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191 条记录 (耗时 0.084 秒)

    Low temperature barriers for use with in situ processes
    5.
    发明申请
    Low temperature barriers for use with in situ processes 有权
    用于原位过程的低温屏障

    公开(公告)号：US20070144732A1

    公开(公告)日：2007-06-28

    申请号：US11409566

    申请日：2006-04-21

    申请人： Dong Kim ,  Harold Vinegar

    发明人： Dong Kim ,  Harold Vinegar

    IPC分类号： E21B23/00 ,  E21B47/00

    CPC分类号： E21B43/24 ,  C07C4/02 ,  E21B17/028 ,  E21B36/001 ,  E21B36/04 ,  E21B43/243 ,  Y10T29/49179 ,  C07C9/04

    摘要： A method of forming and maintaining a low temperature zone around at least a portion of a subsurface treatment area is described. The method includes reducing a temperature of heat transfer fluid with a refrigeration system. The heat transfer fluid is circulated through freeze well canisters and placed in a formation around at least a portion of the subsurface treatment area. An initial temperature of the heat transfer fluid supplied to a first freeze well canister is in a range from about −35 ° C. to about −55 ° C. At least one of the well canisters includes carbon steel. The heat transfer fluid is returned to the refrigeration system.

    摘要翻译： 描述了在地下处理区域的至少一部分周围形成和保持低温区域的方法。 该方法包括用制冷系统降低传热流体的温度。 传热流体通过冷冻罐循环并且被放置在围绕地下处理区域的至少一部分的地层中。 提供给第一冷冻井罐的传热流体的初始温度在约-35℃至约-55℃的范围内。井筒中的至少一个包括碳钢。 传热流体返回到制冷系统。

    Subsurface connection methods for subsurface heaters
    6.
    发明申请
    Subsurface connection methods for subsurface heaters 有权
    地下加热器的地下连接方法

    公开(公告)号：US20070045267A1

    公开(公告)日：2007-03-01

    申请号：US11409559

    申请日：2006-04-21

    申请人： Harold Vinegar ,  Ronald Bass ,  Dong Kim ,  Stanley Mason ,  George Stegemeier ,  Thomas Keltner ,  Frederick Carl

    发明人： Harold Vinegar ,  Ronald Bass ,  Dong Kim ,  Stanley Mason ,  George Stegemeier ,  Thomas Keltner ,  Frederick Carl

    IPC分类号： B60L1/02

    CPC分类号： E21B43/24 ,  C07C4/02 ,  E21B17/028 ,  E21B36/001 ,  E21B36/04 ,  E21B43/243 ,  Y10T29/49179 ,  C07C9/04

    摘要： A system for heating a subsurface formation is described. The system includes a first elongated heater in a first opening in the formation. The first elongated heater includes an exposed metal section in a portion of the first opening. The portion is below a layer of the formation to be heated. The exposed metal section is exposed to the formation. A second elongated heater is in a second opening in the formation. The second opening connects to the first opening at or near the portion of the first opening below the layer to be heated. At least a portion of an exposed metal section of the second elongated heater is electrically coupled to at least a portion of the exposed metal section of the first elongated heater in the portion of the first opening below the layer to be heated.

    摘要翻译： 描述了用于加热地下地层的系统。 该系统包括在地层中的第一开口中的第一细长加热器。 第一细长加热器包括在第一开口的一部分中的暴露的金属部分。 该部分在待加热地层的一层之下。 暴露的金属部分暴露于地层。 第二细长加热器位于地层中的第二个开口中。 第二开口在第一开口的部分处或附近连接到第一开口，该第一开口在被加热层下方。 第二细长加热器的暴露的金属部分的至少一部分电耦合到第一细长加热器的暴露的金属部分的第一开口部分的待加热层下方的部分。

    Decoder, method of operating the same, and apparatuses including the same
    7.
    发明授权
    Decoder, method of operating the same, and apparatuses including the same 有权
    解码器，其操作方法和包括该解码器的设备

    公开(公告)号：US08990666B2

    公开(公告)日：2015-03-24

    申请号：US13234130

    申请日：2011-09-15

    申请人： Jae Phil Kong ,  Hwa Seok Oh ,  Dong Kim

    发明人： Jae Phil Kong ,  Hwa Seok Oh ,  Dong Kim

    IPC分类号： H03M13/00 ,  G06F11/10 ,  H03M13/15

    CPC分类号： G06F11/1008 ,  G06F11/108 ,  H03M13/1515 ,  H03M13/152 ,  H03M13/1545 ,  H03M13/6502

    摘要： A decoder, a method of decoding and systems implementing the same are disclosed. In one example, the method includes calculating syndrome values from input codewords, generating an error location polynomial about the codewords using the syndrome values, determining an error count in the codewords using the error location polynomial, and adjusting power consumption of a circuit in response to the determined error count in the codewords. In one example, a frequency of a clock signal to be provided to a search circuit may be determined based on the error count, and the clock signal may be provided having the determined frequency to a search circuit, such as a Chien search circuit.

