of the bonding wire.
摘要翻译: 为自动楔形丝焊机提供了一种新颖且改进的监控和检测电路。 检测电路在第二线接合时启动,而接合工具将焊接线焊接在焊盘或电极上。 如果在焊接工具的工作面下缺少细线,则感测电路启动由控制装置检测到的信号,以便启动中断信号来停止引线接合器的操作。 可以在第一或第二引线接合处发生在键合处的接合楔下存在或不存在电线的情况。 在第二引线接合时,启动新的感测和检测电路以确定在接合楔和线夹之间的接合线中发生的长度的量,以便在提供尾部时修正线夹的移动 焊接工具的工作面,并且确保提供均匀的尾部长度,而不受接合线的伸长的影响。
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公开(公告)号:US4763826A
公开(公告)日:1988-08-16
申请号:US862988
申请日:1986-05-14
申请人: Frederick W. Kulicke, Jr. , David A. Leonhardt , Robert B. Newsome , Richard D. Sadler , Gary S. Gillotti
发明人: Frederick W. Kulicke, Jr. , David A. Leonhardt , Robert B. Newsome , Richard D. Sadler , Gary S. Gillotti
CPC分类号: H01L24/78 , B23K20/005 , H01L2224/78313 , H01L2224/786 , H01L2224/851 , H01L2924/00014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082
摘要: An improved automatic wire feed system for supplying a fine wire to a capillary bonding tool or to a wedge bonding tool is provided. The wire feed system includes a novel wire feed slack loop device which is mounted on the wire bonder between the bonding tool and the source of fine wire. The novel wire feed slack loop device comprises a pair of sector plates which are closely spaced apart from each other to provide an air space therebetween for receiving the fine wire. Compressed air is supplied to the air space between the sector plates and is directed radially outward by a diffuser shim plate which forces the wire to form into a uniform circular shape in the air space. Sensor means are provided at the outer perimeter of the sector plates which sense the position of the fine wire and supplies a signal to control means which turns off the rotation of the drive motor. Turning off the gas provides a slack wire loop with sufficient fine wire to make an interconnection on a semiconductor device without creating tension or compression of the wire at the bonding tool.
摘要翻译: 提供了一种用于将细线供应到毛细管接合工具或楔形接合工具的改进的自动送丝系统。 送丝系统包括一种新颖的送丝松弛环装置,其安装在接合工具和细丝源之间的接线机上。 新颖的送丝松弛环装置包括彼此紧密间隔开的一对扇形板,以在其间提供用于接收细线的空气空间。 压缩空气被供给到扇形板之间的空气空间,并且通过扩散器垫片径向向外指向,该扩散板垫板迫使电线在空气空间中形成均匀的圆形形状。 传感器装置设置在扇形板的外周边,感测细线的位置,并将信号提供给控制装置,该控制装置关闭驱动电动机的旋转。 关闭气体提供具有足够细线的松弛线环,以在半导体器件上形成互连,而不会在焊接工具处产生电线的张力或压缩。
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公开(公告)号:US08152046B2
公开(公告)日:2012-04-10
申请号:US13063852
申请日:2010-03-26
申请人: Gary S. Gillotti
发明人: Gary S. Gillotti
IPC分类号: B23K31/02
CPC分类号: H01L24/85 , B23K3/0623 , B23K20/004 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/0401 , H01L2224/04073 , H01L2224/1134 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13664 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/78301 , H01L2224/78801 , H01L2224/85045 , H01L2224/85051 , H01L2224/851 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85986 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , Y10S228/904 , H01L2224/85186 , H01L2224/13099 , H01L2924/00 , H01L2224/48227 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要: A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (3) closing the wire clamp; (4) lowering the bonding tool to a smoothing height with the wire clamp still closed; (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool; and (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.
摘要翻译: 提供一种形成导电凸块的方法。 该方法包括以下步骤:(1)使用接合工具将自由空气球结合到接合位置以形成接合球; (2)将焊接工具提升到所需的高度,同时将电线夹打开,同时支付与接合球连续的电线; (3)关闭线夹; (4)将导线夹仍然封闭时,将焊接工具降至平滑高度; (5)使用焊接工具使焊丝夹仍然闭合,使接合球的上表面平滑化; 和(6)提升接合工具,线夹仍然闭合,以将接合球与接合工具接合的线分离。
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公开(公告)号:US20100230476A1
公开(公告)日:2010-09-16
申请号:US12788827
申请日:2010-05-27
申请人: Gary S. Gillotti , Steven Mak , E. Walter Frasch
发明人: Gary S. Gillotti , Steven Mak , E. Walter Frasch
CPC分类号: B23K20/007 , B23K35/38 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48465 , H01L2224/781 , H01L2224/78268 , H01L2224/78301 , H01L2224/78703 , H01L2224/85045 , H01L2224/85075 , H01L2224/85205 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.
