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公开(公告)号：US20100078860A1
公开(公告)日：2010-04-01
申请号：US12563461
申请日：2009-09-21
申请人： Ikuo Yoneda , Kentaro Matsunaga , Yukiko Kikuchi , Yoshihisa Kawamura , Eishi Shiobara , Shinichi Ito , Tetsuro Nakasugi , Hirokazu Kato
发明人： Ikuo Yoneda , Kentaro Matsunaga , Yukiko Kikuchi , Yoshihisa Kawamura , Eishi Shiobara , Shinichi Ito , Tetsuro Nakasugi , Hirokazu Kato
IPC分类号： B29C35/08
CPC分类号： B29C37/0003 , B29C35/0888 , B29C37/006 , B29C59/022 , B29C2035/0822 , B29C2035/0827 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： An imprint method includes applying a light curable resin on a substrate to be processed, the substrate including first and second regions on which the light curable resin is applied, contacting an imprint mold with the light curable resin, curing the light curable resin by irradiating the light curable resin with light passing through the imprint mold, generating gas by performing a predetermined process to the light curable resin applied on a region of the substrate, the region including at least the first region, wherein an amount of gas generated from the light curable resin applied on the first region is larger than an amount of gas generated from the light curable resin of the second region, and forming a pattern by separating the imprint mold from the light curable resin after the gas being generated.
摘要翻译： 压印方法包括将光固化树脂施加在待加工的基板上，所述基板包括施加有光固化树脂的第一和第二区域，使印模与光固化树脂接触，通过照射光固化树脂来固化光固化树脂 光固化树脂，其光通过压印模具，通过对施加在基板的区域上的光固化树脂进行预定处理产生气体，该区域至少包括第一区域，其中从光可固化 施加在第一区域上的树脂大于由第二区域的光固化树脂产生的气体的量，并且在产生气体之后通过从光固化树脂分离压印模具来形成图案。
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公开(公告)号：US08419995B2
公开(公告)日：2013-04-16
申请号：US12563461
申请日：2009-09-21
申请人： Ikuo Yoneda , Kentaro Matsunaga , Yukiko Kikuchi , Yoshihisa Kawamura , Eishi Shiobara , Shinichi Ito , Tetsuro Nakasugi , Hirokazu Kato
发明人： Ikuo Yoneda , Kentaro Matsunaga , Yukiko Kikuchi , Yoshihisa Kawamura , Eishi Shiobara , Shinichi Ito , Tetsuro Nakasugi , Hirokazu Kato
CPC分类号： B29C37/0003 , B29C35/0888 , B29C37/006 , B29C59/022 , B29C2035/0822 , B29C2035/0827 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： An imprint method includes applying a light curable resin on a substrate to be processed, the substrate including first and second regions on which the light curable resin is applied, contacting an imprint mold with the light curable resin, curing the light curable resin by irradiating the light curable resin with light passing through the imprint mold, generating gas by performing a predetermined process to the light curable resin applied on a region of the substrate, the region including at least the first region, wherein an amount of gas generated from the light curable resin applied on the first region is larger than an amount of gas generated from the light curable resin of the second region, and forming a pattern by separating the imprint mold from the light curable resin after the gas being generated.
摘要翻译： 压印方法包括将光固化树脂施加在待加工的基板上，所述基板包括施加有光固化树脂的第一和第二区域，使印模与光固化树脂接触，通过照射光固化树脂来固化光固化树脂 光固化树脂，其光通过压印模具，通过对施加在基板的区域上的光固化树脂进行预定处理产生气体，该区域至少包括第一区域，其中从光可固化 施加在第一区域上的树脂大于由第二区域的光固化树脂产生的气体的量，并且在产生气体之后通过从光固化树脂分离压印模具来形成图案。
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3.发明授权公开(公告)号：US08747682B2
公开(公告)日：2014-06-10
申请号：US12849599
申请日：2010-08-03
CPC分类号： H01L21/0337 , B81C1/00031 , B81C2201/0149
摘要： According to one embodiment, a pattern formation method is disclosed. The method includes forming a plurality of regions on a foundation and the plurality of the regions correspond to different pattern sizes. The method includes separating each of a plurality of block copolymers from another one of the plurality of the block copolymers and segregating the each of the plurality of the block copolymers into a corresponding one of the regions. The method includes performing a phase separation of the each of the block copolymers of each of the regions. The method includes selectively removing a designated phase of each of the phase-separated block copolymers to form a pattern of the each of the block copolymers and the pattern has a different pattern size for the each of the regions.
