公开(公告)号：US20090283302A1

公开(公告)日：2009-11-19

申请号：US12318748

申请日：2009-01-07

申请人： Seok-Kyu Lee ,  Shuhichi Okabe ,  Seung-Hyun Cho ,  Jae-Joon Lee

发明人： Seok-Kyu Lee ,  Shuhichi Okabe ,  Seung-Hyun Cho ,  Jae-Joon Lee

IPC分类号： H05K1/00 ,  H05K3/46 ,  H05K3/22

CPC分类号： H05K3/4682 ,  H05K1/0271 ,  H05K3/181 ,  H05K3/20 ,  H05K3/28 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0156

摘要： Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board in accordance with the present invention includes: a circuit laminate, a solder resist laminated on the circuit laminate, a metal support layer formed on the solder resist, a stiffener formed on the metal support layer.

摘要翻译： 公开了一种印刷电路板及其制造方法。 根据本发明的印刷电路板包括：电路层叠体，层叠在电路层叠体上的阻焊剂，形成在阻焊剂上的金属支撑层，形成在金属支撑层上的加强件。

公开(公告)号：US20070018335A1

公开(公告)日：2007-01-25

申请号：US11483844

申请日：2006-07-11

申请人： Seung-Hyun Cho ,  Soon-Jin Cho ,  Jae-Joon Lee ,  Se-Jong Oh

发明人： Seung-Hyun Cho ,  Soon-Jin Cho ,  Jae-Joon Lee ,  Se-Jong Oh

IPC分类号： H01L23/48

CPC分类号： H01L23/13 ,  H01L23/562 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A flip chip BGA board is disclosed, in which each of the corners of the board is removed to minimize warpage of the board due to heat applied during the manufacturing process. Embodiments of the invention allow the production of thin boards by preventing warpage of the board, and may provide a board high in reliability since the risk of the chip being separated from the board is reduced.

摘要翻译： 公开了一种倒装芯片BGA板，其中去除板的每个拐角以最小化由于在制造过程中施加的热而引起的板的翘曲。 本发明的实施例允许通过防止板的翘曲来生产薄板，并且可以提供高可靠性的板，因为芯片与板分离的风险降低。

公开(公告)号：US08542425B2

公开(公告)日：2013-09-24

申请号：US12971233

申请日：2010-12-17

申请人： Seung-Hyun Cho ,  Jong Hoon Lee ,  Eun Gu Lee ,  Jie Hyun Lee ,  Han-Hyub Lee ,  Eui Suk Jung ,  Sang Soo Lee

发明人： Seung-Hyun Cho ,  Jong Hoon Lee ,  Eun Gu Lee ,  Jie Hyun Lee ,  Han-Hyub Lee ,  Eui Suk Jung ,  Sang Soo Lee

IPC分类号： G02F1/03

CPC分类号： G02F1/17 ,  G02B6/4215 ,  G02F1/133608 ,  H01S5/0265 ,  H01S5/141

摘要： A wavelength tunable light source includes: an optical gain medium generating light; a wavelength tunable filter positioned on a optical path and transmitting or reflecting only a predetermined wavelength generated from and injected into the optical gain medium; a first housing where the optical gain medium and the wavelength tunable filter are mounted; and an optical fiber block providing the optical wave having the predetermined wavelength come from the wavelength tunable filter, wherein the wavelength tunable filter comprised of a dielectric thin-film filter formed by alternately stacking a first dielectric thin film layer and a second dielectric thin film layer having different refractive index.

摘要翻译： 波长可调光源包括：产生光的光学增益介质; 位于光路上的波长可调滤波器，仅传输或反射从光增益介质产生和注入的预定波长; 安装光学增益介质和波长可调滤波器的第一壳体; 提供具有预定波长的光波长的光纤块来自波长可调谐滤波器，其中波长可调滤波器由通过交替地堆叠第一介电薄膜层和第二介电薄膜层而形成的电介质薄膜滤波器组成 具有不同的折射率。

公开(公告)号：US20120155876A1

公开(公告)日：2012-06-21

申请号：US13333119

申请日：2011-12-21

申请人： Seung-Hyun Cho ,  Han-Hyub Lee ,  Jie-Hyun Lee ,  Jong-Hoon Lee ,  Eun-Gu Lee ,  Eui-Suk Jung ,  Sang-Soo Lee

发明人： Seung-Hyun Cho ,  Han-Hyub Lee ,  Jie-Hyun Lee ,  Jong-Hoon Lee ,  Eun-Gu Lee ,  Eui-Suk Jung ,  Sang-Soo Lee

IPC分类号： H04J14/02 ,  H04J14/06

CPC分类号： H04J14/0282 ,  H04B10/506

摘要： A seed light module for a WDM-PON system is provided. The seed light module includes a reflector configured to reflect a part of seed light that is generated from a light source generator, and an optical attenuator configured to attenuate the intensity of the reflected seed light and provide the attenuated seed light, which corresponds to a signal generated by attenuating the intensity of the reflected seed light, to the light source generator.