    摘要翻译： 公开了解码器，解码方法及其实现方法。 在一个示例中，该方法包括从输入码字计算校正子值，使用校正子值生成关于码字的误差位置多项式，使用误差位置多项式确定码字中的误差计数，以及响应于 在码字中确定的错误计数。 在一个示例中，可以基于错误计数来确定要提供给搜索电路的时钟信号的频率，并且可以向诸如Chien搜索电路的搜索电路提供具有确定的频率的时钟信号。

    Drying machine and method for controlling the same
    8.
    发明申请
    Drying machine and method for controlling the same 有权
    干燥机及其控制方法

    公开(公告)号：US20080000098A1

    公开(公告)日：2008-01-03

    申请号：US11706435

    申请日：2007-02-15

    申请人： Chul Choi ,  Dae Yang ,  Chong Ryu ,  Jea Wee ,  Young Kim ,  Sang Hun Bae ,  Chang Son ,  Dong Kim ,  Young Son

    发明人： Chul Choi ,  Dae Yang ,  Chong Ryu ,  Jea Wee ,  Young Kim ,  Sang Hun Bae ,  Chang Son ,  Dong Kim ,  Young Son

    IPC分类号： D06F58/04 ,  F26B21/02

    CPC分类号： D06F58/203 ,  D06F58/04 ,  D06F58/28

    摘要： A drying machine is disclosed. The drying machine includes a selectively rotatable drum receiving an object to be dried, a steam supply member having one side connected to a steam generator and the other side connected to the drum, and a swirler installed in the steam supply member at a predetermined position for swirling steam flowing through the steam supply member. A method for controlling the drying machine includes heating a drum, supplying steam generated in a steam generator into the drum, and supplying hot air into the drum. The drying machine having the above described configuration can efficiently eliminate creases of clothes.

    摘要翻译： 公开了干燥机。 干燥机包括容纳待干燥物体的可选择性地旋转的滚筒，具有连接到蒸汽发生器的一侧的蒸汽供应构件和连接到滚筒的另一侧;以及在预定位置处安装在蒸汽供应构件中的旋流器， 蒸汽通过蒸汽供应构件流动。 一种用于控制干燥机的方法包括加热滚筒，将在蒸汽发生器中产生的蒸汽供应到滚筒中，并将热空气供应到滚筒中。 具有上述构造的干燥机能够有效地消除衣服的褶皱。

    Optical Sheet and Backlight Assembly Having the Same
    9.
    发明申请
    Optical Sheet and Backlight Assembly Having the Same 有权
    光学片和背光组件具有相同的功能

    公开(公告)号：US20070279940A1

    公开(公告)日：2007-12-06

    申请号：US11734611

    申请日：2007-04-12

    申请人： Cheul Kim ,  Sang Kim ,  Jong Huh ,  Dong Kim ,  Ju Lee ,  Min Kim ,  Hyun Shin ,  Yong Kim

    发明人： Cheul Kim ,  Sang Kim ,  Jong Huh ,  Dong Kim ,  Ju Lee ,  Min Kim ,  Hyun Shin ,  Yong Kim

    IPC分类号： F21V8/00 ,  G02B5/02

    CPC分类号： G02B5/045

    摘要： Provided are embodiments of an optical sheet and a backlight assembly having the optical sheet. The optical sheet can include a body, a plurality of protrusions, and a plurality of embossed portions. The body can form a substrate. One surface of the body can be provided in a planar shape, and the other surface of the body can include the plurality of protrusions, where the protrusions have a triangular shaped cross-section. Each of the protrusions can be configured with the plurality of embossed, which may be formed by a microlens pattern.

    摘要翻译： 提供了具有光学片的光学片和背光组件的实施例。 光学片可以包括主体，多个突起和多个压花部分。 身体可以形成底物。 身体的一个表面可以设置成平面形状，并且主体的另一个表面可以包括多个突起，其中突起具有三角形的横截面。 每个突起可以配置有多个压花，其可以由微透镜图案形成。

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 失效
    半导体封装及其制造方法

    公开(公告)号：US20070249095A1

    公开(公告)日：2007-10-25

    申请号：US11769489

    申请日：2007-06-27

    申请人： Moon Song ,  Dong Kim ,  Jin Ryu

    发明人： Moon Song ,  Dong Kim ,  Jin Ryu

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/3114 ,  H01L24/10 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    摘要： Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter attached on the pad electrodes of the wafer by means of a bonding agent, terminals electrically connected to the pad electrodes, respectively, in via holes formed at the other side surface of the wafer, which is opposite to the pad electrodes, and bump electrodes, each of which is connected to one side of each of the terminals. The present invention is capable of minimizing the size of a semiconductor package having an image sensor, which is referred to as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), through the application of a wafer level package technology, thereby reducing the manufacturing costs of the semiconductor package and accomplishing production on a large scale.

    摘要翻译： 本文公开了用于数字光学仪器的半导体封装及其制造方法。 半导体封装包括由硅材料制成的晶片，并且在其一个侧表面上形成有焊盘电极，IR滤光器通过粘结剂分别附着在晶片的焊盘电极上，分别与焊盘电极电连接， 在与晶片电极相对的晶片的另一侧表面上形成的通孔以及每个端子的一侧连接的凸起电极。 通过采用晶片级封装技术，本发明能够使具有图像传感器（称为互补金属氧化物半导体（CMOS）或电荷耦合器件（CCD））的半导体封装的尺寸最小化， 从而降低半导体封装的制造成本并大量实现生产。