Pattern forming method and method for manufacturing semiconductor device
    2.
    发明申请
    Pattern forming method and method for manufacturing semiconductor device 审中-公开
    图案形成方法和半导体器件的制造方法

    公开(公告)号:US20050214695A1

    公开(公告)日:2005-09-29

    申请号:US11081579

    申请日:2005-03-17

    CPC分类号: H01L21/0337 H01L21/0275

    摘要: A pattern forming method which can suppress pattern collapse of a resist pattern comprises after developing a resist pattern formed from a resist film on a substrate, supplying a rinse agent onto the substrate to replace a developer on the substrate with the rinse agent, supplying an coating film material onto the substrate to replace at least a part of the rinse agent with the coating film material, wherein the coating film material contains a solvent and a solute different from the resist film, volatilizing the solvent in the coating film material to form an coating film covering the resist film on the substrate, removing at least a part of a surface of the coating film to expose at least a part of an upper surface of the resist pattern and form a mask pattern comprising the coating film, and processing the substrate using the mask pattern.

    摘要翻译: 可以抑制抗蚀剂图案的图案塌陷的图案形成方法包括在从基板上的抗蚀剂膜形成的抗蚀剂图案显影之后,将冲洗剂供应到基板上以用冲洗剂代替基板上的显影剂, 将薄膜材料涂覆在基材上以用涂膜材料代替至少一部分漂洗剂,其中涂膜材料含有溶剂和不同于抗蚀剂膜的溶质,挥发涂膜材料中的溶剂以形成涂层 膜,覆盖基板上的抗蚀剂膜,去除涂膜的表面的至少一部分以暴露抗蚀剂图案的上表面的至少一部分,并形成包含涂膜的掩模图案,并使用 掩模图案。

    Imprint method
    3.
    发明授权
    Imprint method 有权
    印记法

    公开(公告)号:US08419995B2

    公开(公告)日:2013-04-16

    申请号:US12563461

    申请日:2009-09-21

    IPC分类号: B28B11/08 B29C35/08

    摘要: An imprint method includes applying a light curable resin on a substrate to be processed, the substrate including first and second regions on which the light curable resin is applied, contacting an imprint mold with the light curable resin, curing the light curable resin by irradiating the light curable resin with light passing through the imprint mold, generating gas by performing a predetermined process to the light curable resin applied on a region of the substrate, the region including at least the first region, wherein an amount of gas generated from the light curable resin applied on the first region is larger than an amount of gas generated from the light curable resin of the second region, and forming a pattern by separating the imprint mold from the light curable resin after the gas being generated.

    摘要翻译: 压印方法包括将光固化树脂施加在待加工的基板上,所述基板包括施加有光固化树脂的第一和第二区域,使印模与光固化树脂接触,通过照射光固化树脂来固化光固化树脂 光固化树脂,其光通过压印模具,通过对施加在基板的区域上的光固化树脂进行预定处理产生气体,该区域至少包括第一区域,其中从光可固化 施加在第一区域上的树脂大于由第二区域的光固化树脂产生的气体的量,并且在产生气体之后通过从光固化树脂分离压印模具来形成图案。

    Substrate processing apparatus and method
    4.
    发明授权
    Substrate processing apparatus and method 失效
    基板加工装置及方法

    公开(公告)号:US07779777B2

    公开(公告)日:2010-08-24

    申请号:US12466525

    申请日:2009-05-15

    摘要: A substrate-processing apparatus includes a sample table which mounts thereon a to-be-processed substrate, a first line which supplies a chemical solution, a second line which supplies a cleaning liquid, a three-way valve connected to the first and second lines and configured to select one of the first and second lines, a filter provided across the first line upstream of the three-way valve, and configured to eliminate a foreign material from the chemical solution, and a nozzle provided downstream of the three-way valve and configured to discharge the chemical solution or the cleaning liquid when the first or second line is selected via the three-way valve. The three-way valve selects the first line when the substrate is coated with the chemical solution, and selects the second line in other cases.

