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公开(公告)号:US20090132545A1
公开(公告)日:2009-05-21
申请号:US12230463
申请日:2008-08-29
申请人: Hiroshi Kurihara , Yoshitaka Iwata
发明人: Hiroshi Kurihara , Yoshitaka Iwata
IPC分类号: G06F17/30
CPC分类号: H04L67/06 , H04L63/0428 , H04L63/06 , H04L63/10 , H04L67/1095
摘要: A contents management system provides a user who already downloaded valid contents with a mechanism capable of downloading the same contents in a duplication manner. A system for delivering contents checks whether contents which are about to be purchased by the user are the same as contents which are in a validity term and which are already downloaded by the user. If so, the system prepares a new contents ID, DL information and meta information for duplicated buying, and makes duplicated buying of the same contents possible.
摘要翻译: 内容管理系统为已经下载有效内容的用户提供能够以复制方式下载相同内容的机制。 用于发送内容的系统检查用户将要购买的内容是否与有效期内的内容相同,并且已由用户下载。 如果是这样,系统将准备新的内容ID,DL信息和元信息以供重复购买,并且可以重复购买相同的内容。
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公开(公告)号:US20130039010A1
公开(公告)日:2013-02-14
申请号:US13643227
申请日:2011-04-28
CPC分类号: H01L23/473 , H01L21/4882 , H01L23/3731 , H01L2924/0002 , H05K7/20254 , H01L2924/00
摘要: Disclosed is a heat dissipation device which is reduced in the number of components, while having sufficient insulating function and cooling function with respect to an object to be cooled. The heat dissipation device includes a base that is formed from a ceramic and a refrigerant channel for circulating a refrigerant within the base. The base is formed by sintering a stacked body in which a plurality of ceramic sheets are stacked. The plurality of ceramic sheets include the ceramic sheet which is provided with a plurality of slits that constitute the refrigerant channel, and the ceramic sheets which are provided with communication paths that communicate the refrigerant channel and outside units with each other. A semiconductor device is configured by bonding a metal plate, on which a semiconductor element is mounted, to the heat dissipation device.
摘要翻译: 公开了一种减少部件数量的散热装置,同时相对于待冷却的物体具有足够的绝缘功能和冷却功能。 散热装置包括由陶瓷形成的基座和用于在基座内循环制冷剂的制冷剂通道。 基底通过烧结多个陶瓷片层叠的层叠体形成。 多个陶瓷片包括设置有构成制冷剂通道的多个狭缝的陶瓷片,以及设置有使制冷剂流路和外部单元相互连通的连通路的陶瓷片。 通过将安装有半导体元件的金属板接合到散热装置来构成半导体器件。
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公开(公告)号:US5055945A
公开(公告)日:1991-10-08
申请号:US476345
申请日:1990-02-07
申请人: Shingo Oguma , Hideki Muroya , Yoshitaka Iwata
发明人: Shingo Oguma , Hideki Muroya , Yoshitaka Iwata
IPC分类号: H04N1/32
CPC分类号: H04N1/32064 , H04N1/00912 , H04N1/00915 , H04N1/32037
摘要: A broadcasting facsimile transceiver has a transmission controller which, in the broadcasting mode, inhibits broadcasting communications during a predetermined interval of time ranging from the completion of transmission to a destination to the commencement of transmission to the succeeding destination. The transceiver also includes a scanning unit for reading a document and delivering video data, a data compression unit for compressing the video data, a memory unit for storing compressed video data from said data compression unit, a reproduction unit for reading the compressed video data stored in said memory unit, a MODEM for transmitting the video data to a communication line. The transmission controller controls the transceiver such that when reading the document, the video data read out of the scanning unit is stored in the memory unit through the data compression unit and in the broadcasting communication mode, the video data from the data reproduction unit is transmitted to the communication line through the MODEM. During a predetermined interval of time between the termination of transmission to a first destination and the commencement of transmission to a second destination, the transmission of transmission video data is inhibited to establish a reception wait state in the transceiver.
摘要翻译: 广播传真收发机具有传输控制器,在广播模式下,在从发送完成到目的地到开始发送到后续目的地的预定时间间隔期间禁止广播通信。 收发器还包括用于读取文档并传送视频数据的扫描单元,用于压缩视频数据的数据压缩单元,用于存储来自所述数据压缩单元的压缩视频数据的存储单元,用于读取存储的压缩视频数据的再现单元 在所述存储器单元中,用于将视频数据发送到通信线路的MODEM。 传输控制器控制收发器,使得当读取文档时,从扫描单元读出的视频数据通过数据压缩单元被存储在存储器单元中,并且在广播通信模式中,传送来自数据再现单元的视频数据 通过MODEM通信线路。 在终止发送到第一目的地的预定时间间隔和到第二目的地的发送开始之间的预定时间间隔内,传输视频数据被禁止在收发机中建立接收等待状态。
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公开(公告)号:US08995129B2
公开(公告)日:2015-03-31
申请号:US13443152
申请日:2012-04-10
申请人: Yoshitaka Iwata , Shogo Mori , Tomoya Hirano , Kazuhiko Minami
发明人: Yoshitaka Iwata , Shogo Mori , Tomoya Hirano , Kazuhiko Minami
IPC分类号: H05K7/20 , H01L23/473 , H01L23/34 , H01L23/00
CPC分类号: H01L23/473 , H01L24/32 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2924/00013 , H01L2924/01068 , H01L2924/1305 , H01L2924/13055 , H05K7/20254 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00
摘要: A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the back metal layer (16, 31). A region in the back metal layer (16, 31) that is directly below a semiconductor device (12) is defined as a directly-below region (A1), and a region outside the directly-below region (A1) that corresponds to and has the same dimensions as the directly-below region (A1) is defined as a comparison region (A21). The volume of the stress relaxation spaces (17) in the range of the directly-below region (A1) is less than the volume of the stress relaxation spaces (17) formed in the range of the comparison region (A21).
