Optical measurement arrangement, in particular for layer thickness measurement

    公开(公告)号:US06618154B2

    公开(公告)日:2003-09-09

    申请号:US09846331

    申请日:2001-05-02

    IPC分类号: G01B902

    CPC分类号: G01B11/0625

    摘要: The invention refers to an optical measurement arrangement, in particular for layer thickness measurement and for ascertaining optical material properties such as refractive index, extinction factor, etc. of a specimen (P), having an illumination device (1) for emitting a measurement light beam (6), a beam splitter (8) for dividing the measurement light beam (6) into a specimen light beam (10) and a reference light beam (9), a measurement objective for directing the specimen light beam (10) onto a measurement location (M) on the surface of the specimen (P) and for acquiring the light reflected from the measurement location (M), and an analysis device (11) into which the reference light beam (9) and the specimen light beam (10) reflected from the specimen (P) are coupled in order to obtain information about the specimen (P), in particular about layer thicknesses present thereon. Light-guiding devices (23, 25) having a plurality of light-guiding fibers are provided for coupling the specimen light beam (10) and the reference light beam (9) into the analysis device (11). The result is to create a compact optical measurement arrangement that can be flexibly set up and is insensitive to disturbance, which is suitable in particular for automatic monitoring of continuous production processes, in particular in semiconductor chip manufacture.

    Method for determining layer thickness ranges
    2.
    发明授权
    Method for determining layer thickness ranges 有权
    确定层厚范围的方法

    公开(公告)号:US06985237B2

    公开(公告)日:2006-01-10

    申请号:US10462280

    申请日:2003-06-16

    IPC分类号: G01B11/02

    CPC分类号: G01B11/0625

    摘要: The invention concerns a method for the determination of layer thickness ranges of layers of a specimen, in which the reflection spectrum of the specimen is measured in a specified wavelength range and then smoothed, the number of extremes in the smoothed reflection spectrum is determined, and the determination of the layer thickness ranges is accomplished by comparison with the number of extremes in the modeled reflection spectra, such that for each layer the thickness in that layer is varied in steps having a predetermined increment, and a reflection spectrum is modeled. In a method of this kind, the wavelength range and the increments are specified in self-consistent fashion using a sensitivity criterion.

    摘要翻译: 本发明涉及一种用于确定样品层的层厚度范围的方法,其中在特定波长范围内测量样品的反射光谱然后平滑,确定平滑反射光谱中的极限数量,以及 通过与建模的反射光谱中的极限数量进行比较来实现层厚度范围的确定,使得对于每层,该层中的厚度在具有预定增量的步骤中变化,并且对反射光谱进行建模。 在这种方法中,使用灵敏度标准以自相矛盾的方式指定波长范围和增量。

    Method and apparatus for the determination of layer thicknesses
    3.
    发明授权
    Method and apparatus for the determination of layer thicknesses 失效
    用于确定层厚度的方法和装置

    公开(公告)号:US06826511B2

    公开(公告)日:2004-11-30

    申请号:US10360965

    申请日:2003-02-07

    IPC分类号: G06F1500

    CPC分类号: G01B11/0625

    摘要: A method and apparatus for determination of layer thicknesses and optical parameters of a number of layers of a specimen, in which the reflectance spectrum of the specimen is measured and then smoothed, and a modeled reflectance spectrum is adapted to the measured one by means of an optimization criterion so as thereby to determine the layer thickness. The optimization criterion is determined by the totality of the absolute values of the wavelength differences of all pairs of wavelengths, a pair of wavelengths being constituted by those wavelengths that respectively correspond to a selected extreme in the measured reflectance spectrum characterized by an index counting the extremes in ascending or descending order, and a selected extreme in the modeled reflectance spectrum having the same index.

    摘要翻译: 一种用于确定试样的多个层的层厚度和光学参数的方法和装置,其中测量样品的反射光谱然后平滑,并且建模的反射光谱通过 优化标准,从而确定层厚度。 优化标准由所有波长对的波长差的绝对值的总和确定,一对波长由分别对应于所测量的反射光谱中选定的极端的那些波长构成,其特征在于计数极值 在升序或降序,以及具有相同指数的建模反射光谱中选定的极值。

    System operating unit
    4.
    发明授权
    System operating unit 有权
    系统操作单元

    公开(公告)号:US07152488B2

    公开(公告)日:2006-12-26

    申请号:US10853757

    申请日:2004-05-26

    IPC分类号: G01N3/20

    摘要: The invention concerns a system operating unit (30) having a column (3) that is attachable by way of at least two supports (9, 10) to different points of a system housing (14). In the preferred embodiment, this column is attached laterally to the housing, the supports serving for attachment to the housing of the system. In addition, a retaining bracket (4) is connected to the column (3) in such a way that a horizontal deflection of the retaining bracket (4) about a vertical axis is possible.

