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公开(公告)号：US20060017152A1
公开(公告)日：2006-01-26
申请号：US11177508
申请日：2005-07-08
IPC分类号： H01L23/12
CPC分类号： H05K1/186 , H01L21/4857 , H01L23/055 , H01L23/13 , H01L23/49827 , H01L23/49833 , H01L23/5383 , H01L23/5389 , H01L24/48 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/183 , H05K2201/09509 , H05K2201/09536 , H05K2203/061 , H01L2924/00012 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Organic laminate stack ups are disclosed for a variety of applications, including high frequency RF applications. One or more inner core layers may be disposed between outer layers along with bondply or prepreg layers as needed. Discrete devices, including surface mount components and flip chips, may be embedded within the organic laminate stack up structures. The embedding of the discrete devices, which may be active or passive devices, may be in the form of a layer of bondply or prepreg encapsulating the discrete devices. In addition or in the alternative, cavities may be formed in at least the outer layers for housing discrete devices, which include surface mount components, flip chips, and wire bonded integrated circuits. A variety of caps may be utilized to seal the cavities. Further, shielding may be provided for the organic laminate stack up structure, including through a wall of vias or a plated trench cut along at least one side of the stack up structure. Each stack up structure may be packaged in a variety of ways, including as a surface mount component, ball grid array, or land grid array.
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2.发明申请公开(公告)号：US20070267138A1
公开(公告)日：2007-11-22
申请号：US11833626
申请日：2007-08-03
IPC分类号： B32B37/00
CPC分类号： B32B37/00 , H01F17/0033 , H01F41/041 , H01L21/4857 , H01L25/0652 , H01L27/08 , H01L2224/16 , H01L2224/16235 , H01L2224/48235 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/00 , H05K1/162 , H05K1/167 , H05K3/4617 , H05K3/4632 , H05K3/4688 , H05K2201/0129 , H05K2201/0141 , H05K2201/0209 , Y10T29/49126 , Y10T29/49149 , Y10T29/49158 , H01L2224/0401
摘要： The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided LCP, where both the high and low temperature LCP are provided with a z-axis connection. The single sided conductive layer is a bus layer to form z-axis conductive stud within the high and low temperature LCP. High and low temperature LCP layers are etched or built up to form circuit patterns and subsequently bonded together to form final multilayer circuit pattern where the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond.
摘要翻译： 本发明包括使用高温低温单面LCP制造液晶聚合物（LCP）互连结构的方法，其中高低温LCP都具有z轴连接。 单面导电层是在高低温LCP下形成z轴导电螺柱的总线层。 高温和低温LCP层被蚀刻或构建以形成电路图案并且随后结合在一起以形成最终的多层电路图案，其中低温LCP熔融以形成与高温LCP电路层的电介质至电介质结合，以及电介质至导电键 。
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3.发明申请Liquid crystalline polymer and multilayer polymer-based passive signal processing components for rf/wireless multi-band applications 有权用于射频/无线多频段应用的液晶聚合物和多层聚合物基无源信号处理组件公开(公告)号：US20070085108A1
公开(公告)日：2007-04-19
申请号：US10590851
申请日：2005-02-23
IPC分类号： H01L29/74
CPC分类号： H05K1/16 , H01L23/552 , H01L23/66 , H01L2924/0002 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H01P1/203 , H01P1/20381 , H01P1/2135 , H01P5/10 , H03H7/0115 , H03H7/075 , H03H7/09 , H03H7/1708 , H03H7/1758 , H03H7/1766 , H03H7/1775 , H03H7/38 , H03H7/42 , H03H7/463 , H03H2001/0085 , H05K1/024 , H05K1/162 , H05K1/165 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4632 , H05K3/4644 , H05K3/4673 , H05K3/4688 , H05K2201/0141 , H05K2201/09536 , H01L2924/00
摘要： The present invention provides all organic fully-packaged miniature bandpass filters, baluns, diplexers, multiplexers, couplers and a combination of the above manufactured using liquid crystalline polymer (LCP) and other multilayer polymer based substrates. These devices are manufactured using one or more LCP layers having integrated passive components formed thereon to provide the density and performance necessary for multi-band wireless devices. In the designs involving multiple LCP layers, the LCP layers arc separated by prepeg layers. In accordance with an aspect of the present invention, coplanar waveguide, hybrid stripline/coplanar waveguide and/or microstrip topologies are utilized to form the integrated passive components, and the devices can be mass produced on large area panels at least 18 inches by 12 inches with line widths smaller than 10 um.