摘要翻译: 后金属层(16,31)具有多个应力松弛空间(17)。 每个应力松弛空间(17)形成为至少在后金属层(16,31)的前表面和后表面中的一个处打开。 将直接位于半导体器件(12)的正下方的背面金属层(16,31)的区域定义为直接下方的区域(A1),以及直接向下方的区域(A1)外的区域 具有与直接下方区域(A1)相同的尺寸作为比较区域(A21)。 在直接低于区域(A1)的范围内的应力松弛空间(17)的体积小于在比较区域(A21)的范围内形成的应力松弛空间(17)的体积。
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公开(公告)号:US20120262883A1
公开(公告)日:2012-10-18
申请号:US13443152
申请日:2012-04-10
申请人: Yoshitaka Iwata , Shogo Mori , Tomoya Hirano , Kazuhiko Minami
发明人: Yoshitaka Iwata , Shogo Mori , Tomoya Hirano , Kazuhiko Minami
CPC分类号: H01L23/473 , H01L24/32 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2924/00013 , H01L2924/01068 , H01L2924/1305 , H01L2924/13055 , H05K7/20254 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00
摘要: A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the back metal layer (16, 31). A region in the back metal layer (16, 31) that is directly below a semiconductor device (12) is defined as a directly-below region (A1), and a region outside the directly-below region (A1) that corresponds to and has the same dimensions as the directly-below region (A1) is defined as a comparison region (A21). The volume of the stress relaxation spaces (17) in the range of the directly-below region (A1) is less than the volume of the stress relaxation spaces (17) formed in the range of the comparison region (A21).
摘要翻译: 后金属层(16,31)具有多个应力松弛空间(17)。 每个应力松弛空间(17)形成为至少在后金属层(16,31)的前表面和后表面中的一个处打开。 将直接位于半导体器件(12)的正下方的背面金属层(16,31)的区域定义为直接下方的区域(A1),以及直接向下方的区域(A1)外的区域 具有与直接下方区域(A1)相同的尺寸作为比较区域(A21)。 在直接低于区域(A1)的范围内的应力松弛空间(17)的体积小于在比较区域(A21)的范围内形成的应力松弛空间(17)的体积。
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公开(公告)号:US20080290500A1
公开(公告)日:2008-11-27
申请号:US12154542
申请日:2008-05-23
申请人: Yoshitaka Iwata , Keiji Toh , Shinobu Tamura , Shintaro Nakagawa
发明人: Yoshitaka Iwata , Keiji Toh , Shinobu Tamura , Shintaro Nakagawa
IPC分类号: H01L23/36
CPC分类号: H01L23/473 , H01L23/13 , H01L23/3735 , H01L2924/0002 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要: A semiconductor device has a ceramic substrate having a first surface and a second surface, a metal layer that is coupled to the second surface, a heat sink that is coupled to the metal layer and a stress relaxation member. The stress relaxation member is arranged between the metal layer and the heat sink and has a first surface that is coupled to the metal layer and a second surface that is coupled to the heat sink. A plurality of stress relaxation spaces are provided over the entire surface of at least one of the first and second surfaces of the stress relaxation member. The stress relaxation spaces that are arranged at the outermost portions of the stress relaxation member are deeper than the other stress relaxation spaces.
摘要翻译: 半导体器件具有陶瓷衬底,其具有第一表面和第二表面,耦合到第二表面的金属层,耦合到金属层的散热器和应力松弛元件。 应力松弛构件布置在金属层和散热器之间,并且具有耦合到金属层的第一表面和耦合到散热器的第二表面。 在应力缓和构件的第一和第二表面中的至少一个的整个表面上设置有多个应力松弛空间。 布置在应力松弛部件的最外部的应力松弛空间比其他应力松弛空间深。
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公开(公告)号:US09379038B2
公开(公告)日:2016-06-28
申请号:US13643227
申请日:2011-04-28
IPC分类号: F28F7/00 , H01L23/473 , H01L23/373 , H05K7/20 , H01L21/48
CPC分类号: H01L23/473 , H01L21/4882 , H01L23/3731 , H01L2924/0002 , H05K7/20254 , H01L2924/00
摘要: Disclosed is a heat dissipation device which is reduced in the number of components, while having sufficient insulating function and cooling function with respect to an object to be cooled. The heat dissipation device includes a base that is formed from a ceramic and a refrigerant channel for circulating a refrigerant within the base. The base is formed by sintering a stacked body in which a plurality of ceramic sheets are stacked. The plurality of ceramic sheets include the ceramic sheet which is provided with a plurality of slits that constitute the refrigerant channel, and the ceramic sheets which are provided with communication paths that communicate the refrigerant channel and outside units with each other. A semiconductor device is configured by bonding a metal plate, on which a semiconductor element is mounted, to the heat dissipation device.