摘要翻译： 根据一个实施例，公开了图案形成方法。 该方法包括在基础上形成多个区域，并且多个区域对应于不同的图案尺寸。 该方法包括从多个嵌段共聚物中的另一个嵌段共聚物中分离多个嵌段共聚物，并将多个嵌段共聚物中的每一个分离成相应的一个区域。 该方法包括进行每个区域的每个嵌段共聚物的相分离。 该方法包括选择性地除去每个相分离的嵌段共聚物的指定相以形成每个嵌段共聚物的图案，并且该图案对于每个区域具有不同的图案尺寸。
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4.发明申请公开(公告)号：US20110034029A1
公开(公告)日：2011-02-10
申请号：US12849599
申请日：2010-08-03
IPC分类号： H01L21/306
CPC分类号： H01L21/0337 , B81C1/00031 , B81C2201/0149
摘要： According to one embodiment, a pattern formation method is disclosed. The method includes forming a plurality of regions on a foundation and the plurality of the regions correspond to different pattern sizes. The method includes separating each of a plurality of block copolymers from another one of the plurality of the block copolymers and segregating the each of the plurality of the block copolymers into a corresponding one of the regions. The method includes performing a phase separation of the each of the block copolymers of each of the regions. The method includes selectively removing a designated phase of each of the phase-separated block copolymers to form a pattern of the each of the block copolymers and the pattern has a different pattern size for the each of the regions.
摘要翻译： 根据一个实施例，公开了图案形成方法。 该方法包括在基础上形成多个区域，并且多个区域对应于不同的图案尺寸。 该方法包括从多个嵌段共聚物中的另一个嵌段共聚物中分离多个嵌段共聚物，并将多个嵌段共聚物中的每一个分离成相应的一个区域。 该方法包括进行每个区域的每个嵌段共聚物的相分离。 该方法包括选择性地除去每个相分离的嵌段共聚物的指定相以形成每个嵌段共聚物的图案，并且该图案对于每个区域具有不同的图案尺寸。
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5.发明授权Substrate processing method, substrate processing apparatus, and manufacturing method of semiconductor device 失效基板处理方法，基板处理装置以及半导体装置的制造方法公开(公告)号：US07794923B2
公开(公告)日：2010-09-14
申请号：US11654565
申请日：2007-01-18
申请人： Eishi Shiobara , Kentaro Matsunaga , Daisuke Kawamura , Tomoyuki Takeishi , Kei Hayasaki , Shinichi Ito
发明人： Eishi Shiobara , Kentaro Matsunaga , Daisuke Kawamura , Tomoyuki Takeishi , Kei Hayasaki , Shinichi Ito
IPC分类号： G03F7/00
CPC分类号： G03F7/70341 , Y10S430/162
摘要： A substrate processing method including while a liquid is supplied between a processing target substrate to be applied with exposure treatment and a projection optical system of an exposure apparatus for carrying out the exposure treatment, prior to providing a resist film on a first main face of the processing target substrate that is provided for liquid immersion exposure for carrying out the exposure treatment at a side to be applied with the exposure treatment, selectively applying at least hydrophobic treatment with respect to a region in a predetermined range from a peripheral rim part of a second main face opposite to the first main face.
摘要翻译： 一种基板处理方法，包括在将待施加曝光处理的处理对象基板和用于进行曝光处理的曝光装置的投影光学系统之间提供液体之前，在将抗蚀剂膜提供在第一主面 为了进行曝光处理的一侧进行曝光处理而设置的液浸曝光处理对象基板，从第二图像的外围边缘部选择性地施加相对于规定范围的区域的至少疏水处理 主面与第一主面相对。
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6.发明申请Substrate processing method, substrate processing apparatus, and manufacturing method of semiconductor device 失效基板处理方法，基板处理装置以及半导体装置的制造方法公开(公告)号：US20070190462A1
公开(公告)日：2007-08-16
申请号：US11654565
申请日：2007-01-18
申请人： Eishi Shiobara , Kentaro Matsunaga , Daisuke Kawamura , Tomoyuki Takeishi , Kei Hayasaki , Shinichi Ito
发明人： Eishi Shiobara , Kentaro Matsunaga , Daisuke Kawamura , Tomoyuki Takeishi , Kei Hayasaki , Shinichi Ito
IPC分类号： G03F7/20
CPC分类号： G03F7/70341 , Y10S430/162
摘要： A substrate processing method including while a liquid is supplied between a processing target substrate to be applied with exposure treatment and a projection optical system of an exposure apparatus for carrying out the exposure treatment, prior to providing a resist film on a first main face of the processing target substrate that is provided for liquid immersion exposure for carrying out the exposure treatment at a side to be applied with the exposure treatment, selectively applying at least hydrophobic treatment with respect to a region in a predetermined range from a peripheral rim part of a second main face opposite to the first main face.
摘要翻译： 一种基板处理方法，包括在将待施加曝光处理的处理对象基板和用于进行曝光处理的曝光装置的投影光学系统之间提供液体之前，在将抗蚀剂膜提供在第一主面 为了进行曝光处理的一侧进行曝光处理而设置的液浸曝光处理对象基板，从第二图像的外围边缘部选择性地施加相对于规定范围的区域的至少疏水处理 主面与第一主面相对。
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公开(公告)号：US08753803B2
公开(公告)日：2014-06-17
申请号：US12878828
申请日：2010-09-09
申请人： Yoshihisa Kawamura , Eishi Shiobara , Shinichi Ito
发明人： Yoshihisa Kawamura , Eishi Shiobara , Shinichi Ito
IPC分类号： G03F7/20
CPC分类号： G03F7/0002
摘要： According to one embodiment, a pattern forming method is disclosed. The method can include selectively providing a curing agent to a pattern in a template, contacting the template provided the curing agent to a substrate, irradiating the curing agent with light where the template and the substrate are contacted each other to harden the curing agent, demolding the template from the substrate to form a curing agent pattern on the substrate, and etching the substrate on a basis of the curing agent pattern.