    摘要翻译: 本发明涉及一种系统操作单元(30),其具有可通过至少两个支撑件(9,10)附接到系统壳体(14)的不同点的柱(3)。 在优选实施例中,该柱侧向地附接到壳体,支撑件用于附接到系统的壳体。 此外,保持支架(4)以这样的方式连接到柱(3),使得保持支架(4)围绕垂直轴的水平偏转是可能的。

    Holding device for wafers
    5.
    发明授权
    Holding device for wafers 失效
    晶圆保持装置

    公开(公告)号:US06918735B2

    公开(公告)日:2005-07-19

    申请号:US10362791

    申请日:2002-04-12

    CPC分类号: H01L21/68707 Y10S294/902

    摘要: The invention relates to a holding device for wafers in an arrangement for wafer inspection, comprising two grippers (11, 12), each of which, in the closed state of the holding device (8), encloses a subsection of the wafer circumference and which are connected to a drive device (27) and, when the latter is driven, the grippers (11, 12) move away from each other for the purpose of opening the holding device (9) and move toward each other for the purpose of closing the holding device (8), and a holding arm (13), on which the two grippers (11, 12) are pivotably mounted.In this case the holding arm (13) is mounted such that it can rotate about an axis (A) which lies substantially in the plane covered by the wafer (W), so that after a rotation through 180° about the axis (A), a wafer (W) held between the grippers (11, 12) has been turned.

    摘要翻译: 本发明涉及一种用于晶片检查的晶片的保持装置,包括两个夹持器(11,12),每个夹持器在保持装置(8)的关闭状态下包围晶片圆周的子部分,并且其中 连接到驱动装置(27),并且当驱动装置(27)被驱动时,夹持器(11,12)彼此远离,以便打开保持装置(9)并且朝向彼此移动以关闭 所述保持装置(8)和保持臂(13),所述两个夹持器(11,12)可枢转地安装在所述保持臂上。 在这种情况下,保持臂(13)被安装成使得其可以围绕基本上位于由晶片(W)覆盖的平面中的轴线(A)旋转,使得在围绕轴线(A)旋转180°之后, 夹持在夹持器(11,12)之间的晶片(W)已经转动。

    Optical measurement arrangement and method for inclination measurement
    6.
    发明授权
    Optical measurement arrangement and method for inclination measurement 有权
    光学测量布置和倾斜测量方法

    公开(公告)号:US06504608B2

    公开(公告)日:2003-01-07

    申请号:US09748339

    申请日:2000-12-26

    IPC分类号: G01J400

    摘要: An optical measurement arrangement includes an ellipsometer (45) and a device for ascertaining and correcting directional deviations between the line normal to the specimen surface and the angle bisector (25) between the incident and return beams (23, 24) of the ellipsometer (45). A measurement arrangement includes a mirror objective and a device for ascertaining directional deviations between the line normal to the specimen surface and the optical axis of the mirror objective, which has a deflection element in the unused aperture space of the mirror objective. A direction monitoring beam (30) is directed onto the specimen (P). An optical element for imaging the return reflection of the direction monitoring beam (30) onto an area detector that is connected to an evaluation circuit (46) is also provided. Positioning commands for a specimen stage (12) are available at the outputs of the evaluation circuit (46). By way of the control commands, the specimen stage is caused to tilt until the return reflection on the area detector has assumed the position at which the direction of the normal line corresponds to the direction of the angle bisector (25).

