公开(公告)号：US06992006B2

公开(公告)日：2006-01-31

申请号：US10922951

申请日：2004-08-23

申请人： Hideki Otsuka ,  Tsuyoshi Miyata ,  Muneyuki Matsumoto ,  Hiroshi Kawano

发明人： Hideki Otsuka ,  Tsuyoshi Miyata ,  Muneyuki Matsumoto ,  Hiroshi Kawano

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/02074 ,  H01L21/3212 ,  H01L21/32134 ,  H01L21/7684

摘要： The present invention provides a method for fabricating a semiconductor device which initially performs chemical mechanical polishing with respect to a metal film made of copper formed on a semiconductor substrate to form wires composed of the metal film on the semiconductor substrate and subsequently removes a wire-to-wire bridge occurring during the formation of the wires and remaining on the semiconductor substrate to cause unneeded conduction between the wires adjacent to each other. The removal of the wire-to-wire bridge is performed by oxidizing the wire-to-wire bridge into a copper oxide by using an aqueous hydrogen peroxide and then dissolving the copper oxide by using an oxalic acid. This allows the removal of the wire-to-wire bridge without damaging the main bodies of the wires.

摘要翻译： 本发明提供一种制造半导体器件的方法，该半导体器件最初对形成在半导体衬底上的由铜制成的金属膜进行化学机械抛光，以形成由半导体衬底上的金属膜构成的导线， 在电线形成期间发生并且保留在半导体衬底上以在彼此相邻的导线之间引起不必要的导通。 线对线桥的去除通过使用过氧化氢水溶液将线对线桥氧化成氧化铜，然后使用草酸溶解氧化铜来进行。 这允许去除线对线桥而不损坏导线的主体。

公开(公告)号：US20050048777A1

公开(公告)日：2005-03-03

申请号：US10922951

申请日：2004-08-23

申请人： Hideki Otsuka ,  Tsuyoshi Miyata ,  Muneyuki Matsumoto ,  Hiroshi Kawano

发明人： Hideki Otsuka ,  Tsuyoshi Miyata ,  Muneyuki Matsumoto ,  Hiroshi Kawano

IPC分类号： H01L21/306 ,  H01L21/02 ,  H01L21/28 ,  H01L21/304 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/768 ,  H01L21/44

CPC分类号： H01L21/02074 ,  H01L21/3212 ,  H01L21/32134 ,  H01L21/7684

摘要： The present invention provides a method for fabricating a semiconductor device which initially performs chemical mechanical polishing with respect to a metal film made of copper formed on a semiconductor substrate to form wires composed of the metal film on the semiconductor substrate and subsequently removes a wire-to-wire bridge occurring during the formation of the wires and remaining on the semiconductor substrate to cause unneeded conduction between the wires adjacent to each other. The removal of the wire-to-wire bridge is performed by oxidizing the wire-to-wire bridge into a copper oxide by using an aqueous hydrogen peroxide and then dissolving the copper oxide by using an oxalic acid. This allows the removal of the wire-to-wire bridge without damaging the main bodies of the wires.

摘要翻译： 本发明提供一种制造半导体器件的方法，该半导体器件最初对形成在半导体衬底上的由铜制成的金属膜进行化学机械抛光，以形成由半导体衬底上的金属膜构成的导线， 在电线形成期间发生并且保留在半导体衬底上以在彼此相邻的导线之间引起不必要的导通。 线对线桥的去除通过使用过氧化氢水溶液将线对线桥氧化成氧化铜，然后使用草酸溶解氧化铜来进行。 这允许去除线对线桥而不损坏导线的主体。

公开(公告)号：US08585421B2

公开(公告)日：2013-11-19

申请号：US13258271

申请日：2010-03-05

申请人： Yasuhiro Yamaguchi ,  Nobuaki Yoshioka ,  Sakai Yagi ,  Sachiko Yagome ,  Hiroshi Kawano ,  Yuichiro Matsumoto

发明人： Yasuhiro Yamaguchi ,  Nobuaki Yoshioka ,  Sakai Yagi ,  Sachiko Yagome ,  Hiroshi Kawano ,  Yuichiro Matsumoto

IPC分类号： H01R13/64

CPC分类号： H01R13/6315 ,  H01R13/05 ,  H01R13/514

摘要： A connector 1 includes: a terminal 2; an inner housing 5; and an outer housing 30 receiving the terminal 2 and the inner housing 5. The terminal 2 is provided with a first electric connecting part 21 received and held in the inner housing 5 and electrically connected to the mating connector, a second electric connecting part 22, and a flexible coupling part 23 made of conductive material, movably coupling and electrically connecting the first electric connecting part 21 and the second electric connecting part 22. The outer housing 30 is provided with a receiving part 36 movably receiving the inner housing 5 which receives the first electric connecting part 21, and a fixing part 35 to which the second electric connecting part 22 is fixed.