摘要翻译： 本发明提供了使用液晶聚合物（LCP）和其它多层聚合物基底板制造的所有有机全封装微型带通滤光器，平衡 - 不平衡转换器，双工器，多路复用器，耦合器和上述组合。 这些设备使用一个或多个LCP层制造，其中形成有集成的无源元件，以提供多频带无线设备所需的密度和性能。 在涉及多个LCP层的设计中，LCP层由预制层分开。 根据本发明的一个方面，共面波导，混合带状线/共面波导和/或微带线拓扑被用于形成集成的无源部件，并且可以在大面积的面板上批量生产至少18英寸×12英寸 线宽小于10um。
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公开(公告)号：US20050231304A1
公开(公告)日：2005-10-20
申请号：US11140630
申请日：2005-05-27
IPC分类号： H01F17/00 , H01F41/04 , H01L21/48 , H01L25/065 , H01L27/08 , H01P1/203 , H03H7/38 , H03H7/01
CPC分类号： H01P1/20381 , H01F17/0033 , H01F41/041 , H01L21/4857 , H01L25/0652 , H01L27/08 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H03H7/38 , H01L2924/00
摘要： The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multilayer board, ceramic carrier or silicon platform in the form of an integrated passive device. The passive device includes side shielding on two sides in the SMD form and four sides in the BGA/CSP form. The side shielding can be external or in-built.
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5.发明授权Integrated passive devices fabricated utilizing multi-layer, organic laminates 有权使用多层有机层压板制造的集成无源器件公开(公告)号：US06900708B2
公开(公告)日：2005-05-31
申请号：US10402313
申请日：2003-03-28
IPC分类号： H01F17/00 , H01F41/04 , H01L21/48 , H01L25/065 , H01L27/08 , H01P1/203 , H03H7/38 , H03F7/00
CPC分类号： H01P1/20381 , H01F17/0033 , H01F41/041 , H01L21/4857 , H01L25/0652 , H01L27/08 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H03H7/38 , H01L2924/00
摘要： The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multilayer board, ceramic carrier or silicon platform in the form of an integrated passive device. The passive device includes side shielding on two sides in the SMD form and four sides in the BGA/CSP form. The side shielding can be external or in-built.
摘要翻译： 本发明包括可以集成在由有机材料制成的多层板中的有机器件。 无源器件可以在表面贴装器件（SMD）或球栅阵列（BGA）形式的电路板上整体制造。 或者，无源器件可以以独立的SMD或BGA /芯片级封装（CSP）形式构造，使得其可以以集成的无源器件的形式安装在多层板，陶瓷载体或硅平台上。 无源器件包括SMD形式两侧的侧屏蔽和BGA / CSP形式的四面。 侧面屏蔽可以是外部的或内置的。
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6.发明授权公开(公告)号：US07805834B2
公开(公告)日：2010-10-05
申请号：US11833626
申请日：2007-08-03
CPC分类号： B32B37/00 , H01F17/0033 , H01F41/041 , H01L21/4857 , H01L25/0652 , H01L27/08 , H01L2224/16 , H01L2224/16235 , H01L2224/48235 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/00 , H05K1/162 , H05K1/167 , H05K3/4617 , H05K3/4632 , H05K3/4688 , H05K2201/0129 , H05K2201/0141 , H05K2201/0209 , Y10T29/49126 , Y10T29/49149 , Y10T29/49158 , H01L2224/0401
摘要： The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided LCP, where both the high and low temperature LCP are provided with a z-axis connection. The single sided conductive layer is a bus layer to form z-axis conductive stud within the high and low temperature LCP. High and low temperature LCP layers are etched or built up to form circuit patterns and subsequently bonded together to form final multilayer circuit pattern where the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond.