摘要翻译: 提供引线接合机。 引线接合机包括:(1)在引线接合操作期间用于保持半导体器件的接合位置区域;以及(2)气体供给管线,被配置为从接合位置区域的上方在接合部位区域提供气体。
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公开(公告)号:US20130125390A1
公开(公告)日:2013-05-23
申请号:US13812999
申请日:2011-08-03
申请人: Gary S. Gillotti
发明人: Gary S. Gillotti
IPC分类号: H01R43/00
CPC分类号: H01R43/00 , B23K20/005 , B23K20/007 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48095 , H01L2224/48247 , H01L2224/48471 , H01L2224/48478 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/78301 , H01L2224/82045 , H01L2224/829 , H01L2224/85045 , H01L2224/85051 , H01L2224/85186 , H01L2224/85203 , H01L2224/85205 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , Y10T29/49117 , H01L2924/00 , H01L2224/48227 , H01L2224/85399 , H01L2224/05599
摘要: A method of forming a wire loop is provided. The method includes the steps of: (1) forming a conductive bump on a bonding location using a wire bonding tool; (2) bonding a portion of wire to another bonding location using the wire bonding tool; (3) extending a length of wire from the bonded portion of wire toward the bonding location; (4) lowering the bonding tool toward the bonding location while detecting a height of a tip of the wire bonding tool; and (5) interrupting the lowering of the wire bonding tool during step (4) if the wire bonding tool reaches a predetermined height.
摘要翻译: 提供一种形成线环的方法。 该方法包括以下步骤:(1)使用引线接合工具在接合位置形成导电凸块; (2)使用所述引线接合工具将一部分线接合到另一接合位置; (3)将线的长度从所述接合部分延伸到所述接合位置; (4)在检测所述引线接合工具的尖端的高度的同时,朝向所述接合位置降低所述接合工具; 以及(5)如果所述引线接合工具达到预定高度,则在步骤(4)期间中断所述引线接合工具的下降。
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公开(公告)号:US07614538B2
公开(公告)日:2009-11-10
申请号:US11742696
申请日:2007-05-01
CPC分类号: B23K20/004 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48463 , H01L2224/49171 , H01L2224/78268 , H01L2224/78301 , H01L2224/78703 , H01L2224/85045 , H01L2224/85075 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configured to be positioned adjacent a bond site area of the wire bonding machine. The body portion includes a inlet port for receiving a fluid from a gas supply source. The body portion defines a fluid path from the inlet port to the at least one device aperture.
摘要翻译: 提供了一种被配置为与引线接合机一起使用的器件夹持器。 装置夹具包括限定至少一个装置孔的主体部分。 所述至少一个装置孔中的每一个构造成邻近所述引线接合机的接合位置区域定位。 主体部分包括用于从气体供应源接收流体的入口端口。 主体部分限定从入口端口到至少一个设备孔口的流体路径。
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公开(公告)号:US09455544B2
公开(公告)日:2016-09-27
申请号:US13812999
申请日:2011-08-03
申请人: Gary S. Gillotti
发明人: Gary S. Gillotti
CPC分类号: H01R43/00 , B23K20/005 , B23K20/007 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48095 , H01L2224/48247 , H01L2224/48471 , H01L2224/48478 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/78301 , H01L2224/82045 , H01L2224/829 , H01L2224/85045 , H01L2224/85051 , H01L2224/85186 , H01L2224/85203 , H01L2224/85205 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , Y10T29/49117 , H01L2924/00 , H01L2224/48227 , H01L2224/85399 , H01L2224/05599
摘要: A method of forming a wire loop is provided. The method includes the steps of: (1) forming a conductive bump on a bonding location using a wire bonding tool; (2) bonding a portion of wire to another bonding location using the wire bonding tool; (3) extending a length of wire from the bonded portion of wire toward the bonding location; (4) lowering the bonding tool toward the bonding location while detecting a height of a tip of the wire bonding tool; and (5) interrupting the lowering of the wire bonding tool during step (4) if the wire bonding tool reaches a predetermined height.
