公开(公告)号：US20050260430A1

公开(公告)日：2005-11-24

申请号：US10343944

申请日：2001-04-27

申请人： Hiroshi Kuroda ,  Nobuyuki Okinaga

发明人： Hiroshi Kuroda ,  Nobuyuki Okinaga

IPC分类号： H01R4/00 ,  H01R4/02 ,  H01R4/04 ,  H01R13/03 ,  H05K3/32 ,  H05K3/34 ,  B32B15/02

CPC分类号： H01R4/00 ,  H01R4/02 ,  H01R4/04 ,  H01R13/035 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/068 ,  H05K2203/0425 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/2991

摘要： This invention provides a conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3×10−5 to 7×10−5 (1/K).

摘要翻译： 本发明提供一种具有放松施加到基板的电路等的力的能力的导电细粒。 一种导电细颗粒，其包含由其表面覆盖有至少一个金属层的树脂制成的芯细颗粒，其中所述树脂的线性膨胀系数为3×10 -5至7×10 -6， -5（1 / K）。

公开(公告)号：US07226660B2

公开(公告)日：2007-06-05

申请号：US10343944

申请日：2001-04-27

申请人： Hiroshi Kuroda ,  Nobuyuki Okinaga

发明人： Hiroshi Kuroda ,  Nobuyuki Okinaga

IPC分类号： B32B5/16

CPC分类号： H01R4/00 ,  H01R4/02 ,  H01R4/04 ,  H01R13/035 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/068 ,  H05K2203/0425 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/2991

摘要： This invention provides a conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3×10−5 to 7×10−5 (1/K).

摘要翻译： 本发明提供一种具有放松施加到基板的电路等的力的能力的导电细粒。 一种导电细颗粒，其包含由其表面覆盖有至少一个金属层的树脂制成的芯细颗粒，其中所述树脂的线性膨胀系数为3×10 -5至7×10 -6， -5（1 / K）。

公开(公告)号：US08609246B2

公开(公告)日：2013-12-17

申请号：US12450704

申请日：2008-03-31

申请人： Ren-de Sun ,  Kiyoto Matsushita ,  Taku Sasaki ,  Shinya Uenoyama ,  Masaki Okuda ,  Nobuyuki Okinaga

发明人： Ren-de Sun ,  Kiyoto Matsushita ,  Taku Sasaki ,  Shinya Uenoyama ,  Masaki Okuda ,  Nobuyuki Okinaga

IPC分类号： B32B15/02

CPC分类号： H05K3/323 ,  B23K35/262 ,  B23K2101/36 ,  C23C18/1635 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/30 ,  C23C18/34 ,  C23C18/54 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/2939 ,  H01L2224/29411 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01R13/03 ,  H05K2201/0221 ,  H05K2203/0425 ,  Y10T428/2982 ,  Y10T428/2998 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure.

摘要翻译： 导电性细颗粒，用于细电极之间的导电连接，并且即使具有落下冲击，也不会引起焊料层中的裂纹或由于电极和导电性细颗粒之间的连接界面的断裂而导致的断开， 即使在重复加热和冷却之后也不会有疲劳; 通过使用导电性微粒获得的各向异性导电材料; 和导电连接结构。

公开(公告)号：US20100112353A1

公开(公告)日：2010-05-06

申请号：US12450704

申请日：2008-03-31

申请人： Ren-de Sun ,  Kiyoto Matsushita ,  Taku Sasaki ,  Shinya Uenoyama ,  Masaki Okuda ,  Nobuyuki Okinaga

发明人： Ren-de Sun ,  Kiyoto Matsushita ,  Taku Sasaki ,  Shinya Uenoyama ,  Masaki Okuda ,  Nobuyuki Okinaga

IPC分类号： B32B15/02

CPC分类号： H05K3/323 ,  B23K35/262 ,  B23K2101/36 ,  C23C18/1635 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/30 ,  C23C18/34 ,  C23C18/54 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/2939 ,  H01L2224/29411 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01R13/03 ,  H05K2201/0221 ,  H05K2203/0425 ,  Y10T428/2982 ,  Y10T428/2998 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014

摘要： It is an object of the present invention to provide: a conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure.The present invention relates to a conductive fine particle, which comprises a solder layer containing tin and being formed on a surface of a resin fine particle, with nickel adhered to a surface of the solder layer, and contains 0.0001 to 5.0% by weight of the nickel with respect to a total of a metal contained in the solder layer and the nickel adhered to the surface of the solder layer.

