Vitreous carbon mask substrate for X-ray lithography
    1.
    发明授权
    Vitreous carbon mask substrate for X-ray lithography 有权
    用于X射线光刻的玻璃碳掩模基板

    公开(公告)号:US07608367B1

    公开(公告)日:2009-10-27

    申请号:US11192797

    申请日:2005-07-28

    IPC分类号: G03F1/00

    CPC分类号: G03F1/22

    摘要: The present invention is directed to the use of vitreous carbon as a substrate material for providing masks for X-ray lithography. The new substrate also enables a small thickness of the mask absorber used to pattern the resist, and this enables improved mask accuracy. An alternative embodiment comprised the use of vitreous carbon as a LIGA substrate wherein the VC wafer blank is etched in a reactive ion plasma after which an X-ray resist is bonded. This surface treatment provides a surface enabling good adhesion of the X-ray photoresist and subsequent nucleation and adhesion of the electrodeposited metal for LIGA mold-making while the VC substrate practically eliminates secondary radiation effects that lead to delamination of the X-ray resist form the substrate, the loss of isolated resist features, and the formation of a resist layer adjacent to the substrate that is insoluble in the developer.

    摘要翻译: 本发明涉及玻璃碳作为基片材料用于提供用于X射线光刻的掩模的用途。 新的基板还能够使用用于图案化抗蚀剂的掩模吸收体的小的厚度,并且这使得能够改善掩模精度。 一个替代实施例包括使用玻璃碳作为LIGA衬底,其中VC晶片坯料在反应离子等离子体中被蚀刻,之后结合X射线抗蚀剂。 该表面处理提供了表面,使得能够良好地粘附X射线光致抗蚀剂并且随后的成核和用于LIGA模制的电沉积金属的粘附,而VC衬底实际上消除了导致X射线抗蚀剂分层的二次辐射效应 衬底,孤立的抗蚀剂特征的损失以及与基底相邻的抗蚀剂层的形成,其不溶于显影剂。

    Apparatus and method for electroforming high aspect ratio micro-parts
    2.
    发明授权
    Apparatus and method for electroforming high aspect ratio micro-parts 有权
    用于电铸高纵横比微零件的装置和方法

    公开(公告)号:US07608174B1

    公开(公告)日:2009-10-27

    申请号:US11599766

    申请日:2006-11-14

    IPC分类号: B23H7/26

    摘要: A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.

    摘要翻译: 公开了一种固定装置,以更容易地将工件以适当的取向和间隔与电化学电镀浴中的密封电互连相连接。 工件可以是任何平面的金属或非金属基底,例如通常用于LIGA或微系统制造的硅晶片。 所描述的夹具允许工件深深地浸入电解池中,面向上,并且允许容易地从一个单元转移到另一个单元。 边缘,背面和电气连接被密封并保护电解质。

    Real-time polishing pad stiffness-control using magnetically controllable fluid
    5.
    发明授权
    Real-time polishing pad stiffness-control using magnetically controllable fluid 有权
    使用磁力控制流体实时抛光垫刚度控制

    公开(公告)号:US06776688B2

    公开(公告)日:2004-08-17

    申请号:US10274082

    申请日:2002-10-21

    IPC分类号: B24B31112

    摘要: A method of CMP polishing of a semiconductor wafer is described that includes using a polishing pad on a platen/table with the polishing pad including a sub-pad containing pockets of magnetorheological fluid. The stiffness of the sub-pad is controlled by selectively applying a magnetic field at selective pockets containing magnetorheological fluid to change the viscosity of the magnetorheological fluid. The changing stiffness increases the polishing rate of the pad in the areas of the magnetic field.

    摘要翻译: 描述了一种半导体晶片的CMP抛光方法,其包括在抛光垫上使用抛光垫,抛光垫包括含有磁流变流体袋的子垫。 通过在包含磁流变流体的选择性袋中选择性地施加磁场来改变磁流变流体的粘度来控制子垫的刚度。 改变的刚度增加了焊盘在磁场区域中的抛光速率。