    摘要翻译: 光学测量装置包括椭偏仪(45)和用于确定和校正与样品表面垂直的线与椭圆偏振仪(45)的入射和返回光束(23,24)之间的角度平分线(25)之间的方向偏差的装置, )。 测量装置包括镜面物镜和用于确定在垂直于样品表面的线与反射镜物镜的光轴之间的方向偏差的装置,其在镜面物镜的未使用的孔径空间中具有偏转元件。 方向监测光束(30)被引导到样本(P)上。 还提供了用于将方向监视光束(30)的反射成像到连接到评估电路(46)的区域检测器上的光学元件。 在评估电路(46)的输出处提供用于样品台(12)的定位命令。 通过控制命令,使样本台倾斜直到区域检测器上的返回反射已经假定法线方向对应于角平分线(25)的方向的位置。

    Method and apparatus for inspecting a wafer
    7.
    发明申请
    Method and apparatus for inspecting a wafer 审中-公开
    用于检查晶片的方法和装置

    公开(公告)号:US20070076943A1

    公开(公告)日:2007-04-05

    申请号:US11400919

    申请日:2006-04-10

    IPC分类号: G06K9/00

    摘要: The present invention provides a method for inspecting the surface of a wafer, wherein an image of a wafer recorded by a camera is evaluated with respect to the imaging quality and is taken again, if necessary, before the wafer is evaluated by evaluating the image.

    摘要翻译: 本发明提供了一种用于检查晶片表面的方法,其中由相机记录的晶片的图像相对于成像质量进行评估,并且如果需要,则在通过评估图像评估晶片之前再次进行评估。

    System for inspection of a disk-shaped object
    8.
    发明申请
    System for inspection of a disk-shaped object 审中-公开
    用于检查盘形物体的系统

    公开(公告)号:US20060119366A1

    公开(公告)日:2006-06-08

    申请号:US11289022

    申请日:2005-11-29

    IPC分类号: C23F1/00

    摘要: A system (100, 200, 300) for inspecting a disc-shaped object is disclosed. The system (100, 200, 300) comprises a loading unit for disc-shaped objects 4 and a device 1 for simultaneously imaging the front side and back side of the disc-shaped object 4.

    摘要翻译: 公开了一种用于检查盘形物体的系统(100,200,300)。 系统(100,200,300)包括用于盘形物体4的装载单元和用于同时成像盘状物体4的前侧和后侧的装置1。

    Substrate conveying module and system made up of substrate conveying module and workstation
    9.
    发明授权
    Substrate conveying module and system made up of substrate conveying module and workstation 有权
    基板输送模块和系统由基板输送模块和工作站组成

    公开(公告)号:US06962471B2

    公开(公告)日:2005-11-08

    申请号:US09880100

    申请日:2001-06-14

    CPC分类号: H01L21/67196 H01L21/67775

    摘要: The invention is based on a substrate conveying module (1) for conveying substrates into a workstation (3) for inspection, measurement, or processing of the substrates, in which on because of connecting elements (4a, b) in at least two side walls (1a, b, c) of the substrate conveying module (1) and/or in at least two side walls (3a, b, c, d) of the workstation (3), the substrate conveying module (1) can, at the installation location of the workstation (3), be flexibly connected thereto in different orientations with respect to the workstation (3) and/or can be coupled at different points to the workstation (3).

    摘要翻译: 本发明基于用于将基板输送到工作站(3)中用于基板的检查,测量或处理的基板输送模块(1),其中由于连接元件(4a,b)至少在两侧 基板输送模块(1)的壁(1a,b,c)和/或工作站(3)的至少两个侧壁(3a,b,c,d),基板输送模块(1) 可以在工作站(3)的安装位置处以相对于工作站(3)的不同取向灵活地连接到工作站(3)并且/或可以在不同点处联接到工作站(3)。

    Apparatus for inspecting a disk-like object
    10.
    发明授权
    Apparatus for inspecting a disk-like object 有权
    用于检查盘状物体的装置

    公开(公告)号:US07489394B2

    公开(公告)日:2009-02-10

    申请号:US11391066

    申请日:2006-03-28

    IPC分类号: G01N21/00

    摘要: An apparatus for inspecting a disk-like object comprising at least one first module for inspecting a surface of the disk-like object and at least one second module insertable in the apparatus. The at least one second module is arranged to inspect a different element of the disk-like object than the surface of the disk-like object.

    摘要翻译: 一种用于检查盘状物体的装置,包括至少一个用于检查盘状物体的表面的第一模块和可插入到装置中的至少一个第二模块。 至少一个第二模块布置成检查与盘状物体的表面相比盘状物体的不同元件。