摘要翻译： 本发明的目的是提供：导电性微粒，用于在细电极之间进行导电连接，并且不会引起焊料层中的裂纹或由电极之间的连接界面中的断裂引起的断开 导电性细颗粒即使具有液滴冲击等，并且即使在重复加热和冷却之后也不会有疲劳; 通过使用导电性微粒获得的各向异性导电材料; 和导电连接结构。 本发明涉及一种导电性细颗粒，其包含含锡的焊料层，并且形成在树脂细颗粒的表面上，镍附着在焊料层的表面上，并且含有0.0001至5.0重量％的 镍相对于焊料层中包含的总量和附着到焊料层表面的镍。

公开(公告)号：US07045050B2

公开(公告)日：2006-05-16

申请号：US10485369

申请日：2002-07-31

申请人： Yoshiaki Tanaka ,  Nobuyuki Okinaga ,  Manabu Matsubara

发明人： Yoshiaki Tanaka ,  Nobuyuki Okinaga ,  Manabu Matsubara

IPC分类号： C25D5/00 ,  C25D17/16

CPC分类号： C25D7/006 ,  B22F1/025 ,  C25D5/20 ,  C25D17/20

摘要： The purpose of the invention is to provide a method for producing conductive fine particles having a plating layer of extremely uniform thickness and free from scratches without being accompanied with agglomeration of fine particles to be plated during the plating process and a method for producing conductive fine particles comprising resin fine particles and a tin/silver alloy plating layer formed thereon.The invention is a method for producing a conductive fine particle, which comprises forming a plating layer on the surface of a fine particle to be plated using a barrel plating apparatus having a rotatable barrel in a plating bath, said method comprising putting the fine particle to be plated and a dummy particle with a lager particle diameter than that of the fine particle to be plated in the barrel and forming a plating layer while vibrating the barrel at an amplitude of 0.05 to 3.0 mm and a frequency of 20 to 120 Hz.

摘要翻译： 本发明的目的在于提供一种导电性微粒的制造方法，其特征在于，具有镀层厚度均匀且无划伤的导电性微粒，而不伴随镀覆工序中的被镀细小颗粒的聚集，导电性微粒的制造方法 包括树脂细颗粒和形成在其上的锡/银合金镀层。 本发明是一种导电性微粒的制造方法，其特征在于，在电镀槽中，使用具有可旋转筒的滚镀装置，在被镀细微粒的表面上形成镀层，所述方法包括： 并且将其镀层的粒径大于待镀层的微细粒子的粒子的大小，形成镀层，同时以0.05〜3.0mm的振幅和频率为20〜120Hz振动筒体。

公开(公告)号：US4698105A

公开(公告)日：1987-10-06

申请号：US946789

申请日：1986-12-29

申请人： Atsuo Inoue ,  Kazuhiro Miyamoto ,  Nobuo Hisada ,  Nobuyuki Okinaga

发明人： Atsuo Inoue ,  Kazuhiro Miyamoto ,  Nobuo Hisada ,  Nobuyuki Okinaga

IPC分类号： C06B47/14 ,  C06B45/00

CPC分类号： C06B47/145

摘要： Disclosed herein are water-in-oil type emulsion explosives comprising an aqueous solution of oxidizing agent, an oily material, hollow microspheres and an emulsifier containing from 0.1 to 10% by weight of fatty acid, from 0.1 to 10% by weight of fatty acid soap and from 80 to 99.8% by weight of a fatty acid ester mixture comprising from 0 to 3% by weight of sorbide fatty acid ester, from 5 to 50% by weight of sorbitan fatty acid ester and from 50 to 95% by weight of sorbitol fatty acid ester.

摘要翻译： 本文公开了包含氧化剂水溶液，油性物质，中空微球体和含有0.1至10重量％脂肪酸，0.1至10重量％脂肪酸的乳化剂的油包水型乳液炸药 皂和80至99.8重量％的脂肪酸​​酯混合物，其包含0至3重量％的山梨糖醇脂肪酸酯，5至50重量％的脱水山梨糖醇脂肪酸酯和50至95重量％ 山梨醇脂肪酸酯。