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1.发明授权
公开(公告)号：US5087658A
公开(公告)日：1992-02-11
申请号：US452520
申请日：1989-12-18
IPC分类号： H01B3/30 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/532 , H05K1/00 , H05K3/28 , H05K3/46
CPC分类号： H01B3/303 , H01L23/293 , H01L23/3135 , H01L23/49894 , H01L23/5329 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K3/285 , H05K3/4664 , H05K3/4676
摘要： A heat-resistant resin paste consisting essentially of a first organic liquid (A.sub.1), a second organic liquid (A.sub.2), a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting essentially of the first organic liquid (A.sub.1) and the second organic liquid (A.sub.2), and fine particles of a heat-resistant resin (C) which are soluble in the first organic liquid (A.sub.1), but insoluble in the second organic liquid (A.sub.2). The first organic liquid (A.sub.1), the second organic liquid (A.sub.2), and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed. The heat-resistant resin paste may be suitably used for screen process printing to provide integrated circuit devices with insulator layers or surface protecting layers. The heat-resistant resin paste is suitable for forming insulator layers or surface protecting layers in integrated circuit devices by employing screen process printing.
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2.发明授权Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste 失效由耐热树脂浆料制成的树脂层制成的集成电路装置
公开(公告)号：US5164816A
公开(公告)日：1992-11-17
申请号：US739829
申请日：1991-08-02
IPC分类号： H01B3/30 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/532 , H05K1/00 , H05K3/28 , H05K3/46
CPC分类号： H01B3/303 , H01L23/293 , H01L23/3135 , H01L23/49894 , H01L23/5329 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H05K3/285 , H05K3/4664 , H05K3/4676
摘要： An integrated circuit device wherein layer insulation is attained by at least one of (i) an insulator layer interposed between two adjacent conductor layers, and (ii) a surface protecting layer fixedly covering the surface of the semiconductor chip, each of the insulator layer and the surface protecting layer being made of a heat-resistant resin obtainable by heating a heat-resistant resin paste. Said paste consists essentially of a first organic liquid, a second organic liquid, a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid and the second organic liquid, and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid but insoluble in the second organic liquid. The first organic liquid, the second organic liquid and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.
摘要翻译： 一种集成电路器件，其中通过以下中的至少一个获得层间绝缘：（i）插入在两个相邻的导体层之间的绝缘体层，以及（ii）固定地覆盖半导体芯片的表面的表面保护层，绝缘体层和 表面保护层由耐热树脂浆料加热得到的耐热树脂制成。 所述糊基本上由第一有机液体，第二有机液体，可溶于由第一有机液体和第二有机液体组成的有机液体混合物中的耐热树脂（B） 可溶于第一有机液体但不溶于第二有机液体的耐热树脂（C）。 将第一有机液体，第二有机液体和耐热性树脂（B）置于分散有耐热性树脂（C）的微粒子的溶液中。
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公开(公告)号：US5037862A
公开(公告)日：1991-08-06
申请号：US204190
申请日：1988-06-08
CPC分类号： C08J3/091 , C08L79/08 , C09D11/102 , C08J2379/08 , H05K1/0346 , H05K1/0373 , H05K3/4676
摘要： Disclosed is a polyamide-imide resin paste which comprises polyamide-imide resin solution dissolved in a non-nitrogen-containing solvent, wherein resin fine particles are dispersed in the solution in an amount of 1 to 50% by weight relative to the resulting polyamide-imide resin paste.According to the present invention, there can be provided a paste which does not cause any clogging of screen due to adhesion of the paste even in repeated printings over a long period of time and shows an excellent mechanical stability of a paste in printing.