摘要翻译： 连接器1包括：端子2; 内壳5; 以及接收端子2和内壳体5的外壳体30.端子2设置有容纳并保持在内壳体5中并与配合连接器电连接的第一电连接部件21，第二电连接部件22， 以及由导电材料制成的柔性联接部件23，可移动地联接并电连接第一电连接部件21和第二电连接部件22.外壳体30设置有可移动地接纳内壳体5的接收部分36， 第一电连接部21和固定第二电连接部22的固定部35。

公开(公告)号：USD683285S1

公开(公告)日：2013-05-28

申请号：US29414236

申请日：2012-02-27

申请人： Minoru Yoshida ,  Hiroshi Kawano ,  Masanobu Ino ,  Patrick Reimer ,  Marc Cogswell

设计人： Minoru Yoshida ,  Hiroshi Kawano ,  Masanobu Ino ,  Patrick Reimer ,  Marc Cogswell

公开(公告)号：USD682753S1

公开(公告)日：2013-05-21

申请号：US29414230

申请日：2012-02-27

申请人： Minoru Yoshida ,  Hiroshi Kawano ,  Masanobu Ino ,  Patrick Reimer ,  Marc Cogswell

设计人： Minoru Yoshida ,  Hiroshi Kawano ,  Masanobu Ino ,  Patrick Reimer ,  Marc Cogswell

公开(公告)号：US20120017042A1

公开(公告)日：2012-01-19

申请号：US12918608

申请日：2010-07-16

申请人： Yuko Matsui ,  Hiroshi Kawano ,  Shigeo Homma ,  Masayuki Yamamoto

发明人： Yuko Matsui ,  Hiroshi Kawano ,  Shigeo Homma ,  Masayuki Yamamoto

IPC分类号： G06F12/08

CPC分类号： G06F3/0689 ,  G06F3/0608 ,  G06F3/061 ,  G06F3/0619 ,  G06F3/0635 ,  G06F3/0647 ,  G06F3/0658 ,  G06F3/0665 ,  G06F3/0685 ,  G06F12/023 ,  G06F12/08 ,  G06F12/0813 ,  G06F2206/1012

摘要： A storage system has multiple disk controller (DKC) units that are coupled to one another in accordance with a coupling mode that satisfies the following (a1) through (a3): (a1) One DKC inside one DKC unit and one DKC inside another DKC unit are coupled via a second type of coupling medium that differs from the internal bus of the DKC and has a longer maximum communication distance than a first type of coupling medium, which is the same type of coupling medium as the internal bus of the DKC; (a2) the one DKC unit virtualizes a logical volume of the other DKC unit and provides this virtualized logical volume to host(s) coupled to the one DKC unit; and (a3) the other DKC unit virtualizes a logical volume of the DKC unit and provides this virtualized logical volume to host(s) coupled to the other DKC unit.

摘要翻译： 存储系统具有根据满足以下（a1）至（a3）的耦合模式彼此耦合的多个盘控制器（DKC）：（a1）一个DKC单元内的一个DKC和另一个DKC内的一个DKC 单元通过与DKC的内部总线不同的第二类型的耦合介质耦合，并且具有比与DKC的内部总线相同类型的耦合介质的第一类耦合介质的更长的最大通信距离; （a2）一个DKC单元虚拟化另一DKC单元的逻辑卷，并将该虚拟化逻辑卷提供给耦合到该DKC单元的主机; 和（a3）另一个DKC单元虚拟化DKC单元的逻辑卷并将该虚拟化逻辑卷提供给耦合到另一个DKC单元的主机。

公开(公告)号：US20090229846A1

公开(公告)日：2009-09-17

申请号：US12426982

申请日：2009-04-21

申请人： Hiroshi Kawano ,  Tatsuya Hirahara

发明人： Hiroshi Kawano ,  Tatsuya Hirahara

IPC分类号： B25B21/00

CPC分类号： B25B21/00 ,  B23P19/06 ,  B23P19/065 ,  B25B23/0085 ,  B25B23/12 ,  F16B23/00 ,  F16B31/04 ,  F16B39/26 ,  F16B43/00

摘要： To provide a screw fastening device that, when performing a screw tightening operation, can substantially reduce the running torque directly applied by external force to a screw driving device.A characteristic constitution is adopted that is equips a screw driving device α2 with a device body 1 that stacks a plurality of piezoelectric elements 3 and 4 that generate predetermined ultrasonic oscillations with the application of a predetermined AC voltage and excites mechanical oscillations in a predetermined direction on an oscillating end surface 1a based on the ultrasonic oscillations; and a male distal end portion 21 that is correspondingly formed to be capable of fitting in a female recess 103 formed in a screw β1 and integrally fixed to the device body 1 on the oscillating end surface 1a of the device body 1 to impart running torque, which is directly applied to the screw driving device α2 by external force, and transmit the mechanical oscillations in the predetermined direction that the device body 1 excites to the screw β1, with which contact is made by fitting in the female recess 103.

