公开(公告)号：US07943001B2

公开(公告)日：2011-05-17

申请号：US11649203

申请日：2007-01-04

申请人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

发明人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

IPC分类号： H04K3/34

CPC分类号： H05K3/4614 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T29/49117

摘要： A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

摘要翻译： 一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成， 金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

公开(公告)号：US20070289706A1

公开(公告)日：2007-12-20

申请号：US11649203

申请日：2007-01-04

申请人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

发明人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

IPC分类号： C09J5/06

CPC分类号： H05K3/4614 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T29/49117

摘要： A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

摘要翻译： 一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成， 金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

公开(公告)号：US08152953B2

公开(公告)日：2012-04-10

申请号：US12365279

申请日：2009-02-04

申请人： Hideaki Yoshimura ,  Takashi Nakagawa ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi

发明人： Hideaki Yoshimura ,  Takashi Nakagawa ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi

IPC分类号： B32B37/12

CPC分类号： H05K3/321 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0218 ,  H05K2201/0323 ,  H05K2201/0361 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/061

摘要： The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.

摘要翻译： 响应于粘合片的软化，第一支撑体被压靠在第二支撑体上。 允许填料在第一导电焊盘和第二导电焊盘之间彼此可靠地接触。 粘合片软化后，填料熔化。 金属间化合物形成在填料和导电性焊盘之间以及填料之间。 电连接以这种方式建立在第一导电焊盘和第二导电焊盘之间。 然后将基质材料和粘合片固化。 第一支撑体和第二支撑体彼此牢固地接合。

公开(公告)号：US20110100690A1

公开(公告)日：2011-05-05

申请号：US12915786

申请日：2010-10-29

申请人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi ,  Hiroki Ikeda ,  Katsu Yanagimoto

发明人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi ,  Hiroki Ikeda ,  Katsu Yanagimoto

IPC分类号： H05K1/02 ,  B32B15/08 ,  B23K35/12 ,  H01B1/02 ,  B23K31/02

CPC分类号： H05K3/4614 ,  H01B1/02 ,  H01B1/026 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K1/186 ,  H05K3/1216 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4069 ,  H05K3/4647 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/10992 ,  Y10T428/31678 ,  H01L2924/00

摘要： An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.

摘要翻译： 导电体包括：第一导电材料; 第二导电材料; 以及至少用于导电的将第一导电材料接合到第二导电材料的接合材料。 接合材料由含有铜 - 锡基金属间化合物相和锡 - 铋相的金属结构制成，铜 - 锡基金属间化合物相在第一导电材料和第二导电材料之间连续，锡 - 铋 相被铜 - 锡基金属间化合物相包围。

公开(公告)号：US06869822B2

公开(公告)日：2005-03-22

申请号：US10105287

申请日：2002-03-26

申请人： Tomohisa Yagi ,  Nobuhiro Imaizumi ,  Yasuhiro Usui ,  Kenji Fukuzono

发明人： Tomohisa Yagi ,  Nobuhiro Imaizumi ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/12 ,  H01L23/498 ,  H01L21/44

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512

摘要： According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.

摘要翻译： 根据制造半导体器件的方法，通过倒装芯片接合，半导体芯片通过凸块接合到基板。 然后，将密封粘合剂组合物装载在半导体芯片和基板之间以提供粘合剂密封。 能够两阶段硬化的密封粘合剂组合物至少含有第一主要树脂成分，第二主要树脂成分和硬化剂。 然后，加热粘合剂密封件进行一次硬化。 然后，将基板放置在母板上，其中焊料材料插入在基板和母板之间。 最后，将粘合剂密封加热以进行二次硬化，同时将焊料回流焊接到母板上。

公开(公告)号：US20050110169A1

公开(公告)日：2005-05-26

申请号：US11019617

申请日：2004-12-23

申请人： Tomohisa Yagi ,  Nobuhiro Imaizumi ,  Yasuhiro Usui ,  Kenji Fukuzono

发明人： Tomohisa Yagi ,  Nobuhiro Imaizumi ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/12 ,  H01L23/498 ,  H01L23/495

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512

摘要： According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.