摘要翻译： 本发明包括使用高温低温单面LCP制造液晶聚合物（LCP）互连结构的方法，其中高低温LCP都具有z轴连接。 单面导电层是在高低温LCP下形成z轴导电螺柱的总线层。 高温和低温LCP层被蚀刻或构建以形成电路图案并且随后结合在一起以形成最终的多层电路图案，其中低温LCP熔融以形成与高温LCP电路层的电介质至电介质结合，以及电介质至导电键 。
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7.发明授权Integrated passive devices fabricated utilizing multi-layer, organic laminates 有权使用多层有机层压板制造的集成无源器件公开(公告)号：US07068124B2
公开(公告)日：2006-06-27
申请号：US11140630
申请日：2005-05-27
IPC分类号： H03H7/00
CPC分类号： H01P1/20381 , H01F17/0033 , H01F41/041 , H01L21/4857 , H01L25/0652 , H01L27/08 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H03H7/38 , H01L2924/00
摘要： The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multilayer board, ceramic carrier or silicon platform in the form of an integrated passive device. The passive device includes side shielding on two sides in the SMD form and four sides in the BGA/CSP form. The side shielding can be external or in-built.
摘要翻译： 本发明包括可以集成在由有机材料制成的多层板中的有机器件。 无源器件可以在表面贴装器件（SMD）或球栅阵列（BGA）形式的电路板上整体制造。 或者，无源器件可以以独立的SMD或BGA /芯片级封装（CSP）形式构造，使得其可以以集成的无源器件的形式安装在多层板，陶瓷载体或硅平台上。 无源器件包括SMD形式两侧的侧屏蔽和BGA / CSP形式的四面。 侧面屏蔽可以是外部的或内置的。
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8.发明授权公开(公告)号：US07260890B2
公开(公告)日：2007-08-28
申请号：US10402315
申请日：2003-03-28
IPC分类号： H05K3/36
CPC分类号： B32B37/00 , H01F17/0033 , H01F41/041 , H01L21/4857 , H01L25/0652 , H01L27/08 , H01L2224/16 , H01L2224/16235 , H01L2224/48235 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/00 , H05K1/162 , H05K1/167 , H05K3/4617 , H05K3/4632 , H05K3/4688 , H05K2201/0129 , H05K2201/0141 , H05K2201/0209 , Y10T29/49126 , Y10T29/49149 , Y10T29/49158 , H01L2224/0401
摘要： The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP where both the high and low temperature LCP are drilled to form a z-axis connection. The single sided conductive layer is a bus layer to form z axis conductive stud within the high and low temperature LCP, followed by a metallic capping layer of the stud that serves as the bonding metal between the conductive interconnects to form the z-axis connection. High and low temperature LCP layers are etched or built up to form circuit patterns and subsequently bonded together to form final multilayer circuit pattern where the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond, whereas metal to metal bonding occurs with high temperature metal capping layer bonding to conductive metal layer.
