公开(公告)号：US4841540A

公开(公告)日：1989-06-20

申请号：US250237

申请日：1988-09-28

申请人： Hans Krueger ,  Herbert Lamprecht, deceased ,  by Thekla Lamprecht, heir ,  by Simon Lamprecht, heir ,  Wilhelm Tiemann

发明人： Hans Krueger ,  Herbert Lamprecht, deceased ,  by Thekla Lamprecht, heir ,  by Simon Lamprecht, heir ,  Wilhelm Tiemann

IPC分类号： H01S3/032 ,  H01S3/038 ,  H01S3/097

CPC分类号： H01S3/0323 ,  H01S3/038

摘要： A gas laser arrangement includes a discharge tube arranged between a cathode and anode and including a central discharge channel and at least one gas return channel. An auxiliary electrode for pre-discharge is allocated to the cathode, the auxiliary electrode being connected to an operating voltage source through a resistor.

摘要翻译： 气体激光装置包括布置在阴极和阳极之间并且包括中心排放通道和至少一个气体返回通道的放电管。 用于预放电的辅助电极被分配给阴极，辅助电极通过电阻器连接到工作电压源。

公开(公告)号：US4937838A

公开(公告)日：1990-06-26

申请号：US250438

申请日：1988-09-28

申请人： Hans Krueger ,  Wilhelm Tiemann ,  Herbert Lamprecht, deceased ,  by Thekla Lamprecht, heir ,  by Simon Lamprecht, heir

发明人： Hans Krueger ,  Wilhelm Tiemann ,  Herbert Lamprecht, deceased ,  by Thekla Lamprecht, heir ,  by Simon Lamprecht, heir

IPC分类号： H01S3/038 ,  H01S3/03 ,  H01S3/032

CPC分类号： H01S3/03 ,  H01S3/0323

摘要： A gas laser arrangement includes a discharge tube between a cathode and an anode, the discharge tube including a central discharge channel and at least one gas return channel. A blocking electrode is provided at the openings of the gas return channels at least in the cathode space and possibly also in the anode space, the blocking electrode being connected to a blocking voltage to avoid misfirings of the laser through the gas return channels.

摘要翻译： 气体激光装置包括在阴极和阳极之间的放电管，放电管包括中心放电通道和至少一个气体返回通道。 阻挡电极至少在阴极空间和可能还在阳极空间中设置在气体返回通道的开口处，阻挡电极连接到阻挡电压，以避免激光通过气体返回通道发生错位。

公开(公告)号：US4847841A

公开(公告)日：1989-07-11

申请号：US51695

申请日：1987-05-20

申请人： Herbert Lamprecht, deceased ,  by Thekla Lamprecht, heir ,  by Simon Lamprecht, Heir ,  Guenter Funk ,  Hans Krueger

发明人： Herbert Lamprecht, deceased ,  by Thekla Lamprecht, heir ,  by Simon Lamprecht, Heir ,  Guenter Funk ,  Hans Krueger

IPC分类号： H01S3/032 ,  H01S3/041

CPC分类号： H01S3/041 ,  H01S3/0326

摘要： An ion laser includes a magnetic field source to generate an axial magnetic field in one region and transverse field components outside the region, the magnetic field source being shorter than the discharge channel of the laser. Axially spaced permanent magnets in the proximity of the discharge channel are adapted to the laser structure and can include magnetic rings or ring structures. The magnets are preferrably adjacent the cathode end of the discharge channel.

摘要翻译： 离子激光器包括在一个区域中产生轴向磁场的磁场源和区域外的横向场分量，该磁场源比激光器的放电通道短。 在排出通道附近的轴向间隔的永磁体适用于激光结构，并且可以包括磁环或环形结构。 磁体优选地邻近排放通道的阴极端。

公开(公告)号：US08865499B2

公开(公告)日：2014-10-21

申请号：US13805630

申请日：2011-07-07

申请人： Wolfgang Pahl ,  Hans Krueger ,  Gregor Feiertag ,  Alois Stelzl ,  Anton Leidl ,  Stefan Seitz

发明人： Wolfgang Pahl ,  Hans Krueger ,  Gregor Feiertag ,  Alois Stelzl ,  Anton Leidl ,  Stefan Seitz

IPC分类号： H01L21/00

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2207/096 ,  B81C1/00309 ,  H01L2224/16225 ,  H01L2924/15151 ,  H01L2924/16151 ,  H04R1/086 ,  H04R1/38 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R31/006

摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.

摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中换能器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（S01）; 进行麦克风的功能测试; 第一声​​音入口（S01）关闭; 并且在盖中产生第二声音入口（S02）。 本发明还涉及由该方法产生的麦克风，其中第一声音入口开口（S01）准备但关闭。

公开(公告)号：US08759677B2

公开(公告)日：2014-06-24

申请号：US12993299

申请日：2009-05-26

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

IPC分类号： H01J5/00 ,  H01J15/00 ,  H05K5/06 ,  H05H1/00 ,  H05K7/00 ,  H05K7/10 ,  H05K7/12

CPC分类号： H01L23/06 ,  B81B7/0077 ,  B81C2203/0136 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/00

摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).

