摘要:
Disclosed herein is a laminated filter with improved stop band attenuation, which is adopted in devices using a radio frequency, such as communication systems and/or broadcasting systems. The laminated filter forms cross capacitive coupling as feeding lines of input lead and/or output lead are coupled to a resonator pattern, and enhances an attenuation characteristic of stop band. Also, the laminated filter is minimized if feeding lines of the input lead and output lead are aligned in different layers, and the positions of the attenuation poles are easily controlled by adjusting the feeding line length.
摘要:
Provided herein is a plasma display panel. The plasma display panel comprises a front substrate, a rear substrate opposite to the front substrate and having address electrodes formed thereon, a lattice-shaped partition wall formed between the front substrate and the rear substrate, a phosphor applied to a discharge space partitioned by the partition wall, and a plurality of scanning electrodes and common electrodes formed in intersection regions of the partition wall and extending perpendicular to the front substrate. The plasma display panel has a sufficient aperture ratio, and thus has enhanced light emitting efficiency. The scanning electrodes and the common electrodes formed in the intersection regions of the partition walls have a vertical construction, thereby effectively preventing the phosphor from being damaged by the plasma. Discharge uniformly occurs at the outer periphery of the discharge cell, thereby inducing effective excitation of the phosphor.
摘要:
There is provided a method of manufacturing a multilayer ceramic circuit board. A multilayer ceramic circuit board according to an aspect of the invention may include: preparing a plurality of ceramic green sheets; forming a recess having a desired line shape and a via hole connected to the recess in at least one of the plurality of ceramic green sheets; forming a conductive via by filling the via hole with a conductive material; forming a circuit line connected to the conductive via by filling the recess with a conductive material; stacking the plurality of ceramic green sheets upon one another to thereby form a ceramic green sheet stack; and sintering the ceramic green sheet stack.
摘要:
Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of fired ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.
摘要:
There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin.
摘要:
There are provided a multi layer circuit board and a method of manufacturing the same. The multi layer circuit board includes each of ceramic boards having wiring patterns formed and stacked thereon; and via electrodes connecting in series the wiring patterns formed in the each of the ceramic boards, wherein one of the via electrodes is formed as a via group including a plurality of via units which connect in parallel one catch pad formed on one ceramic board and another catch pad formed on ceramic boards adjacent to the one ceramic board. Since the ceramic boards are connected through the plurality of via units, the reliability of the electrical connectivity of the via electrode may be improved, and the formation of a void and the protrusion of the via electrode may be prevented.
摘要:
There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.
摘要:
There is provided a probe card, including: a substrate having a plurality of grooves formed in one surface thereof; and at least one probe pin having a plurality of substrate combining protrusions formed on one surface thereof and corresponding to the plurality of grooves, the plurality of substrate combining protrusions having heights corresponding to the plurality of grooves.
摘要:
Disclosed herein are a multilayer ceramic substrate and a method for manufacturing the same. In a method for manufacturing the multilayer ceramic substrate, which has a ceramic laminate including multiple ceramic layers and allowing interconnection between layers through vias respectively formed in the multiple ceramic layers, the method includes: preparing a ceramic laminate in which a void is formed around a via in at least one ceramic layer of multiple ceramic layers; immersing the ceramic laminate in a precipitating bath in which an electrode solution is contained; putting the ceramic laminate out of the precipitating bath after a predetermined period of time, and then removing a nanoparticle film stacked on a surface of a multilayer ceramic substrate; and applying heat to the multilayer ceramic substrate to form nanoparticles filling an inside of the void, after the removing of the nanoparticle film.
摘要:
Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.