摘要翻译： 根据一个实施例，公开了一种图案形成方法。 该方法可以包括选择性地向模板中的图案提供固化剂，使提供固化剂的模板与基底接触，用光照射固化剂，其中模板和基底彼此接触以硬化固化剂，脱模 所述模板从所述基板在所述基板上形成固化剂图案，并且基于所述固化剂图案来蚀刻所述基板。
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公开(公告)号：US20110059406A1
公开(公告)日：2011-03-10
申请号：US12878828
申请日：2010-09-09
申请人： Yoshihisa KAWAMURA , Eishi Shiobara , Shinichi Ito
发明人： Yoshihisa KAWAMURA , Eishi Shiobara , Shinichi Ito
IPC分类号： G03F7/20
CPC分类号： G03F7/0002
摘要： According to one embodiment, a pattern forming method is disclosed. The method can include selectively providing a curing agent to a pattern in a template, contacting the template provided the curing agent to a substrate, irradiating the curing agent with light where the template and the substrate are contacted each other to harden the curing agent, demolding the template from the substrate to form a curing agent pattern on the substrate, and etching the substrate on a basis of the curing agent pattern.
摘要翻译： 根据一个实施例，公开了一种图案形成方法。 该方法可以包括选择性地向模板中的图案提供固化剂，使提供固化剂的模板与基底接触，用光照射固化剂，其中模板和基底彼此接触以硬化固化剂，脱模 所述模板从所述基板在所述基板上形成固化剂图案，并且基于所述固化剂图案来蚀刻所述基板。
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公开(公告)号：US20090226624A1
公开(公告)日：2009-09-10
申请号：US12466525
申请日：2009-05-15
申请人： Eishi Shiobara , Hirokazu Kato , Seiro Miyoshi , Shinichi Ito
发明人： Eishi Shiobara , Hirokazu Kato , Seiro Miyoshi , Shinichi Ito
CPC分类号： H01L21/67253 , H01L21/67051 , H01L21/6715
摘要： A substrate-processing apparatus includes a sample table which mounts thereon a to-be-processed substrate, a first line which supplies a chemical solution, a second line which supplies a cleaning liquid, a three-way valve connected to the first and second lines and configured to select one of the first and second lines, a filter provided across the first line upstream of the three-way valve, and configured to eliminate a foreign material from the chemical solution, and a nozzle provided downstream of the three-way valve and configured to discharge the chemical solution or the cleaning liquid when the first or second line is selected via the three-way valve. The three-way valve selects the first line when the substrate is coated with the chemical solution, and selects the second line in other cases.
摘要翻译： 基板处理装置包括安装在被处理基板上的样品台，供给化学溶液的第一管线，供给清洗液的第二管线，与第一管路和第二管路连接的三通阀 并且构造成选择第一和第二管线中的一个，设置在三通阀上游的第一线上的过滤器，并且被配置为从化学溶液中除去异物，以及设置在三通阀下游的喷嘴 并且构造成当通过三通阀选择第一或第二管线时，排出化学溶液或清洗液体。 当基材涂有化学溶液时，三通阀选择第一行，在其他情况下选择第二行。
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公开(公告)号：US07779777B2
公开(公告)日：2010-08-24
申请号：US12466525
申请日：2009-05-15
申请人： Eishi Shiobara , Hirokazu Kato , Seiro Miyoshi , Shinichi Ito
发明人： Eishi Shiobara , Hirokazu Kato , Seiro Miyoshi , Shinichi Ito
CPC分类号： H01L21/67253 , H01L21/67051 , H01L21/6715
摘要： A substrate-processing apparatus includes a sample table which mounts thereon a to-be-processed substrate, a first line which supplies a chemical solution, a second line which supplies a cleaning liquid, a three-way valve connected to the first and second lines and configured to select one of the first and second lines, a filter provided across the first line upstream of the three-way valve, and configured to eliminate a foreign material from the chemical solution, and a nozzle provided downstream of the three-way valve and configured to discharge the chemical solution or the cleaning liquid when the first or second line is selected via the three-way valve. The three-way valve selects the first line when the substrate is coated with the chemical solution, and selects the second line in other cases.
摘要翻译： 基板处理装置包括安装在被处理基板上的样品台，供给化学溶液的第一管线，供给清洗液的第二管线，与第一管路和第二管路连接的三通阀 并且构造成选择第一和第二管线中的一个，设置在三通阀上游的第一线上的过滤器，并且被配置为从化学溶液中除去异物，以及设置在三通阀下游的喷嘴 并且构造成当通过三通阀选择第一或第二管线时，排出化学溶液或清洗液体。 当基材涂有化学溶液时，三通阀选择第一行，在其他情况下选择第二行。
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