    摘要翻译: 基板处理装置包括安装在被处理基板上的样品台,供给化学溶液的第一管线,供给清洗液的第二管线,与第一管路和第二管路连接的三通阀 并且构造成选择第一和第二管线中的一个,设置在三通阀上游的第一线上的过滤器,并且被配置为从化学溶液中除去异物,以及设置在三通阀下游的喷嘴 并且构造成当通过三通阀选择第一或第二管线时,排出化学溶液或清洗液体。 当基材涂有化学溶液时,三通阀选择第一行,在其他情况下选择第二行。

    IMPRINT METHOD
    5.
    发明申请
    IMPRINT METHOD 有权
    IMPRINT方法

    公开(公告)号:US20100078860A1

    公开(公告)日:2010-04-01

    申请号:US12563461

    申请日:2009-09-21

    IPC分类号: B29C35/08

    摘要: An imprint method includes applying a light curable resin on a substrate to be processed, the substrate including first and second regions on which the light curable resin is applied, contacting an imprint mold with the light curable resin, curing the light curable resin by irradiating the light curable resin with light passing through the imprint mold, generating gas by performing a predetermined process to the light curable resin applied on a region of the substrate, the region including at least the first region, wherein an amount of gas generated from the light curable resin applied on the first region is larger than an amount of gas generated from the light curable resin of the second region, and forming a pattern by separating the imprint mold from the light curable resin after the gas being generated.

    摘要翻译: 压印方法包括将光固化树脂施加在待加工的基板上,所述基板包括施加有光固化树脂的第一和第二区域,使印模与光固化树脂接触,通过照射光固化树脂来固化光固化树脂 光固化树脂,其光通过压印模具,通过对施加在基板的区域上的光固化树脂进行预定处理产生气体,该区域至少包括第一区域,其中从光可固化 施加在第一区域上的树脂大于由第二区域的光固化树脂产生的气体的量,并且在产生气体之后通过从光固化树脂分离压印模具来形成图案。

    SUBSTRATE PROCESSING APPARATUS AND METHOD
    6.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND METHOD 失效
    基板加工装置和方法

    公开(公告)号:US20090226624A1

    公开(公告)日:2009-09-10

    申请号:US12466525

    申请日:2009-05-15

    摘要: A substrate-processing apparatus includes a sample table which mounts thereon a to-be-processed substrate, a first line which supplies a chemical solution, a second line which supplies a cleaning liquid, a three-way valve connected to the first and second lines and configured to select one of the first and second lines, a filter provided across the first line upstream of the three-way valve, and configured to eliminate a foreign material from the chemical solution, and a nozzle provided downstream of the three-way valve and configured to discharge the chemical solution or the cleaning liquid when the first or second line is selected via the three-way valve. The three-way valve selects the first line when the substrate is coated with the chemical solution, and selects the second line in other cases.

    摘要翻译: 基板处理装置包括安装在被处理基板上的样品台,供给化学溶液的第一管线,供给清洗液的第二管线,与第一管路和第二管路连接的三通阀 并且构造成选择第一和第二管线中的一个,设置在三通阀上游的第一线上的过滤器,并且被配置为从化学溶液中除去异物,以及设置在三通阀下游的喷嘴 并且构造成当通过三通阀选择第一或第二管线时,排出化学溶液或清洗液体。 当基材涂有化学溶液时,三通阀选择第一行,在其他情况下选择第二行。

    Substrate processing apparatus and method
    7.
    发明申请
    Substrate processing apparatus and method 审中-公开
    基板加工装置及方法

    公开(公告)号:US20070266936A1

    公开(公告)日:2007-11-22

    申请号:US11798132

    申请日:2007-05-10

    IPC分类号: B05C11/02

    摘要: A substrate-processing apparatus includes a sample table which mounts thereon a to-be-processed substrate, a first line which supplies a chemical solution, a second line which supplies a cleaning liquid, a three-way valve connected to the first and second lines and configured to select one of the first and second lines, a filter provided across the first line upstream of the three-way valve, and configured to eliminate a foreign material from the chemical solution, and a nozzle provided downstream of the three-way valve and configured to discharge the chemical solution or the cleaning liquid when the first or second line is selected via the three-way valve. The three-way valve selects the first line when the substrate is coated with the chemical solution, and selects the second line in other cases.