公开(公告)号：US20090208308A1

公开(公告)日：2009-08-20

申请号：US12430949

申请日：2009-04-28

申请人： Hiroshi Kawano ,  Tatsuya Hirahara

发明人： Hiroshi Kawano ,  Tatsuya Hirahara

IPC分类号： F16B39/24

CPC分类号： B25B21/00 ,  B23P19/06 ,  B23P19/065 ,  B25B23/0085 ,  B25B23/12 ,  F16B23/00 ,  F16B31/04 ,  F16B39/26 ,  F16B43/00

摘要： To provide a screw fastening device that, when performing a screw tightening operation, can substantially reduce the running torque directly applied by external force to a screw driving device.A characteristic constitution is adopted that is equips a screw driving device α2 with a device body 1 that stacks a plurality of piezoelectric elements 3 and 4 that generate predetermined ultrasonic oscillations with the application of a predetermined AC voltage and excites mechanical oscillations in a predetermined direction on an oscillating end surface 1a based on the ultrasonic oscillations; and a male distal end portion 21 that is correspondingly formed to be capable of fitting in a female recess 103 formed in a screw β1 and integrally fixed to the device body 1 on the oscillating end surface 1a of the device body 1 to impart running torque, which is directly applied to the screw driving device α2 by external force, and transmit the mechanical oscillations in the predetermined direction that the device body 1 excites to the screw β1, with which contact is made by fitting in the female recess 103.

摘要翻译： 为了提供螺钉紧固装置，当执行螺钉紧固操作时，可以将通过外力直接施加的行驶扭矩显着地减小到螺丝驱动装置。 采用一种特征构造，其装备有螺旋驱动装置α2的装置主体1，其堆叠多个压电元件3和4，其通过施加预定的AC电压产生预定的超声波振荡，并且以预定方向激励机械振荡 基于超声波振荡的振荡端面1a; 和相应地形成为能够装配在形成为螺钉β1的阴凹槽103中并且一体地固定到装置主体1的装置主体1的摆动端面1a上以赋予运行转矩的阳极远端部21， 其通过外力直接施加到螺钉驱动装置α2，并且以装置主体1激励到预定方向的机械振动传递到螺钉β1，螺钉β1通过装配在凹槽103中而进行接触。

公开(公告)号：US20060173964A1

公开(公告)日：2006-08-03

申请号：US11236467

申请日：2005-09-27

申请人： Junichi Oohama ,  Hiroshi Kawano

发明人： Junichi Oohama ,  Hiroshi Kawano

IPC分类号： G06F15/16

CPC分类号： H04L51/28 ,  H04L29/12009 ,  H04L29/12594 ,  H04L51/066 ,  H04L51/12 ,  H04L61/301 ,  H04L61/303 ,  H04L67/04

摘要： A communication terminal device and a method for controlling the same which can operate a mail restriction function effectively without increasing a mail address registered for the mail restriction function are provided. The transmission and the reception of the mail is restricted by storing by a domain conversion table a corresponding relationship between an original domain by the automatic address conversion unit and the domain after the conversion, acquiring by the original domain acquiring unit the original domain based on the domain of the mail address converted by the automatic address conversion unit by referring to the domain conversion table, and controlling by the mail transmission and reception control means the transmission and the reception of the mail by comparing the mail address replaced with the domain of the mail address of the transmitting/receiving mail by the original domain acquired by the original domain acquiring unit with the registered mail address.

摘要翻译： 提供了一种通信终端设备及其控制方法，其可以有效地操作邮件限制功能，而不增加为邮件限制功能注册的邮件地址。 通过域转换表存储由自动地址转换单元的原始域与转换后的域之间的对应关系来限制邮件的发送和接收，由原始域获取单元基于原始域获取原始域， 通过参考域转换表由自动地址转换单元转换的邮件地址的域，并且通过邮件发送和接收控制装置来控制邮件的发送和接收，通过比较邮件地址替换为邮件的域 由原始域获取单元获得的原始域的发送/接收邮件的地址与登记的邮件地址。

公开(公告)号：US6002181A

公开(公告)日：1999-12-14

申请号：US551917

申请日：1995-10-23

申请人： Etsuo Yamada ,  Yasushi Shiraishi ,  Hiroshi Kawano ,  Shinji Ohuchi ,  Hidekazu Nasu

发明人： Etsuo Yamada ,  Yasushi Shiraishi ,  Hiroshi Kawano ,  Shinji Ohuchi ,  Hidekazu Nasu

IPC分类号： H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L23/3107 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/4951 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165

摘要： A resin molded type semiconductor device has an inner portion sandwiched between two outer surfaces. The device includes a chip support with a first, inwardly facing surface and a second, outwardly facing surface. The device also includes a semiconductor element with a first, inwardly facing surface and a second, outwardly facing surface. The respective first surfaces of the chip support and semiconductor element are fixed to each other. A mold resin is provided to seal the entire semiconductor device except for the respective second surfaces of the chip support and semiconductor element which remain exposed as part of the two outer surfaces of the device, in order to keep the semiconductor device thin.

摘要翻译： 树脂模制型半导体器件具有夹在两个外表面之间的内部部分。 该装置包括具有第一面向内的表面和第二向外表面的芯片支撑件。 该装置还包括具有第一面向内的表面和第二向外表面的半导体元件。 芯片支撑体和半导体元件的各个第一表面彼此固定。 为了保持半导体器件的薄型化，提供了一种模制树脂来密封整个半导体器件，除了作为器件的两个外表面的一部分而保持暴露的芯片支撑件和半导体元件的相应的第二表面之外。