摘要翻译： 提供了一种用于WDM-PON系统的种子光模块。 种子光模块包括被配置为反射从光源发生器产生的种子光的一部分的反射器，以及光衰减器，被配置为衰减反射种子光的强度并提供对应于信号的衰减种子光 通过将反射的种子光的强度衰减而产生到光源发生器。

公开(公告)号：US20110149365A1

公开(公告)日：2011-06-23

申请号：US12971233

申请日：2010-12-17

申请人： Seung-Hyun Cho ,  Jong Hoon Lee ,  Eun Gu Lee ,  Jie Hyun Lee ,  Han-Hyub Lee ,  Eui Suk Jung ,  Sang Soo Lee

发明人： Seung-Hyun Cho ,  Jong Hoon Lee ,  Eun Gu Lee ,  Jie Hyun Lee ,  Han-Hyub Lee ,  Eui Suk Jung ,  Sang Soo Lee

IPC分类号： H01S5/068 ,  G02B5/28 ,  G02F1/17

CPC分类号： G02F1/17 ,  G02B6/4215 ,  G02F1/133608 ,  H01S5/0265 ,  H01S5/141

摘要： A wavelength tunable light source includes: an optical gain medium generating light; a wavelength tunable filter positioned on a optical path and transmitting or reflecting only a predetermined wavelength generated from and injected into the optical gain medium; a first housing where the optical gain medium and the wavelength tunable filter are mounted; and an optical fiber block providing the optical wave having the predetermined wavelength come from the wavelength tunable filter, wherein the wavelength tunable filter comprised of a dielectric thin-film filter formed by alternately stacking a first dielectric thin film layer and a second dielectric thin film layer having different refractive index.

摘要翻译： 波长可调光源包括：产生光的光学增益介质; 位于光路上的波长可调滤波器，仅传输或反射从光增益介质产生和注入的预定波长; 安装光学增益介质和波长可调滤波器的第一壳体; 并且提供具有预定波长的光波长的光纤块来自波长可调谐滤波器，其中波长可调滤波器由通过交替堆叠第一介电薄膜层和第二介电薄膜层形成的电介质薄膜滤波器组成 具有不同的折射率。

公开(公告)号：US07736952B2

公开(公告)日：2010-06-15

申请号：US12010544

申请日：2008-01-25

申请人： Soon-Jin Cho ,  Jin-Won Choi ,  Seung-Hyun Cho ,  Chung-Woo Cho ,  Dong-Gyu Lee ,  Seok-Hwan Ahn

发明人： Soon-Jin Cho ,  Jin-Won Choi ,  Seung-Hyun Cho ,  Chung-Woo Cho ,  Dong-Gyu Lee ,  Seok-Hwan Ahn

IPC分类号： H01L21/00 ,  H01L21/58

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/00014

摘要： A wafer packaging method is disclosed.An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.

摘要翻译： 公开了一种晶片封装方法。 本发明的一个方面是提供一种晶片封装方法，包括： 将带附着到载体的一侧上，所述载体具有形成在其中的通孔; 将晶片附接到暴露在通孔内的带上，使得晶片的至少一个电极露出; 以及在所述载体上执行封装处理以使所述晶片被封装。

公开(公告)号：US07663226B2

公开(公告)日：2010-02-16

申请号：US12010643

申请日：2008-01-28

申请人： Seung-Hyun Cho ,  Seung-Chul Kim ,  Sang-Soo Lee ,  Jung-Woo Lee

发明人： Seung-Hyun Cho ,  Seung-Chul Kim ,  Sang-Soo Lee ,  Jung-Woo Lee

IPC分类号： H01L23/12 ,  H01L23/053

CPC分类号： H05K3/285 ,  B82Y10/00 ,  H01L23/373 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/15311 ,  H05K1/0209 ,  H05K3/3452 ,  H05K2201/026 ,  Y10S977/742

摘要： A heat-releasing printed circuit board and semiconductor chip package are disclosed. The heat-releasing printed circuit board includes an insulation layer, on a surface of which a circuit pattern is formed, and a solder resist, which is stacked on the insulation layer, where the solder resist contains carbon nanotubes. The heat-releasing printed circuit board allows the heat generated in a semiconductor chip to be dispersed in several directions of the board or package, to improve heat-releasing property.

摘要翻译： 公开了一种散热印刷电路板和半导体芯片封装。 散热印刷电路板包括在其表面上形成电路图案的绝缘层和层叠在绝缘层上的阻焊剂，其中阻焊剂包含碳纳米管。 散热印刷电路板允许在半导体芯片中产生的热分散在板或封装的多个方向上，以提高散热性能。

公开(公告)号：US20110026923A1

公开(公告)日：2011-02-03

申请号：US12445935

申请日：2007-07-06

申请人： Byoung-Whi Kim ,  Manyong Park ,  Woo-Ram Lee ,  Bong-Tae Kim ,  Seung-Hyun Cho ,  Jie-Hyun Lee ,  Geon Jeong ,  Chulyoung Kim ,  Dae-Ung Kim ,  Byung-Yong Kang

发明人： Byoung-Whi Kim ,  Manyong Park ,  Woo-Ram Lee ,  Bong-Tae Kim ,  Seung-Hyun Cho ,  Jie-Hyun Lee ,  Geon Jeong ,  Chulyoung Kim ,  Dae-Ung Kim ,  Byung-Yong Kang