摘要翻译： 根据制造半导体器件的方法，通过倒装芯片接合，半导体芯片通过凸块接合到基板。 然后，在半导体芯片和基板之间加载密封粘合剂组合物以提供粘合剂密封。 能够两阶段硬化的密封粘合剂组合物至少含有第一主要树脂成分，第二主要树脂成分和硬化剂。 然后，加热粘合剂密封件进行一次硬化。 然后，将基板放置在母板上，其中焊料材料插入在基板和母板之间。 最后，将粘合剂密封加热以进行二次硬化，同时将焊料回流焊接到母板上。

公开(公告)号：US06790881B2

公开(公告)日：2004-09-14

申请号：US10254538

申请日：2002-09-26

申请人： Hiroaki Date ,  Tomohisa Yagi ,  Makoto Sasaki ,  Hideshi Tokuhira ,  Nobuhiro Imaizumi

发明人： Hiroaki Date ,  Tomohisa Yagi ,  Makoto Sasaki ,  Hideshi Tokuhira ,  Nobuhiro Imaizumi

IPC分类号： C08K716

CPC分类号： C09J11/06

摘要： A single-liquid type adhesive composition contains a main agent, an imidazole serving as a hardener, and a hardening promoter for increased hardening speed. The imidazole has its surface covered by a thermoplastic resin, and the hardening promoter is provided by a modified imidazole composition with its imino group (—NH—) having the H replaced by a specific reaction retarder group.

摘要翻译： 单液型粘合剂组合物含有主剂，用作固化剂的咪唑和用于提高硬化速度的硬化促进剂。 咪唑的表面被热塑性树脂覆盖，并且硬化促进剂由改性咪唑组合物提供，其亚氨基（-NH-）具有被特定的反应延迟剂基取代的H。

公开(公告)号：US20050001014A1

公开(公告)日：2005-01-06

申请号：US10816915

申请日：2004-04-05

申请人： Shuichi Takeuchi ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Hiroshi Kobayashi ,  Takayoshi Matsumura ,  Shigeo Matsunuma ,  Tomohisa Yagi

发明人： Shuichi Takeuchi ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Hiroshi Kobayashi ,  Takayoshi Matsumura ,  Shigeo Matsunuma ,  Tomohisa Yagi

IPC分类号： B23K1/00 ,  B23K1/06 ,  B23K1/20 ,  B23K3/06 ,  H01L21/56 ,  H01L21/60 ,  H01L21/607 ,  H05K3/32 ,  H05K3/34 ,  B23K20/10 ,  B23K31/02

CPC分类号： H01L21/563 ,  B23K1/0016 ,  B23K1/06 ,  B23K1/203 ,  B23K3/0607 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/328 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2224/05599

摘要： The method of mounting an electronic part is capable of securely mounting the electronic part having fine solder bumps without excessively heating the part. The method of comprises the steps of: applying flux-fill, which acts as flux and under-filling resin, on a surface of a mount board, in which electrodes are formed; respectively connecting solder bums of the electronic part with the electrodes; and simultaneously filling a gap between the electronic part and the mount board with the flux-fill, wherein the solder bumps are made contact with the electrodes, and ultrasonic vibration energy is applied to contact portions of the solder bumps and the electrodes in the connecting step.

摘要翻译： 安装电子部件的方法能够牢固地安装具有细焊锡凸块的电子部件，而不会过度加热该部件。 所述方法包括以下步骤：在其中形成电极的安装板的表面上施加用作助熔剂和未充填树脂的焊剂填充物; 分别将电子部件的焊料焊接与电极连接; 并且同时用助焊剂填充电子部件和安装板之间的间隙，其中焊料凸块与电极接触，并且在连接步骤中将超声波振动能量施加到焊料凸块和电极的接触部分 。

公开(公告)号：US08725378B2

公开(公告)日：2014-05-13

申请号：US13555238

申请日：2012-07-23

申请人： Taku Nakamura ,  Tomohisa Yagi

发明人： Taku Nakamura ,  Tomohisa Yagi

IPC分类号： B60T8/72 ,  B60T8/32

CPC分类号： B60T8/32 ,  F02D11/105 ,  F02D41/021 ,  F02D2200/60 ,  F02D2250/26

摘要： A control system for a vehicle restricts engine torque when an accelerator operation amount is large and it is determined that the direction of the driver's face changed between forward and backward of the vehicle.

摘要翻译： 车辆的控制系统在加速器操作量大的情况下限制发动机转矩，并且确定驾驶员的车身方向在车辆的前后方向之间变化。

公开(公告)号：US20130030669A1

公开(公告)日：2013-01-31

申请号：US13555238

申请日：2012-07-23

申请人： Taku Nakamura ,  Tomohisa Yagi

发明人： Taku Nakamura ,  Tomohisa Yagi

IPC分类号： G06F7/00

CPC分类号： B60T8/32 ,  F02D11/105 ,  F02D41/021 ,  F02D2200/60 ,  F02D2250/26

摘要： A control system for a vehicle restricts engine torque when an accelerator operation amount is large and it is determined that the direction of the driver's face changed between forward and backward of the vehicle.

摘要翻译： 车辆的控制系统在加速器操作量大的情况下限制发动机转矩，并且确定驾驶员的车身方向在车辆的前后方向之间变化。