摘要:
The present invention relates to methods and compositions for measuring latent protein C in test samples, particularly patient samples. The methods and compositions described are sensitive for latent protein C, relative to activated protein C.
摘要:
The present invention relates to methods and compositions for diagnosing SIRS, sepsis, severe sepsis, septic shock, or MODS in a subject, or assigning a prognostic risk for one or more clinical outcomes for a subject suffering from SIRS, sepsis, severe sepsis, septic shock, or MODS, the method comprising performing an immunoassay for CCL23 splice variant.
摘要:
The present invention relates to methods and compositions for diagnosing SIRS, sepsis, severe sepsis, septic shock, or MODS in a subject, or assigning a prognostic risk for one or more clinical outcomes for a subject suffering from SIRS, sepsis, severe sepsis, septic shock, or MODS, the method comprising performing an immunoassay for CCL23 splice variant.
摘要:
The present invention relates to methods and compositions for diagnosing SIRS, sepsis, severe sepsis, septic shock, or MODS in a subject, or assigning a prognostic risk for one or more clinical outcomes for a subject suffering from SIRS, sepsis, severe sepsis, septic shock, or MODS, the method comprising performing an immunoassay for CCL23 splice variant.
摘要:
A semiconductor device includes a substrate including a cell region and a connection region. A stack is disposed on the substrate. A vertical channel structure penetrates the stack in the cell region. The stack includes electrode patterns and insulating patterns which are alternatingly and repeatedly stacked on the substrate. Each of the electrode patterns may extend in a first direction and include a pad portion. The pad portion is positioned in the connection region. The pad portion includes a first sidewall and a second sidewall that extend in the first direction on opposite sides of the pad portion. The first sidewall has a recessed portion that is recessed in a second direction crossing the first direction toward the second sidewall.
摘要:
The present invention relates to methods for the diagnosis and evaluation of BNP-related diseases. In particular, patient test samples are analyzed for the presence and amount of a plurality of natriuretic peptides, and a combined natriuretic peptide result is used as a diagnostic marker.
摘要:
A system for simulating interdependencies between multiple critical physical infrastructure models includes a first infrastructure data model that models a first physical infrastructure; a second infrastructure data model that models a second physical infrastructure, wherein the second physical infrastructure is a different physical infrastructure from the first physical infrastructure; a simulation engine adapted to automatically produce a change in the second infrastructure data model in response to a change in the first infrastructure data model; a user interface permitting a user to interact with the simulation engine; wherein the user interface and the simulation engine are configured such that the user can disable an element of the first physical infrastructure, and subsequently re-enable the element of the first physical infrastructure; wherein the first infrastructure data model comprises a transport network; and wherein the second infrastructure data model comprises a channel network.
摘要:
A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.
摘要:
A light guide plate includes a first surface having a light incident surface and a light reflect surface, a second surface facing the first surface, through which the reflected light exits, a first edge surface connected between edges of the light reflect surface and the second surface, and a second edge surface connected between edges of the light incident surface and the second surface, being opposite to the first edge surface. A light source is disposed on the light incident surface. A light guide plate may also include a stepped edge portion formed at a marginal area of the light guide plate on which a light source is combined. The stepped edge portion includes a light incident surface, a light reflect surface, an upper surface through which the reflected light exits the light guide plate, and a first edge surface connected between edges of the light reflect surface and the upper surface, being opposite to the stepped edge portion. A backlight assembly includes the light guide plate, a lamp unit including lamps and a lamp reflector that are disposed on the light incident surface, and a mold frame for receiving the stepped edge portion and the lamp unit.
摘要:
There are provided a backlight assembly (200) and an LCD apparatus (110) having the same. A lamp unit (210, 220) is received in a first receiving container (300) having a first bottom surface (350) and a first sidewall (310) so that the lamp unit (210) faces the first sidewall. The lamp unit (210, 220) and the first receiving container (300) are received in a second receiving container (500) having a second bottom surface (550) and a second sidewall (510). A heat transfer member (261, 263) comprised of metal material having superior heat conductivity makes contact with the second receiving container (500) through the lamp unit (210, 220). The heat emitted from the lamp unit (210, 263) and discharged to exterior. Accordingly, the backlight assembly and the LCD apparatus may improve display characteristics thereof.