摘要翻译： 本发明包括使用高温低温单面液晶聚合物LCP制备液晶聚合物（LCP）互连结构的方法，其中钻出高低温LCP以形成z轴连接。 单面导电层是在高低温LCP内形成z轴导电柱的总线层，随后是螺柱的金属覆盖层，其用作导电互连之间的结合金属以形成z轴连接。 高温和低温LCP层被蚀刻或构建以形成电路图案并且随后结合在一起以形成最终的多层电路图案，其中低温LCP熔融以形成与高温LCP电路层的电介质至电介质结合，以及电介质至导电键 而金属与金属之间的接合发生在与导电金属层结合的高温金属覆盖层上。
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公开(公告)号：US06987307B2
公开(公告)日：2006-01-17
申请号：US10405024
申请日：2003-03-28
IPC分类号： H01L23/12 , H01L23/053 , H01L23/552 , H01L29/00
CPC分类号： H01L21/4857 , H01F17/0006 , H01F17/0033 , H01F41/041 , H01L25/0652 , H01L27/08 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： The present invention provides for low cost discrete inductor devices in an all organic platform. The inductor devices can utilize virtually any organic material that provides the desired properties, such as liquid crystalline polymer (LCP) or polyphenyl ether (PPE), in a multilayer structure, wherein the organic materials have low moisture uptake and good temperature stability. Each layer may be metalized and selectively interconnected by vias formed in respective layers so as to form winding or coiled inductors. The inductor devices may advantageously include external shielding formed by metalizing the side walls and top surface of the inductor devices on in-built shielding achieved by the utilization of the hybrid co-planar waveguide topologies. The inductor devices can be configured for either ball grid array (BGA)/chip scale package (CSP) or surface mount device (SMD) mounting to circuit boards.
摘要翻译： 本发明提供了在所有有机平台中的低成本分立电感器件。 电感器件可以实际上利用多层结构中提供所需性能的任何有机材料，例如液晶聚合物（LCP）或聚苯醚（PPE）），其中有机材料具有低吸湿性和良好的温度稳定性。 每个层可以被金属化并且通过形成在各个层中的通孔选择性地互连，从而形成绕组或线圈电感器。 电感器件可以有利地包括通过利用混合共面波导拓扑实现的内置屏蔽，使电感器件的侧壁和顶表面金属化形成的外部屏蔽。 电感器件可以配置为安装到电路板的球栅阵列（BGA）/芯片级封装（CSP）或表面贴装器件（SMD）。
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10.发明授权公开(公告)号：US08345433B2
公开(公告)日：2013-01-01
申请号：US11177508
申请日：2005-07-08
IPC分类号： H05K1/18
CPC分类号： H05K1/186 , H01L21/4857 , H01L23/055 , H01L23/13 , H01L23/49827 , H01L23/49833 , H01L23/5383 , H01L23/5389 , H01L24/48 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/183 , H05K2201/09509 , H05K2201/09536 , H05K2203/061 , H01L2924/00012 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Organic laminate stack ups are disclosed for a variety of applications, including high frequency RF applications. One or more inner core layers may be disposed between outer layers along with bondply or prepreg layers as needed. Discrete devices, including surface mount components and flip chips, may be embedded within the organic laminate stack up structures. The embedding of the discrete devices, which may be active or passive devices, may be in the form of a layer of bondply or prepreg encapsulating the discrete devices. In addition or in the alternative, cavities may be formed in at least the outer layers for housing discrete devices, which include surface mount components, flip chips, and wire bonded integrated circuits. A variety of caps may be utilized to seal the cavities. Further, shielding may be provided for the organic laminate stack up structure, including through a wall of vias or a plated trench cut along at least one side of the stack up structure. Each stack up structure may be packaged in a variety of ways, including as a surface mount component, ball grid array, or land grid array.
摘要翻译： 公开了有机层压叠层用于各种应用，包括高频RF应用。 根据需要，一个或多个内芯层可以与键合层或预浸料层一起设置在外层之间。 分立器件，包括表面贴装元件和倒装芯片，可嵌入有机叠层堆叠结构内。 可以是有源或无源器件的分立器件的嵌入可以是封装分立器件的键合层或预浸料的形式。 另外或在替代方案中，空腔可以形成在至少外层中，用于容纳包括表面安装部件，倒装芯片和引线键合集成电路的分立器件。 可以使用各种盖来密封空腔。 此外，可以提供用于有机层叠叠层结构的屏蔽，包括穿过通孔壁或沿堆叠结构的至少一侧切割的电镀沟槽。 每个堆叠结构可以以各种方式包装，包括作为表面安装部件，球栅阵列或平台网格阵列。
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