摘要:
A grid computing system includes a plurality of nodes for processing a plurality of jobs, and a management apparatus for managing the plurality of the nodes. Each of the nodes is switchable between a standby and an active status, respectively. And the management apparatus including, a job request unit for allotting a plurality of requests of jobs to any of the nodes in an active state, a prediction unit for predicting the number of the nodes in the active state optimal for predicted amount of jobs requested from the exterior at a future time when a predetermined time period lapses from the present time, and a controller for controlling switching of the nodes between the standby and active so as to control the predicted number of the nodes to start switching before the future time.
摘要:
A semiconductor integrated circuit includes a semiconductor substrate, one or more wells formed in the semiconductor substrate, one or more diffusion layers formed in the one or more wells, a plurality of interconnects formed in an interconnect layer, the one or more diffusion layers and the plurality of interconnects being connected in series to provide a coupling between a first potential and a second potential, and a comparison circuit coupled to one of the interconnects set at a third potential between the first potential and the second potential, and configured to compare the third potential with a reference potential, wherein a first interconnect of the plurality of interconnects that is set to the first potential is connected to at least a first well of the one or more wells and connected to a first diffusion layer of the one or more diffusion layers that is formed in the first well.
摘要:
A semiconductor integrated circuit includes a semiconductor substrate, one or more wells formed in the semiconductor substrate, one or more diffusion layers formed in the one or more wells, a plurality of interconnects formed in an interconnect layer, the one or more diffusion layers and the plurality of interconnects being connected in series to provide a coupling between a first potential and a second potential, and a comparison circuit coupled to one of the interconnects set at a third potential between the first potential and the second potential, and configured to compare the third potential with a reference potential, wherein a first interconnect of the plurality of interconnects that is set to the first potential is connected to at least a first well of the one or more wells and connected to a first diffusion layer of the one or more diffusion layers that is formed in the first well.
摘要:
An address switch circuit receives a row address signal supplied to a first address terminal group and a column address signal supplied to a second address terminal group. Further, the address switch circuit receives the row address signal supplied to the second address terminal group and thereafter receives the column address signal supplied to the second address terminal group and supplies the received row address signal and the received column address signal to the row decoder and the column decoder during a second operation mode. The number of semiconductor memories that are tested at once can be increased by executing an operation test of the semiconductor memories in the second operation mode. In addition, it becomes possible to test a semiconductor memory using test assets for other semiconductor memories. Consequently, the test efficiency can be improved, and the test cost can be reduced.
摘要:
A logical circuit receives first and second input signals in which a period of a first logic level partially overlaps, and outputs first and second output signals in which a period of the first logic level does not overlap. The logical circuit comprises a first unit which changes a phase of the first output signal from a second logic level to the first logic level when a change of the first input signal from the second logic level to the first logic level is detected. A second unit changes a phase of the second output signal from the first logic level to the second logic level when the second input signal is detected as being at the first logic level at a time of detection of the change of the first input signal.
摘要:
A logical circuit receives first and second input signals in which a period of a first logic level partially overlaps, and outputs first and second output signals in which a period of the first logic level does not overlap. The logical circuit comprises a first unit which changes a phase of the first output signal from a second logic level to the first logic level when a change of the first input signal from the second logic level to the first logic level is detected. A second unit changes a phase of the second output signal from the first logic level to the second logic level when the second input signal is detected as being at the first logic level at a time of detection of the change of the first input signal.
摘要:
In a data transfer method for transfer of data by a first information processing terminal device to a second information processing terminal device connected to the first information processing terminal device via a signal line, the first information processing terminal device calculates a maximum required time according to the amount of data for transfer and transfer performance information relating to the connection of the first information processing terminal device with the second information processing terminal device; upon initiating the data transfer processing, the first information processing terminal device continuously confirms that the data transfer processing is in state of execution from the time of initiation of the data transfer processing until the maximum required time has elapsed; and if, when the maximum required time has elapsed, the data transfer processing initiated is confirmed to be continuing, the first information processing terminal device forcibly ends the data transfer processing.
摘要:
A plurality of memory blocks is allocated the same address spaces to write the same data therein, and is operable independently of one another. One of the memory blocks is selected as a refresh block that performs a refresh operation, in response to a refresh command, while another one of the memory blocks is selected as a read block that performs a read operation, in response to a read command. Then, the plurality of memory blocks performs read operations at different timings so that the read operations overlap one another. Therefore, the semiconductor memory can receive read commands at intervals each of which is shorter than the execution time of a single read operation. As a result, externally supplied read commands can be responded to at high speed, and the data transmission rate during read operation can be improved.
摘要:
One aspect of the present invention is that, when the memory is in the non-power-down state, the supply of clock signals to the data output circuit is limited to the read status after the reception of a read command, and no clock signal supply is performed when either the active status or the write status is in effect. In the best aspect, furthermore, in the read status after the reception of a read command, the supply of clock signals to the data output circuit starts after a number of clock signals corresponding to a set CAS latency following the read command, and stops after a number of clock signals corresponding to a set burst length, after the output of the read out data from the data output circuit starts. Accordingly, even in the non-power-down state, clock signals are only supplied during the time required for the read out data to be actually output from the data output circuit to the outside, whereby it is possible to reduce the number of clock signal supply actions that require large current drive.
摘要:
It is an object of the present invention to provide: a conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure.The present invention relates to a conductive fine particle, which comprises a solder layer containing tin and being formed on a surface of a resin fine particle, with nickel adhered to a surface of the solder layer, and contains 0.0001 to 5.0% by weight of the nickel with respect to a total of a metal contained in the solder layer and the nickel adhered to the surface of the solder layer.