摘要翻译： 施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。 可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。

公开(公告)号：US20120159778A1

公开(公告)日：2012-06-28

申请号：US13330422

申请日：2011-12-19

申请人： Hans Krueger ,  Alexander Schmajew ,  Alois Stelzl

发明人： Hans Krueger ,  Alexander Schmajew ,  Alois Stelzl

IPC分类号： H05K3/36

CPC分类号： H01L24/94 ,  B81B7/007 ,  B81B2207/098 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24147 ,  H01L2224/24991 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1068 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49126 ,  H01L2224/81 ,  H01L2224/82

摘要： A plurality of unpackaged substrates connected to one another is disclosed. The stepped structures on and/or in a first main area of a first substrate include a plurality of integrated circuits. The stepped structures run between the integrated circuits. The first conductor tracks extend from at least some contact connections of the respective integrated circuits as far as the stepped structures. The first substrate is connected on the side of the first main area to a further substrate. The first substrate is severed from a second main area opposite to the first main area such that the first substrate is divided into a plurality of substrate pieces. Each substrate piece has one of the integrated circuits. The first conductor tracks are accessible in interspaces between the substrate pieces. The second conductor tracks are formed from the second main area. At least some of the second conductor tracks lead from the second main area over side walls of the substrate pieces as far as the first conductor tracks.

摘要翻译： 公开了彼此连接的多个未封装的基板。 第一基板的第一主区域和/或第一主区域中的阶梯结构包括多个集成电路。 阶梯式结构在集成电路之间运行。 第一导体轨道从各个集成电路的至少一些接触连接延伸到阶梯式结构。 第一基板在第一主区域的一侧连接到另一基板。 第一基板从与第一主区域相对的第二主区域切断，使得第一基板被分成多个基板块。 每个衬底片具有一个集成电路。 第一导体轨迹可在基片之间的间隙中接近。 第二导体轨道由第二主区域形成。 至少一些第二导体轨道从第二主区域超过衬底片的侧壁延伸，直到第一导体轨迹。

公开(公告)号：US20120061778A1

公开(公告)日：2012-03-15

申请号：US13228971

申请日：2011-09-09

申请人： Michael Gerner ,  Hans Krueger ,  Alois Stelzl

发明人： Michael Gerner ,  Hans Krueger ,  Alois Stelzl

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： B81C1/00333

摘要： A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method.

摘要翻译： 制造提供具有多个芯片部件的至少一个晶片的芯片器件。 将晶片或晶片分离成各个芯片组件和/或分组成芯片组件。 单个芯片组件和/或芯片组件组被施加到载体元件，使得在各个芯片组件和/或芯片组件组之间形成具有预定宽度的间隙。 将聚合物引入到间隙中以形成由芯片部件和聚合物基体组成的复合元件。 复合元件以这样的方式分离，即在每种情况下由芯片部件和聚合物基体的至少一个部分组成的芯片器件形成。 本发明还涉及通过该方法制造的芯片器件。

公开(公告)号：US08110962B2

公开(公告)日：2012-02-07

申请号：US12642357

申请日：2009-12-18

申请人： Christian Bauer ,  Hans Krueger ,  Werner Ruile ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Werner Ruile ,  Alois Stelzl

IPC分类号： H01L29/84

CPC分类号： H03H9/02866 ,  H03H9/14538

摘要： A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.

摘要翻译： MEMS部件包括芯片，该芯片的后侧具有小于在部件中传播的声波的中心频率处波长的十分之一的粗糙度。 用于散射体声波的金属结构设置在芯片的后侧，并且金属结构的材料与芯片的材料声学匹配。

公开(公告)号：US20110214905A1

公开(公告)日：2011-09-08

申请号：US12997867

申请日：2009-06-08

申请人： Wolfgang Pahl ,  Hans Krueger ,  Peter Demmer

发明人： Wolfgang Pahl ,  Hans Krueger ,  Peter Demmer

IPC分类号： H05K1/02 ,  H05K3/00

CPC分类号： H05K1/189 ,  H01L2224/16225 ,  H05K3/4691 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09109 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T428/24322

摘要： A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.

摘要翻译： 一种电路板，包括电路载体，由非导电材料构成的覆盖层，包括布置在电路载体上的有机物质，至少部分地布置在覆盖层上的第一金属化层，其中第一金属化层具有柔性区域 。

公开(公告)号：US20110114355A1

公开(公告)日：2011-05-19

申请号：US12993299

申请日：2009-05-26

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

IPC分类号： H05K5/06

CPC分类号： H01L23/06 ,  B81B7/0077 ,  B81C2203/0136 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/00

摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).

摘要翻译： 施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。 可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。