摘要翻译: 提供一种形成线环的方法。 该方法包括以下步骤:(1)使用引线接合工具在接合位置形成导电凸块; (2)使用所述引线接合工具将一部分线接合到另一接合位置; (3)将线的长度从所述接合部分延伸到所述接合位置; (4)在检测所述引线接合工具的尖端的高度的同时,朝向所述接合位置降低所述接合工具; 以及(5)如果所述引线接合工具达到预定高度,则在步骤(4)期间中断所述引线接合工具的下降。
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公开(公告)号:US20120006882A1
公开(公告)日:2012-01-12
申请号:US13063852
申请日:2010-03-26
申请人: Gary S. Gillotti
发明人: Gary S. Gillotti
CPC分类号: H01L24/85 , B23K3/0623 , B23K20/004 , B23K2101/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/0401 , H01L2224/04073 , H01L2224/1134 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13664 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/78301 , H01L2224/78801 , H01L2224/85045 , H01L2224/85051 , H01L2224/851 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85986 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , Y10S228/904 , H01L2224/85186 , H01L2224/13099 , H01L2924/00 , H01L2224/48227 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要: A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (3) closing the wire clamp; (4) lowering the bonding tool to a smoothing height with the wire clamp still closed; (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool; and (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.
摘要翻译: 提供一种形成导电凸块的方法。 该方法包括以下步骤:(1)使用接合工具将自由空气球结合到接合位置以形成接合球; (2)将焊接工具提升到所需的高度,同时将电线夹打开,同时支付与接合球连续的电线; (3)关闭线夹; (4)将导线夹仍然封闭时,将焊接工具降至平滑高度; (5)使用焊接工具使焊丝夹仍然闭合,使接合球的上表面平滑化; 和(6)提升接合工具,线夹仍然闭合,以将接合球与接合工具接合的线分离。
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公开(公告)号:US20110073635A1
公开(公告)日:2011-03-31
申请号:US12739100
申请日:2009-06-08
CPC分类号: H01L24/85 , B23K20/007 , B23K2101/42 , H01L24/45 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/78268 , H01L2224/78301 , H01L2224/78703 , H01L2224/85043 , H01L2224/85045 , H01L2224/85075 , H01L2224/85205 , H01L2924/00014 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01067 , H01L2924/01079 , H01L2924/01082 , H01L2924/3025 , H01L2224/48 , H01L2924/00 , H01L2924/00015
摘要: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
摘要翻译: 提供引线接合机。 引线接合机包括接合工具和用于在延伸穿过接合工具的线的端部上形成自由空气球的电极,其中自由空气球形成在引线接合机的自由空气球形成区域。 引线接合机还包括用于在引线接合操作期间保持半导体器件的接合位置区域。 引线接合机还包括气体输送机构,其构造成提供覆盖气体以:(1)粘结位置区域,由此覆盖气体通过气体输送机构的至少一个孔被喷射到粘结位置区域,和(2 )自由空气球形成区域。
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10.
公开(公告)号:US08313015B2
公开(公告)日:2012-11-20
申请号:US13272664
申请日:2011-10-13
CPC分类号: H01L24/85 , B23K20/007 , B23K2101/42 , H01L24/45 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/78268 , H01L2224/78301 , H01L2224/78703 , H01L2224/85043 , H01L2224/85045 , H01L2224/85075 , H01L2224/85205 , H01L2924/00014 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01067 , H01L2924/01079 , H01L2924/01082 , H01L2924/3025 , H01L2224/48 , H01L2924/00 , H01L2924/00015
摘要: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
摘要翻译: 提供引线接合机。 引线接合机包括接合工具和用于在延伸穿过接合工具的线的端部上形成自由空气球的电极,其中自由空气球形成在引线接合机的自由空气球形成区域。 引线接合机还包括用于在引线接合操作期间保持半导体器件的接合位置区域。 引线接合机还包括气体输送机构,其构造成提供覆盖气体以:(1)粘结位置区域,由此覆盖气体通过气体输送机构的至少一个孔被喷射到粘结位置区域,和(2 )自由空气球形成区域。
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