摘要翻译： 公开了一种聚酰胺酰亚胺树脂浆料，其包含溶解在不含氮的溶剂中的聚酰胺 - 酰亚胺树脂溶液，其中树脂细颗粒相对于所得的聚酰胺 - 酰亚胺树脂浆以1至50重量％的量分散在溶液中， 酰亚胺树脂糊。 根据本发明，可以提供一种糊剂，即使在长时间的反复印刷中也不会由于糊剂的粘附而导致屏幕堵塞，并且在印刷中显示出优异的糊剂的机械稳定性。
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公开(公告)号：US5874518A
公开(公告)日：1999-02-23
申请号：US275270
申请日：1994-07-15
申请人： Kenji Suzuki , Yoshiyuki Mukoyama , Toshihiko Ito
发明人： Kenji Suzuki , Yoshiyuki Mukoyama , Toshihiko Ito
IPC分类号： C08G18/34 , C08G18/76 , C08G18/83 , C08G59/40 , C08G59/44 , C08G59/54 , C08G69/44 , C08G69/48 , C08G73/10 , C08J5/18 , C08L63/00
摘要： An epoxy-modified polyamide resin obtained by reacting a diisocyanate(A) with at least one member selected from the group consisting of a dicarboxylic acid and a tricarboxylic acid anhydride (B) in a nitrogen-containing aprotic solvent to form a polyamide resin intermediate and reacting this polyamide resin intermediate with an epoxy resin (C) in the nitrogen-containing aprotic solvent. This epoxy-modified polyamide resin has a high molecular weight and can provide a film with excellent heat resistance and flexibility, and its composition can be used as a coating material, adhesive or such in the form as it is.
摘要翻译： 通过使二异氰酸酯（A）与选自二羧酸和三羧酸酐（B）中的至少一种的物质在含氮非质子传递溶剂中反应形成聚酰胺树脂中间体而得到的环氧改性聚酰胺树脂， 使该聚酰胺树脂中间体与环氧树脂（C）在含氮的非质子溶剂中反应。 该环氧改性聚酰胺树脂具有高分子量，并且可以提供具有优异的耐热性和柔性的膜，并且其组成可以以其原样形式用作涂料，粘合剂等。
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5.发明授权Amid group-containing diisocyanates and amide group-containing epoxy resins 失效在含有二甲基的二异氰酸酯和含酰胺基的环氧树脂中
公开(公告)号：US5625026A
公开(公告)日：1997-04-29
申请号：US245671
申请日：1994-05-18
申请人： Kenji Suzuki , Yoshiyuki Mukoyama , Toshihiko Ito
发明人： Kenji Suzuki , Yoshiyuki Mukoyama , Toshihiko Ito
IPC分类号： C07C265/08 , C07D413/14 , C08G18/58 , C08G18/80 , C08G59/28 , C07D413/12 , C08G18/78
CPC分类号： C07D413/14 , C07C265/08 , C08G18/58 , C08G18/8048 , C08G59/28
摘要： An amide group-containing epoxy resin obtained by reacting an epoxy resin with an amide group-containing diisocyanate obtained by reacting a diisocyanate with a dicarboxylic acid gives a uniform cured article showing high adhesiveness and is usable as an adhesive, a coating composition, and the like.
摘要翻译： 通过使二异氰酸酯与二羧酸反应得到的含有酰胺基的二异氰酸酯使环氧树脂与通过使二异氰酸酯反应而得到的含酰胺基的环氧树脂，得到粘合性高的粘合剂，涂料组合物和 喜欢。
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6.发明授权Amide group-containing diisocyanates and amide group-containing epoxy resins 失效含酰胺基的二异氰酸酯和含酰胺基的环氧树脂
公开(公告)号：US5591813A
公开(公告)日：1997-01-07
申请号：US470630
申请日：1995-06-06
申请人： Kenji Suzuki , Yoshiyuki Mukoyama , Toshihiko Ito
发明人： Kenji Suzuki , Yoshiyuki Mukoyama , Toshihiko Ito
IPC分类号： C07C265/08 , C07D413/14 , C08G18/58 , C08G18/80 , C08G59/28 , C08G18/28 , C08G18/77
CPC分类号： C07D413/14 , C07C265/08 , C08G18/58 , C08G18/8048 , C08G59/28
摘要： An amide group-containing epoxy resin obtained by reacting an epoxy resin with an amide group-containing diisocyanate obtained by reacting a diisocyanate with a dicarboxylic acid gives a uniform cured article showing high adhesiveness and is usable as an adhesive, a coating composition, and the like.
