公开(公告)号：US4213810A

公开(公告)日：1980-07-22

申请号：US35823

申请日：1979-05-04

申请人： Hinrich Heynisch ,  Hans Krueger

发明人： Hinrich Heynisch ,  Hans Krueger

IPC分类号： G02F1/1335 ,  G02F1/1337 ,  C09K3/34 ,  G02F1/13

CPC分类号： G02F1/133528 ,  G02F1/1337

摘要： An orientation layer for liquid crystal displays and a method for its construction is provided. Ultrasonic waves are used to create a flat, stationary wave field which is used to direct the deposition of material in order form parallel ridges and associated grooves on an orientation layer in order to orient the liquid crystals. Where the ridges are composed of a conductive or dichroitic material and the grooves have an interval which approximately corresponds to one half of the wavelength of the illuminating light, the orientation layer both orients the liquid crystals and functions as a grid polarizer.

摘要翻译： 提供了一种用于液晶显示器的取向层及其构造方法。 使用超声波来产生平坦的固定波场，其用于引导材料的沉积，以便在取向层上形成平行的脊和相关的凹槽，以便定向液晶。 在脊由导电或二向色材料构成并且凹槽具有大致对应于照明光的波长的一半的间隔的情况下，取向层既定向液晶又起到栅极偏振器的作用。

公开(公告)号：US4756001A

公开(公告)日：1988-07-05

申请号：US898120

申请日：1986-08-20

申请人： Hinrich Heynisch ,  Klemens Hubner ,  Erwin Hubner ,  Hans Krueger ,  Hans Golser

发明人： Hinrich Heynisch ,  Klemens Hubner ,  Erwin Hubner ,  Hans Krueger ,  Hans Golser

IPC分类号： H01S3/04 ,  H01S3/032 ,  H01S3/041 ,  H01S3/03

CPC分类号： H01S3/041

摘要： In an ion laser having a discharge channel extending through a ceramic tube, a coil of thermal conductive material is placed around the ceramic tube and the tube and coil combination are inserted into a bore of a heat eliminating device. The tube, coil, and heat eliminating device are soldered to one another so as to provide clearance between individual turns of the coil, thereby providing good cooling characteristics and enhanced power of the laser without risk of breakage of the ceramic tube.

摘要翻译： 在具有延伸穿过陶瓷管的放电通道的离子激光器中，将导热材料的线圈放置在陶瓷管周围，并将管和线圈组合插入散热装置的孔中。 管，线圈和除热装置彼此焊接，以便在线圈的各个匝之间提供间隙，从而提供良好的冷却特性和增强的激光功率，而不会损坏陶瓷管的破损。

公开(公告)号：US08865499B2

公开(公告)日：2014-10-21

申请号：US13805630

申请日：2011-07-07

申请人： Wolfgang Pahl ,  Hans Krueger ,  Gregor Feiertag ,  Alois Stelzl ,  Anton Leidl ,  Stefan Seitz

发明人： Wolfgang Pahl ,  Hans Krueger ,  Gregor Feiertag ,  Alois Stelzl ,  Anton Leidl ,  Stefan Seitz

IPC分类号： H01L21/00

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2207/096 ,  B81C1/00309 ,  H01L2224/16225 ,  H01L2924/15151 ,  H01L2924/16151 ,  H04R1/086 ,  H04R1/38 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R31/006

摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.

摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中换能器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（S01）; 进行麦克风的功能测试; 第一声​​音入口（S01）关闭; 并且在盖中产生第二声音入口（S02）。 本发明还涉及由该方法产生的麦克风，其中第一声音入口开口（S01）准备但关闭。

公开(公告)号：US08759677B2

公开(公告)日：2014-06-24

申请号：US12993299

申请日：2009-05-26

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

IPC分类号： H01J5/00 ,  H01J15/00 ,  H05K5/06 ,  H05H1/00 ,  H05K7/00 ,  H05K7/10 ,  H05K7/12

CPC分类号： H01L23/06 ,  B81B7/0077 ,  B81C2203/0136 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/00

摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).

摘要翻译： 施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。 可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。

公开(公告)号：US20120159778A1

公开(公告)日：2012-06-28

申请号：US13330422

申请日：2011-12-19

申请人： Hans Krueger ,  Alexander Schmajew ,  Alois Stelzl

发明人： Hans Krueger ,  Alexander Schmajew ,  Alois Stelzl

IPC分类号： H05K3/36

CPC分类号： H01L24/94 ,  B81B7/007 ,  B81B2207/098 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24147 ,  H01L2224/24991 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1068 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49126 ,  H01L2224/81 ,  H01L2224/82

摘要： A plurality of unpackaged substrates connected to one another is disclosed. The stepped structures on and/or in a first main area of a first substrate include a plurality of integrated circuits. The stepped structures run between the integrated circuits. The first conductor tracks extend from at least some contact connections of the respective integrated circuits as far as the stepped structures. The first substrate is connected on the side of the first main area to a further substrate. The first substrate is severed from a second main area opposite to the first main area such that the first substrate is divided into a plurality of substrate pieces. Each substrate piece has one of the integrated circuits. The first conductor tracks are accessible in interspaces between the substrate pieces. The second conductor tracks are formed from the second main area. At least some of the second conductor tracks lead from the second main area over side walls of the substrate pieces as far as the first conductor tracks.

