摘要:
An AC amplifier has an amplification circuit, and a bias circuit connected together by connecting wiring. The bias circuit receives an input of an AC signal from the amplification circuit via the connecting wiring. A DC voltage of the bias circuit conformed to the amplitude of the AC signal of the amplification circuit is supplied to the amplification circuit via the connecting wiring.
摘要:
The invention provides a semi-conductor light valve device and a process for fabricating the same. The device comprises a composite substrate having a supporte substrate, a light-shielding thin film formed on said supporte substrate and semiconductive thin film disposed on the light-shielding thin film with interposing an insulating thin film. A switching element made of a transistor and a transparent electrode for driving light valve are formed on the semiconductive thin film, and the switching element and the transparent electrode are connected electrically with each other. The transistor includes a channel region in the semiconductive thin film and a main gate electrode for controlling the conduction in the channel region, and the light-shielding thin film layer is so formed as to cover the channel region on the side opposite to said channel region, so as to prevent effectively a back channel and shut off the incident light.
摘要:
In a method of manufacturing a semiconductor chip, a wire is traveled in one way to cut a wafer into a plurality of chips while a wire train where wires are arranged by pitches of scribe lines is brought into contact with the scribe lines of the wafer linearly, and an abrasive solution is supplied to a contact portion thereof.
摘要:
A light valve device has a drive substrate integrated with a drive electrode. A transistor is connected to the drive electrode and a driving circuit energizes the drive electrode through the transistor. An opposed substrate is provided opposed to the drive electrode, and an electrooptical material layer is disposed between the drive substrate and the opposed substrate. The drive substrate has a structure comprising a substrate layer and a semiconductor single crystal thin film layer. The semiconductor single crystal thin film layer is made by thinning a semiconductor single crystal wafer which has been bonded to the substrate layer. The light valve device has a small size and high pixel density and can be formed using miniaturization technology. The light valve can be used for a small size, high resolution video projector and a color matrix display device.
摘要:
The present invention is provided for improving latch-up resistance in a semiconductor integrated circuit device employing CMOS structure, for preventing the photoelectric carriers from getting into the sensors and improving the afterimage characteristic in a semiconductor image sensor device, and for impurity the switching characteristic in a semiconductor device having bipolar element. An electron beam of over 2 MeV and 1E15/cm.sup.2 is irradiated to a monocrystal silicon semiconductor region in a substrate and then annealing is performed at a high temperature of over 200.degree. C. As a result, at 150 K., a shallow level traps of which the activation energy from a valence band EV is under 0.1 eV and which is produced at the concentration of about 1.2-1.7E15/cm.sup.3, and a deep level traps of which the activation energy is 0.28-0.32 eV and which is produced at the concentration of about 1.6-2.0E13/cm.sup.3 are obtained. Then a semiconductor substrate having both the level traps stated above as recombination centers in a band gap of silicon is obtained. The chip size of this semiconductor substrate doesn't increase, and furthermore the cost of it is low as an epi wafer is not used. As well, it is possible to manufacture a semiconductor integrated circuit device just before or just after a process step of evaluating the electrical characteristic of a semiconductor integrated circuit device.
摘要:
A thermosensitive semiconductor device has a semiconductor substrate of one conductivity type which is used as the common collector of at least two Darlington-connected transistors. The base of the first stage transistor is connected to the common collector to form a first terminal and the emitter of the final stage transistor forms a second terminal. A constant current source is connected between the first and second terminals. To reduce deviations in the temperature response, a second collector region can be used and which can extend to a depth deeper than the depth of the emitter of the final stage transistor to absorb some of the carriers injected by the emitter.
摘要:
The output voltage of a power source is converted into a time signal by a circuit comprising a capacitor to which the voltage is applied, an MOS-FET connected across the capacitor and controlling its discharge rate in accordance with the voltage of the power source and a switching circuit which controls the MOS-FET. The time period representing the voltage of the power source is displayed digitally by counting the number of standard pulses occurring during the time period and digitally displaying the pulse count.
摘要:
A bypass capacitance is connected to a node between first and second self-bias resistances connected in series between an input and an output of an inverter. The bypass capacitance accommodates changes in the output voltage of the inverter to suppress the feedback effect from the output side to the input side of the inverter. That is, the bypass capacitance plays the role of suppressing a decrease in the input impedance by the Miller effect.
摘要:
A semiconductor device including multiple high-voltage drive transistors in its output section is improved in electrostatic withstand voltage by connecting electrostatic protection transistors in parallel with the high-voltage drive transistors connected to the output pads. The drain withstand voltage of the electrostatic protection transistors is made lower than the drain withstand voltage of the high-voltage drive transistors. In addition, the channel length of electrostatic protection transistors is made short to enable efficient bipolar operation of the electrostatic protection transistors.
摘要:
The semiconductor nonvolatile memory has integrated memory cells, each being operative to carry out writing and reading of information in random-access basis and having an electric charge storage structure effective to memorize the information in nonvolatile state. The information is temporarily written into each memory cell in volatile state, and thereafter the temporarily written information is written at one into the respective electric charge storage structure of each memory cell, thereby effecting quick writing of nonvolatile information into the respective memory cells of multi-bits.