    摘要翻译: 基板处理装置包括安装在被处理基板上的样品台,供给化学溶液的第一管线,供给清洗液的第二管线,与第一管路和第二管路连接的三通阀 并且构造成选择第一和第二管线中的一个,设置在三通阀上游的第一线上的过滤器,并且被配置为从化学溶液中除去异物,以及设置在三通阀下游的喷嘴 并且构造成当通过三通阀选择第一或第二管线时,排出化学溶液或清洗液体。 当基材涂有化学溶液时,三通阀选择第一行,在其他情况下选择第二行。

    Method for fabrication of interconnect structure with improved alignment for semiconductor devices
    9.
    发明授权
    Method for fabrication of interconnect structure with improved alignment for semiconductor devices 失效
    用于制造具有改进的半导体器件对准的互连结构的方法

    公开(公告)号:US08614144B2

    公开(公告)日:2013-12-24

    申请号:US13157744

    申请日:2011-06-10

    申请人: Hirokazu Kato

    发明人: Hirokazu Kato

    IPC分类号: H01L21/31 H01L21/469

    摘要: Methods and structure are provided for creating and utilizing hard masks to facilitate creation of a grating effect to control an anisotropic etching process for the creation of an opening, and subsequent formation of a interconnect structure (e.g., a via) in a multilayered semiconductor device. A first hard mask can be patterned to control etching in a first dimension, and a second hard mask can be patterned to control etching in a second dimension, wherein the second hard mask is patterned orthogonally opposed to the first hard mask. A resist can be patterned by inverting the pattern of a metal line patterning. Interconnects can be formed with critical dimension(s) and also self-aligned.

    摘要翻译: 提供了用于创建和利用硬掩模的方法和结构,以便于创建光栅效应以控制用于产生开口的各向异性蚀刻工艺,以及随后在多层半导体器件中形成互连结构(例如通孔)。 可以对第一硬掩模进行图案化以控制第一维度的蚀刻,并且可以对第二硬掩模进行图案化以控制第二维度中的蚀刻,其中第二硬掩模被图案与第一硬掩模垂直相对。 通过反转金属线图案的图案可以对抗蚀剂进行图案化。 互连可以形成临界尺寸,也可以自对准。

    Information processing apparatus and method for calculating the position and orientation of an image sensing device
    10.
    发明授权
    Information processing apparatus and method for calculating the position and orientation of an image sensing device 有权
    用于计算图像感测装置的位置和取向的信息处理装置和方法

    公开(公告)号:US08391589B2

    公开(公告)日:2013-03-05

    申请号:US12013123

    申请日:2008-01-11

    IPC分类号: G06K9/00

    摘要: Three pieces of candidate position information are calculated based on a plurality of pieces of sensing position information, and three pieces of candidate orientation information are calculated based on a plurality of pieces of sensing orientation information. Sets each of which combines one candidate position information and one candidate orientation information are prepared for all combinations. For each set, the candidate position information and candidate orientation information which configure that set are corrected. An evaluation value is calculated for each corrected set, and one of the sets is selected based on the calculated evaluation values. The candidate position information and candidate orientation information which configure the selected set are respectively recorded in a memory as sensing position information and sensing orientation information.

    摘要翻译: 基于多条感测位置信息计算三条候选位置信息,并且基于多条感测取向信息来计算三条候选方向信息。 对于所有组合,为每个组合一个候选位置信息和一个候选方向信息。 对于每个集合,配置该组的候选位置信息和候选方向信息被校正。 针对每个校正组计算评估值,并且基于所计算的评估值来选择一组。 配置所选择的集合的候选位置信息和候选方向信息分别作为感测位置信息和感测取向信息记录在存储器中。