摘要翻译： 公开了彼此连接的多个未封装的基板。 第一基板的第一主区域和/或第一主区域中的阶梯结构包括多个集成电路。 阶梯式结构在集成电路之间运行。 第一导体轨道从各个集成电路的至少一些接触连接延伸到阶梯式结构。 第一基板在第一主区域的一侧连接到另一基板。 第一基板从与第一主区域相对的第二主区域切断，使得第一基板被分成多个基板块。 每个衬底片具有一个集成电路。 第一导体轨迹可在基片之间的间隙中接近。 第二导体轨道由第二主区域形成。 至少一些第二导体轨道从第二主区域超过衬底片的侧壁延伸，直到第一导体轨迹。

公开(公告)号：US20120061778A1

公开(公告)日：2012-03-15

申请号：US13228971

申请日：2011-09-09

申请人： Michael Gerner ,  Hans Krueger ,  Alois Stelzl

发明人： Michael Gerner ,  Hans Krueger ,  Alois Stelzl

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： B81C1/00333

摘要： A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method.

摘要翻译： 制造提供具有多个芯片部件的至少一个晶片的芯片器件。 将晶片或晶片分离成各个芯片组件和/或分组成芯片组件。 单个芯片组件和/或芯片组件组被施加到载体元件，使得在各个芯片组件和/或芯片组件组之间形成具有预定宽度的间隙。 将聚合物引入到间隙中以形成由芯片部件和聚合物基体组成的复合元件。 复合元件以这样的方式分离，即在每种情况下由芯片部件和聚合物基体的至少一个部分组成的芯片器件形成。 本发明还涉及通过该方法制造的芯片器件。

公开(公告)号：US08110962B2

公开(公告)日：2012-02-07

申请号：US12642357

申请日：2009-12-18

申请人： Christian Bauer ,  Hans Krueger ,  Werner Ruile ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Werner Ruile ,  Alois Stelzl

IPC分类号： H01L29/84

CPC分类号： H03H9/02866 ,  H03H9/14538

摘要： A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.

摘要翻译： MEMS部件包括芯片，该芯片的后侧具有小于在部件中传播的声波的中心频率处波长的十分之一的粗糙度。 用于散射体声波的金属结构设置在芯片的后侧，并且金属结构的材料与芯片的材料声学匹配。

公开(公告)号：US20110214905A1

公开(公告)日：2011-09-08

申请号：US12997867

申请日：2009-06-08

申请人： Wolfgang Pahl ,  Hans Krueger ,  Peter Demmer

发明人： Wolfgang Pahl ,  Hans Krueger ,  Peter Demmer

IPC分类号： H05K1/02 ,  H05K3/00

CPC分类号： H05K1/189 ,  H01L2224/16225 ,  H05K3/4691 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09109 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T428/24322

摘要： A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.

摘要翻译： 一种电路板，包括电路载体，由非导电材料构成的覆盖层，包括布置在电路载体上的有机物质，至少部分地布置在覆盖层上的第一金属化层，其中第一金属化层具有柔性区域 。

公开(公告)号：US20110114355A1

公开(公告)日：2011-05-19

申请号：US12993299

申请日：2009-05-26

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

IPC分类号： H05K5/06

CPC分类号： H01L23/06 ,  B81B7/0077 ,  B81C2203/0136 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/00

摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).

摘要翻译： 施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。 可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。

公开(公告)号：US20090104415A1

公开(公告)日：2009-04-23

申请号：US12258301

申请日：2008-10-24

申请人： Alexander Schmajew ,  Hans Krueger ,  Alois Stelzl

发明人： Alexander Schmajew ,  Hans Krueger ,  Alois Stelzl

IPC分类号： B32B7/06 ,  B32B3/10 ,  H01L21/311 ,  B44C1/22

CPC分类号： H01L23/544 ,  B41M5/24 ,  H01L23/3171 ,  H01L23/3192 ,  H01L2223/54406 ,  H01L2223/5448 ,  H01L2924/0002 ,  Y10T428/24802 ,  Y10T428/24893 ,  Y10T428/24901 ,  H01L2924/00

摘要： A layer combination with a marking is proposed, for example, for a miniaturized electrical component. The layer combination includes a first layer and a different release layer, which is applied on it, on which a pattern is formed by a released pattern-like area. The release area is formed from an inorganic, semiconducting, insulating material, where the pattern produced thereon is machine-readable.

摘要翻译： 提出了具有标记的层组合，例如，用于小型化电气部件。 层组合包括施加在其上的第一层和不同的剥离层，其上由释放的图案状区域形成图案。 释放区域由无机半导体绝缘材料形成，其中在其上产生的图案是机器可读的。