IPC分类号： H04J14/02 ,  H01S5/06

CPC分类号： H01S5/5018 ,  H01S5/0427 ,  H01S5/06253 ,  H01S5/06812 ,  H01S5/50 ,  H04J14/02 ,  H04J14/0227 ,  H04J14/0246 ,  H04J14/0247 ,  H04J14/025 ,  H04J14/0252 ,  H04J14/0282 ,  H04J2014/0253

摘要： In a Wavelength-Division-Multiplexed Passive Optical Network (WDM-PON) utilizing a conventional downstream optical signal reusing method, there is an inventory problem that different optical transmitter types need to be provided for the operation, management, replacement, etc. of a system. A WDM-PON system according to the present invention, includes: a seed light (SL) unit generating a seed light whose wavelength intervals and center wavelengths are adjusted using at least one seed light source; an optical line terminal (OLT) receiving the wavelength-multiplexed seed light from the seed light unit, transmitting a downstream optical signal to a subscriber of the WDM-PON, and receiving a upstream optical signal from the subscriber; and an optical network unit (ONU) receiving the downstream optical signal from the OLT, flattening and modulating the downstream optical signal with upstream data so that the downstream optical signal is reused for carrying upstream data. It is possible to improve the quality and reliability of downstream transmission by sufficiently increasing an extinction ratio, and improve the quality and reliability of upstream transmission by sufficiently flattening an input downstream optical signal in a semiconductor optical amplifier.

摘要翻译： 在利用传统的下行光信号重用方法的波分复用无源光网络（WDM-PON）中，存在一种库存问题，需要为不同的光发射机类型提供不同的光发射机类型的操作，管理，替换等 系统。 根据本发明的WDM-PON系统包括：种子光（SL）单元，其生成使用至少一个种子光源调整其波长间隔和中心波长的种子光; 接收来自种子光单元的波长复用种子光的光线路终端（OLT）向下行光信号发送WDM-PON的用户，并从用户接收上行光信号; 以及从OLT接收下行光信号的光网络单元（ONU），用下游数据对下行光信号进行平坦化和调制，使下游光信号重新用于承载上行数据。 通过充分提高消光比可以提高下游传输的质量和可靠性，通过在半导体光放大器中充分平坦化输入下行光信号，提高上行传输的质量和可靠性。

公开(公告)号：US20070126112A1

公开(公告)日：2007-06-07

申请号：US11606943

申请日：2006-12-01

申请人： Seung-Hyun Cho ,  Dae-Hyun Park ,  Young-Goo Kim

发明人： Seung-Hyun Cho ,  Dae-Hyun Park ,  Young-Goo Kim

IPC分类号： H01L23/12 ,  H01L21/00

CPC分类号： H05K1/056 ,  H01L23/13 ,  H01L23/142 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K2201/09054 ,  H05K2201/09745 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A metal core and a package board having the metal core are disclosed. A package board, which comprises a metal core having a plurality of protrusions formed in a lengthwise direction on its surface, an insulation layer stacked on the metal core, and an inner layer circuit formed on the insulation layer for signal connection between a chip and the exterior, has a greater surface area due to the protrusions, so that it is superior in terms of heat releasing and of adhesion to the insulation layer, and has superior mechanical properties with respect to warpage.

摘要翻译： 公开了具有金属芯的金属芯和封装板。 一种包装板，其包括：金属芯，其具有在其表面上沿长度方向形成的多个突起，堆叠在金属芯上的绝缘层，以及形成在绝缘层上的内层电路，用于在芯片和芯片之间进行信号连接 外部由于突起而具有更大的表面积，因此其在隔热层的散热和粘附性方面优异，并且相对于翘曲具有优异的机械性能。

公开(公告)号：US20070087512A1

公开(公告)日：2007-04-19

申请号：US11546358

申请日：2006-10-12

申请人： Seung-Hyun Cho ,  ll-Soung Yoon ,  Won-Cheol Bae ,  Se-Jong Oh

发明人： Seung-Hyun Cho ,  ll-Soung Yoon ,  Won-Cheol Bae ,  Se-Jong Oh

IPC分类号： H01L21/20

CPC分类号： H05K1/188 ,  H01L23/5389 ,  H01L23/642 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K3/323 ,  H05K2201/0347 ,  H05K2201/0355 ,  H01L2224/05599

摘要： A method for manufacturing a substrate embedded with a passive device, comprising the steps of (a) molding the passive device and (b) mounting the molded passive device in a cavity formed on the substrate, is disclosed. The substrate embedded with a passive device and the manufacturing method thereof in accordance with the present invention can prevent warpage of the substrate caused by disproportioned properties of materials.

摘要翻译： 公开了一种用于制造嵌入无源器件的衬底的方法，包括以下步骤：（a）模制无源器件，和（b）将模制的无源器件安装在形成在衬底上的空腔中。 嵌入无源器件的衬底及其根据本发明的制造方法可以防止由材料的不均衡性质引起的衬底翘曲。