公开(公告)号：US07888605B2

公开(公告)日：2011-02-15

申请号：US12034572

申请日：2008-02-20

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H05K1/16

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A multilayer printed circuit board has an IC chip included in a core substrate in advance, and an intermediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the intermediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole, and to improve reliability.

摘要翻译： 多层印刷电路板预先具有包括在芯基板中的IC芯片，以及设置在IC芯片的焊盘上的中间层。 由此，可以在不使用引线部件和密封树脂的情况下将IC芯片电连接到多层印刷电路板。 此外，通过在芯片焊盘上设置由铜制成的中间层，可以防止焊盘上的树脂残留物并改善焊盘和通孔之间的连接特性，并提高可靠性。

公开(公告)号：US20080151517A1

公开(公告)日：2008-06-26

申请号：US12034586

申请日：2008-02-20

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H05K1/18

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a mediate layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

摘要翻译： 多层印刷电路板预先包括在芯基板30中的IC芯片20和设置在IC芯片20的焊盘24上的中介层38。 由此，可以在不使用引线部件和密封树脂的情况下将IC芯片电连接到多层印刷电路板。 此外，通过在芯片焊盘24上设置由铜制成的中介层38，可以防止焊盘24上的树脂残留，并且改善焊盘24和通孔60之间的连接特性，并且可靠性。

公开(公告)号：US06909054B2

公开(公告)日：2005-06-21

申请号：US10181682

申请日：2001-01-12

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/13 ,  H01L23/498 ,  H01L23/538 ,  H01L23/544 ,  H05K1/18 ,  H05K1/16

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

摘要翻译： 多层印刷电路板预先包括在芯基板30中的IC芯片20和设置在IC芯片20的焊盘24上的过渡层38。 由此，可以不使用引线部件和密封树脂将IC芯片电连接到多层印刷电路板。 此外，通过在芯片焊盘24上设置由铜制成的过渡层38，可以防止焊盘24上的树脂残留，并且改善焊盘24和通孔60之间的连接特性以及可靠性。

公开(公告)号：US08453323B2

公开(公告)日：2013-06-04

申请号：US13234721

申请日：2011-09-16

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H01K3/10 ,  H05K1/16 ,  H05K7/10 ,  H01L21/00

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method for manufacturing a printed circuit board, including providing a core substrate having an electronic component accommodated in the core substrate; forming a positioning mark on the core substrate; forming an interlayer insulating layer over the core substrate, the positioning mark and the electronic component; forming a via hole opening connecting to the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate; and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the electronic component.

摘要翻译： 一种印刷电路板的制造方法，其特征在于，提供具有容纳在所述芯基板中的电子部件的芯基板， 在芯基板上形成定位标记; 在芯基板，定位标记和电子部件之上形成层间绝缘层; 根据芯基板上的定位标记，通过层间绝缘层形成连接到电子部件的通孔开口; 以及在所述层间绝缘层的通孔开口中形成通孔结构，使得所述通孔结构电连接到所述电子部件。

公开(公告)号：US08438727B2

公开(公告)日：2013-05-14

申请号：US12571973

申请日：2009-10-01

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H01K3/10 ,  H05K3/30

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, forming a positioning mark on said substrate based on a positioning mark of said electronic component, and conducting working or formation based on the positioning mark of said substrate.

摘要翻译： 一种制造多层印刷电路板的方法，所述多层印刷电路板具有层间绝缘层和导体层，所述多层印刷电路板重复地形成在基板上，通过形成在所述层间绝缘层中的孔，并且通过所述通孔建立与所述基板中包含电子部件的电连接， 基于所述电子部件的定位标记在所述基板上的定位标记，并且基于所述基板的定位标记进行加工或形成。

公开(公告)号：US07842887B2

公开(公告)日：2010-11-30

申请号：US11757750

申请日：2007-06-04

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H05K1/16

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A multilayer printed circuit board has an IC chip (20) included in a core substrate (30) in advance and a transition layer (38) provided on a pad (24) of the IC chip (20). Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer (38) made of copper on the die pad (24), it is possible to prevent resin residues on the pad (24) and to improve connection characteristics between the pad (24) and a via hole (60) and reliability.

