摘要:
The invention refers to an optical measurement arrangement, in particular for layer thickness measurement and for ascertaining optical material properties such as refractive index, extinction factor, etc. of a specimen (P), having an illumination device (1) for emitting a measurement light beam (6), a beam splitter (8) for dividing the measurement light beam (6) into a specimen light beam (10) and a reference light beam (9), a measurement objective for directing the specimen light beam (10) onto a measurement location (M) on the surface of the specimen (P) and for acquiring the light reflected from the measurement location (M), and an analysis device (11) into which the reference light beam (9) and the specimen light beam (10) reflected from the specimen (P) are coupled in order to obtain information about the specimen (P), in particular about layer thicknesses present thereon. Light-guiding devices (23, 25) having a plurality of light-guiding fibers are provided for coupling the specimen light beam (10) and the reference light beam (9) into the analysis device (11). The result is to create a compact optical measurement arrangement that can be flexibly set up and is insensitive to disturbance, which is suitable in particular for automatic monitoring of continuous production processes, in particular in semiconductor chip manufacture.
摘要:
The invention concerns a method for the determination of layer thickness ranges of layers of a specimen, in which the reflection spectrum of the specimen is measured in a specified wavelength range and then smoothed, the number of extremes in the smoothed reflection spectrum is determined, and the determination of the layer thickness ranges is accomplished by comparison with the number of extremes in the modeled reflection spectra, such that for each layer the thickness in that layer is varied in steps having a predetermined increment, and a reflection spectrum is modeled. In a method of this kind, the wavelength range and the increments are specified in self-consistent fashion using a sensitivity criterion.
摘要:
A method and apparatus for determination of layer thicknesses and optical parameters of a number of layers of a specimen, in which the reflectance spectrum of the specimen is measured and then smoothed, and a modeled reflectance spectrum is adapted to the measured one by means of an optimization criterion so as thereby to determine the layer thickness. The optimization criterion is determined by the totality of the absolute values of the wavelength differences of all pairs of wavelengths, a pair of wavelengths being constituted by those wavelengths that respectively correspond to a selected extreme in the measured reflectance spectrum characterized by an index counting the extremes in ascending or descending order, and a selected extreme in the modeled reflectance spectrum having the same index.
摘要:
The invention concerns a system operating unit (30) having a column (3) that is attachable by way of at least two supports (9, 10) to different points of a system housing (14). In the preferred embodiment, this column is attached laterally to the housing, the supports serving for attachment to the housing of the system. In addition, a retaining bracket (4) is connected to the column (3) in such a way that a horizontal deflection of the retaining bracket (4) about a vertical axis is possible.
摘要:
The invention relates to a holding device for wafers in an arrangement for wafer inspection, comprising two grippers (11, 12), each of which, in the closed state of the holding device (8), encloses a subsection of the wafer circumference and which are connected to a drive device (27) and, when the latter is driven, the grippers (11, 12) move away from each other for the purpose of opening the holding device (9) and move toward each other for the purpose of closing the holding device (8), and a holding arm (13), on which the two grippers (11, 12) are pivotably mounted.In this case the holding arm (13) is mounted such that it can rotate about an axis (A) which lies substantially in the plane covered by the wafer (W), so that after a rotation through 180° about the axis (A), a wafer (W) held between the grippers (11, 12) has been turned.
摘要:
An optical measurement arrangement includes an ellipsometer (45) and a device for ascertaining and correcting directional deviations between the line normal to the specimen surface and the angle bisector (25) between the incident and return beams (23, 24) of the ellipsometer (45). A measurement arrangement includes a mirror objective and a device for ascertaining directional deviations between the line normal to the specimen surface and the optical axis of the mirror objective, which has a deflection element in the unused aperture space of the mirror objective. A direction monitoring beam (30) is directed onto the specimen (P). An optical element for imaging the return reflection of the direction monitoring beam (30) onto an area detector that is connected to an evaluation circuit (46) is also provided. Positioning commands for a specimen stage (12) are available at the outputs of the evaluation circuit (46). By way of the control commands, the specimen stage is caused to tilt until the return reflection on the area detector has assumed the position at which the direction of the normal line corresponds to the direction of the angle bisector (25).
摘要:
The present invention provides a method for inspecting the surface of a wafer, wherein an image of a wafer recorded by a camera is evaluated with respect to the imaging quality and is taken again, if necessary, before the wafer is evaluated by evaluating the image.
摘要:
A system (100, 200, 300) for inspecting a disc-shaped object is disclosed. The system (100, 200, 300) comprises a loading unit for disc-shaped objects 4 and a device 1 for simultaneously imaging the front side and back side of the disc-shaped object 4.
摘要:
The invention is based on a substrate conveying module (1) for conveying substrates into a workstation (3) for inspection, measurement, or processing of the substrates, in which on because of connecting elements (4a, b) in at least two side walls (1a, b, c) of the substrate conveying module (1) and/or in at least two side walls (3a, b, c, d) of the workstation (3), the substrate conveying module (1) can, at the installation location of the workstation (3), be flexibly connected thereto in different orientations with respect to the workstation (3) and/or can be coupled at different points to the workstation (3).
摘要:
An apparatus for inspecting a disk-like object comprising at least one first module for inspecting a surface of the disk-like object and at least one second module insertable in the apparatus. The at least one second module is arranged to inspect a different element of the disk-like object than the surface of the disk-like object.