摘要翻译： 通过使二异氰酸酯与二羧酸反应得到的含有酰胺基的二异氰酸酯使环氧树脂与通过使二异氰酸酯反应而得到的含酰胺基的环氧树脂，得到粘合性高的粘合剂，涂料组合物和 喜欢。
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公开(公告)号：US06372859B1
公开(公告)日：2002-04-16
申请号：US09424550
申请日：1999-11-26
申请人： Touichi Sakata , Hiroshi Nishizawa , Keizo Hirai , Kenji Suzuki
发明人： Touichi Sakata , Hiroshi Nishizawa , Keizo Hirai , Kenji Suzuki
IPC分类号： C08L7700
CPC分类号： C09J9/00 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L2224/32014 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2924/01012 , H01L2924/01015 , H01L2924/01021 , H01L2924/01039 , H01L2924/01057 , H01L2924/01079 , H01L2924/10253 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermoresistance adhesive which does not dissolve in the sealer-composing resins at the sealer molding temperature and is capable of providing a semiconductor chip/lead frame adhesive strength under shear of 1 N/4 mm2 or greater, and including, for example, amide, imide, ester or ether linkage is suited for use in producing thermoresistance adhesive solutions and thermoresistance resin pastes, and the semiconductor chips, lead frames, films, etc., made by using such an adhesive are suited for providing low-cost semiconductor devices.
摘要翻译： 一种热封粘合剂，其在密封件成型温度下不溶解在密封剂组合树脂中，并且能够在1N / 4mm 2或更大的剪切下提供半导体芯片/引线框架粘合强度，并且包括例如酰胺， 酰亚胺，酯或醚键适用于生产耐热粘合剂溶液和耐热树脂浆料，并且使用这种粘合剂制成的半导体芯片，引线框架，薄膜等适于提供低成本的半导体器件。
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公开(公告)号：US5540857A
公开(公告)日：1996-07-30
申请号：US360088
申请日：1994-12-20
申请人： Osamu Hirai , Noriji Tashiro , Osamu Watanabe , Hiroshi Nishizawa , Kenji Suzuki
发明人： Osamu Hirai , Noriji Tashiro , Osamu Watanabe , Hiroshi Nishizawa , Kenji Suzuki
CPC分类号： C09K19/52 , C09K19/00 , Y10T428/1023
摘要： Liquid crystals purified by treating with porous particles of a compound having one or more imide groups, or a liquid crystal composition comprising one or more liquid crystals and porous particles of a compound having one or more imide groups can provide a liquid crystal cell having a high voltage retention rate and a liquid crystal display device having high display properties.
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公开(公告)号：US5422034A
公开(公告)日：1995-06-06
申请号：US164710
申请日：1993-12-10
申请人： Osamu Hirai , Noriji Tashiro , Osamu Watanabe , Hiroshi Nishizawa , Kenji Suzuki
发明人： Osamu Hirai , Noriji Tashiro , Osamu Watanabe , Hiroshi Nishizawa , Kenji Suzuki
CPC分类号： C09K19/52 , C09K19/00 , Y10T428/1023
摘要： Liquid crystals purified by treating with porous particles of a compound having one or more imide groups, or a liquid crystal composition comprising one or more liquid crystals and porous particles of a compound having one or more imide groups can provide a liquid crystal cell having a high voltage retention rate and a liquid crystal display device having high display properties.
摘要翻译： 通过用具有一个或多个酰亚胺基团的化合物的多孔颗粒或包含一种或多种液晶的液晶组合物和具有一个或多个酰亚胺基团的化合物的多孔颗粒处理而提纯的液晶可以提供具有高 电压保持率和具有高显示特性的液晶显示装置。
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公开(公告)号：US5847071A
公开(公告)日：1998-12-08
申请号：US843860
申请日：1997-04-17
CPC分类号： C08G73/1025 , C07C275/40 , C08G73/0677 , C08G73/10 , C08G73/1042 , C08G73/1067 , C08G73/1071 , C08G73/1085 , C08G73/16 , G03F7/0387
摘要： A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
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