摘要翻译： 多层印刷电路板预先包括在芯基板（30）中的IC芯片（20）和设置在IC芯片（20）的焊盘（24）上的过渡层（38）。 由此，可以在不使用引线部件和密封树脂的情况下将IC芯片电连接到多层印刷电路板。 此外，通过在芯片焊盘（24）上设置由铜制成的过渡层（38），可以防止焊盘（24）上的树脂残留物，并且改善焊盘（24）和通孔（24）之间的连接特性 60）和可靠性。

公开(公告)号：US08186045B2

公开(公告)日：2012-05-29

申请号：US12103414

申请日：2008-04-15

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H05K3/30 ,  H05K3/36 ,  H05K3/20 ,  H05K1/16 ,  H05K1/11 ,  H05K7/10 ,  H05K7/12 ,  H05K1/14

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of manufacturing a multilayer printed circuit board, including providing a substrate, embedding an electronic component having a die pad on a surface of the component into the substrate such that the component has the surface and pad exposed from a surface of the substrate, forming a metallic layer including metallic film layers such that the surface of the substrate and the pad and surface of the component are covered with the metallic layer, providing a resist on the metallic layer such that a portion of the metallic layer on the pad is exposed from the resist, forming a thickening metallic layer on the portion of the metallic layer exposed, removing the resist from the substrate and surface of the component, and etching to remove the metallic layer such that a mediate layer including the portion of the metallic layer is formed between the pad and the thickening layer.

摘要翻译： 一种制造多层印刷电路板的方法，包括提供基板，将具有管芯焊盘的电子部件嵌入到所述基板的表面上，使得所述部件具有从所述基板的表面暴露的所述表面和焊盘，形成 包括金属膜层的金属层，使得基板的表面和部件的表面和部件的表面被金属层覆盖，在金属层上提供抗蚀剂，使得焊盘上的金属层的一部分从 所述抗蚀剂在所述金属层的暴露部分上形成增厚金属层，从所述基板和所述部件的表面除去所述抗蚀剂，并蚀刻去除所述金属层，从而形成包含所述金属层的所述部分的介质层 在垫和增厚层之间。

公开(公告)号：US08046914B2

公开(公告)日：2011-11-01

申请号：US12572000

申请日：2009-10-01

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H01K3/10

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, removing a film on a surface of a die pad of said electronic component, forming a mediate layer to be connected to a via hole of a lowermost interlayer insulating layer, on said die pad, forming the interlayer insulating layers on said substrate, and forming the via holes connected to the conductor circuits and the mediate layers, in said interlayer resin insulating layers.

摘要翻译： 一种制造多层印刷电路板的方法，所述多层印刷电路板具有层间绝缘层和重复形成在基板上的导体层，所述多层印刷电路板通过形成在所述层间绝缘层中的孔，并且通过所述通孔建立电连接，所述电连接包括在所述基板中包含电子部件， 在所述电子部件的芯片焊盘的表面上形成薄膜，在所述芯片焊盘上形成与最下层绝缘层的通路孔连接的中间层，在所述基板上形成层间绝缘层， 在所述层间树脂绝缘层中连接到导体电路和中间层的孔。

公开(公告)号：US08079142B2

公开(公告)日：2011-12-20

申请号：US12273939

申请日：2008-11-19

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H01K3/10 ,  H05K1/16 ,  H05K7/10

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad.

摘要翻译： 一种制造印刷电路板的方法，包括提供芯基板和包含在芯基板中的电子部件，具有芯片焊盘的电子部件，在芯基板上形成定位标记，在芯基板上形成层间绝缘层 和所述电子部件，根据所述芯基板上的定位标记，通过所述层间绝缘层形成连接到所述电子部件的所述管芯焊盘的通孔开口，以及在所述层间绝缘体的通孔开口部形成通孔结构 使得通孔结构电连接到管芯焊盘。

公开(公告)号：US07884286B2

公开(公告)日：2011-02-08

申请号：US12034586

申请日：2008-02-20

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H05K1/16

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A multilayer printed circuit board has an IC chip included in a core substrate in advance and a mediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole and reliability.