摘要翻译: 公开了一种减少部件数量的散热装置,同时相对于待冷却的物体具有足够的绝缘功能和冷却功能。 散热装置包括由陶瓷形成的基座和用于在基座内循环制冷剂的制冷剂通道。 基底通过烧结多个陶瓷片层叠的层叠体形成。 多个陶瓷片包括设置有构成制冷剂通道的多个狭缝的陶瓷片,以及设置有使制冷剂流路和外部单元相互连通的连通路的陶瓷片。 通过将安装有半导体元件的金属板接合到散热装置来构成半导体器件。
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8.
公开(公告)号:US08735729B2
公开(公告)日:2014-05-27
申请号:US13346978
申请日:2012-01-10
申请人: Shogo Mori , Yoshitaka Iwata
发明人: Shogo Mori , Yoshitaka Iwata
IPC分类号: H05K1/00 , H01L23/373
CPC分类号: H01L23/3735 , C04B37/021 , C04B37/026 , C04B2237/121 , C04B2237/124 , C04B2237/402 , C04B2237/582 , C04B2237/62 , C04B2237/706 , C04B2237/72 , H01L2224/32225 , H01L2224/83101 , Y10T428/12361 , Y10T428/12611
摘要: A double-sided substrate includes a ceramic substrate, a first metal layer formed on one surface of the ceramic substrate and having a plurality of subsidiary metal layers which are laminated on the surface of the ceramic substrate and whose purities differ from each other and a second metal layer formed on the other surface of the ceramic substrate, wherein the closer to the ceramic substrate any subsidiary metal layer is located, the lower purity the subsidiary metal layer has. Additionally, a semiconductor includes the above double-sided substrate, a power element and a heat sink.
摘要翻译: 双面基板包括陶瓷基板,形成在陶瓷基板的一个表面上的第一金属层,并且具有层叠在陶瓷基板的表面上并且其纯度彼此不同的多个辅助金属层,第二金属层的第二 金属层形成在陶瓷基板的另一个表面上,其中更靠近陶瓷基板的任何辅助金属层位于,辅助金属层具有较低的纯度。 此外,半导体包括上述双面基板,功率元件和散热器。
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公开(公告)号:US4734780A
公开(公告)日:1988-03-29
申请号:US863502
申请日:1986-05-15
申请人: Yoshitaka Iwata , Kunihiro Sakata , Shuichi Hirano
发明人: Yoshitaka Iwata , Kunihiro Sakata , Shuichi Hirano
CPC分类号: H04N1/32791 , H04N1/32702
摘要: A high-speed G3 facsimile communication system for shortening the time required for procedure control performed before transmission of image data is started, a quiescent time intervening between the connection of a receiver equipment to the transmission line and the starting of sending the control procedure signal CED is utilized for sending out a newly provided procedure shortening signal to the receiver equipment, and upon receiving a response of the receiver equipment indicating that the receiver is capable of communicating in an optional mode other than G3 mode, the sender station sends subsequently the requisite control procedure signal from the high-speed modem thereof.
摘要翻译: 用于缩短在图像数据传输之前执行的过程控制所需的时间的高速G3传真通信系统,介于接收机设备与传输线路的连接之间的静止时间以及发送控制过程信号CED 用于向接收机设备发送新提供的过程缩短信号,并且在接收到指示接收机能够以除G3模式之外的可选模式进行通信的接收机设备的响应时,发送站随后发送必要的控制 来自其高速调制解调器的程序信号。
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公开(公告)号:US4560623A
公开(公告)日:1985-12-24
申请号:US608121
申请日:1984-05-08
申请人: Yoshitaka Iwata , Ken Matsuda
发明人: Yoshitaka Iwata , Ken Matsuda
CPC分类号: C25D3/60 , Y10T428/12569 , Y10T428/12722 , Y10T428/12861 , Y10T428/12944
摘要: A specular product of bronze-like tone particularly suitable for use as a decorative material. The specular product uses, as a substrate, a composite board comprising a synthetic resin sheet and metal sheets laminated thereon, and includes a nickel deposit plated on the metal sheet and a specular film of Sn-Ni alloy electroplated on the nickel deposit using a specific electroplating bath.
摘要翻译: 青铜样色调的镜面产品特别适合用作装饰材料。 镜面产品使用包括合成树脂片和层叠在其上的金属片作为基底的复合板,并且包括镀在金属片上的镍沉积物和电镀在镍沉积物上的Sn-Ni合金的镜面膜,使用特定的 电镀浴
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