公开(公告)号：US20090084590A1

公开(公告)日：2009-04-02

申请号：US12188257

申请日：2008-08-08

申请人： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

发明人： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC分类号： H05K1/00

CPC分类号： H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

摘要翻译： 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

公开(公告)号：US08119923B2

公开(公告)日：2012-02-21

申请号：US12188257

申请日：2008-08-08

申请人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

发明人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC分类号： H05K1/00 ,  B32B9/00

CPC分类号： H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

摘要翻译： 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

公开(公告)号：US20070289706A1

公开(公告)日：2007-12-20

申请号：US11649203

申请日：2007-01-04

申请人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

发明人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

IPC分类号： C09J5/06

CPC分类号： H05K3/4614 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T29/49117

摘要： A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

摘要翻译： 一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成， 金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

公开(公告)号：US07943001B2

公开(公告)日：2011-05-17

申请号：US11649203

申请日：2007-01-04

申请人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

发明人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

IPC分类号： H04K3/34

CPC分类号： H05K3/4614 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T29/49117

摘要： A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

摘要翻译： 一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成， 金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

公开(公告)号：US08152953B2

公开(公告)日：2012-04-10

申请号：US12365279

申请日：2009-02-04

申请人： Hideaki Yoshimura ,  Takashi Nakagawa ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi

发明人： Hideaki Yoshimura ,  Takashi Nakagawa ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi

IPC分类号： B32B37/12

CPC分类号： H05K3/321 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0218 ,  H05K2201/0323 ,  H05K2201/0361 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/061

摘要： The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.

摘要翻译： 响应于粘合片的软化，第一支撑体被压靠在第二支撑体上。 允许填料在第一导电焊盘和第二导电焊盘之间彼此可靠地接触。 粘合片软化后，填料熔化。 金属间化合物形成在填料和导电性焊盘之间以及填料之间。 电连接以这种方式建立在第一导电焊盘和第二导电焊盘之间。 然后将基质材料和粘合片固化。 第一支撑体和第二支撑体彼此牢固地接合。

公开(公告)号：US20110100690A1

公开(公告)日：2011-05-05

申请号：US12915786

申请日：2010-10-29

申请人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi ,  Hiroki Ikeda ,  Katsu Yanagimoto

发明人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi ,  Hiroki Ikeda ,  Katsu Yanagimoto

IPC分类号： H05K1/02 ,  B32B15/08 ,  B23K35/12 ,  H01B1/02 ,  B23K31/02

CPC分类号： H05K3/4614 ,  H01B1/02 ,  H01B1/026 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K1/186 ,  H05K3/1216 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4069 ,  H05K3/4647 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/10992 ,  Y10T428/31678 ,  H01L2924/00

摘要： An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.

摘要翻译： 导电体包括：第一导电材料; 第二导电材料; 以及至少用于导电的将第一导电材料接合到第二导电材料的接合材料。 接合材料由含有铜 - 锡基金属间化合物相和锡 - 铋相的金属结构制成，铜 - 锡基金属间化合物相在第一导电材料和第二导电材料之间连续，锡 - 铋 相被铜 - 锡基金属间化合物相包围。

公开(公告)号：US20100014254A1

公开(公告)日：2010-01-21

申请号：US12461867

申请日：2009-08-26

申请人： Kenji Fukuzono ,  Hideaki Yoshimura

发明人： Kenji Fukuzono ,  Hideaki Yoshimura

IPC分类号： H05K7/20 ,  H01L23/48 ,  H01L23/36

CPC分类号： H01L23/4006 ,  H01L21/10 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/433 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/0401

摘要： A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism.

摘要翻译： 一种端子凸块组，包括内嵌在封装基板前表面上的直立的第一棱镜中的最外凸块排。 导热构件与半导体元件的表面接触。 导热构件向外延伸超过半导体元件的轮廓。 在半导体元件的轮廓外部的导热构件和封装基板之间插入加强构件。 加强构件在预定的接合区域结合到封装基板的前表面。 预定的结合区域从封装基板的外周向内延伸超过封装基板的前表面。 第二棱镜直立在第一棱镜内部的封装基板的前表面上，以允许最外面的凸起行包围第二棱镜。

公开(公告)号：US20060036978A1

公开(公告)日：2006-02-16

申请号：US10986135

申请日：2004-11-12

申请人： Kenji Fukuzono ,  Hideaki Yoshimura

发明人： Kenji Fukuzono ,  Hideaki Yoshimura

IPC分类号： G06F17/50 ,  G01R31/02

CPC分类号： G06F17/5068 ,  H05K3/0005 ,  H05K3/4602 ,  H05K2201/0191

摘要： A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section 22 for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section 21.

摘要翻译： 简化设计的印刷线路板以预测印刷线路板的位移量的板设计辅助装置包括：层厚度计算部21，用于通过规定的规​​则获得板的面积的平均厚度， 用于构成印刷电路板的每个层的层;以及层叠模型形成部22，用于通过层叠由层厚度计算部21计算的层厚度的层来形成简单的层叠模型。

公开(公告)号：US20080006915A1

公开(公告)日：2008-01-10

申请号：US11641718

申请日：2006-12-20

申请人： Naoaki Nakamura ,  Hideaki Yoshimura ,  Kenji Fukuzono ,  Toshihisa Sato

发明人： Naoaki Nakamura ,  Hideaki Yoshimura ,  Kenji Fukuzono ,  Toshihisa Sato

IPC分类号： H01L23/495

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83104 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor package provided with a heat radiator achieving a further improvement of reliability by reducing an influence of thermal stress. For this purpose, the heat radiator is formed by a heat radiator comprised of a heat radiation plate plus a box shaped part and comprised so that the entire semiconductor chip is enclosed in this box shaped part together with a board via a metallic bonding material.

摘要翻译： 具有散热器的半导体封装件通过减少热应力的影响而进一步提高可靠性。 为此，散热器由散热板和盒状部件构成的散热片形成，并且包含半导体芯片整体通过金属接合材料与基板一体地包封在该盒状部件中。

公开(公告)号：US07222316B2

公开(公告)日：2007-05-22

申请号：US10986135

申请日：2004-11-12

申请人： Kenji Fukuzono ,  Hideaki Yoshimura

发明人： Kenji Fukuzono ,  Hideaki Yoshimura

IPC分类号： G06F17/50 ,  G01R31/02

CPC分类号： G06F17/5068 ,  H05K3/0005 ,  H05K3/4602 ,  H05K2201/0191

摘要： A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section 22 for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section 21.

摘要翻译： 简化设计的印刷线路板以预测印刷线路板的位移量的板设计辅助装置包括：层厚度计算部21，用于通过规定的规​​则获得板的面积的平均厚度， 用于构成印刷电路板的每个层的层;以及层叠模型形成部22，用于通过层叠由层厚度计算部21计算的层厚度的层来形成简单的层叠模型。