摘要:
A non-volatile flash memory (100) that may have an improved layout freedom is disclosed. Non-volatile flash memory (100) may include banks (B0 and B1). Each bank (B0 and B1) may include memory cell arrays (MCA00 to MCA03) including a plurality of memory cells (MC) connected to sub bit lines (LB). A plurality of sub bit lines (LB) may be selectively connected to a main bit line (MB) by a group switch (Y1S0 and Y1S1). A group of main bit lines (MB) may be disposed over a memory cell array. A group of main bit lines (MB) may be selectively connected to a sense amplifier block (SAB) by a group switch group (Y2S0 and Y2S1) and a bank switch group (Y3S0 and Y3S1). In this way, a sense amplifier block (SAB) may be shared by a plurality of groups of main bit lines (MB). In this way, layout freedom may be improved.
摘要:
A plurality of memory cells are arranged in lattice arrangement to form a memory cell array. Each of the memory cells is provided with a source. Data in the memory cell can be electrically written and erased. Sources of all the memory cells are connected in common. Also, a source voltage control circuit having two or more kinds of load characteristics is connected to the sources connected in common. According to a load characteristics selected from a plurality of load characteristics, source voltage of the memory cell is controlled.
摘要:
A voltage reducing circuit includes an internal power supply section configured to reduce an external power supply voltage supplied from an external power supply to an internal power supply voltage which is lower than the external power supply voltage based on a reference voltage. A first current control section is configured to control a current flowing through the internal power supply section when the internal power supply voltage is lower than a setting voltage. A second current control section is configured to control the current flowing through the internal power supply section when the internal power supply voltage exceeds the setting voltage.
摘要:
Provided is a semiconductor device including a step-down circuit group including multiple step-down circuits that step down an external power supply voltage to a predetermined voltage; multiple functional circuits that require a reset operation upon power-on; and a power-on reset circuit that outputs a reset command to the multiple functional circuits, when an internal power supply voltage supplied from the step-down circuit group exceeds a voltage level necessary for an initialization operation. The multiple step-down circuits of the step-down circuit group are classified into a startup operating step-down circuit group that performs a step-down operation from power-on to supply the internal power supply voltage, and a startup non-operating step-down circuit group that stops operation upon power-on to interrupt supply of the internal power supply voltage. The startup non-operating step-down circuit group includes the multiple step-down circuits sequentially selected from one having a shortest wiring distance from the power-on reset circuit.
摘要:
Disclosed is a device and a method for enabling a programmable semiconductor memory device to provide a block selection transistor of a high voltage withstand type, to prevent the voltage from being decreased at the time of programming, to prevent the readout current from being decreased and to provide a constant sum resistance of the electrically conductive regions without dependency upon the memory cell locations.
摘要:
According to the present invention, a voltage of 10.5 V, a voltage of 6.5 V and a voltage of 0.5 V are respectively applied to the control gate, the drain and the source of a memory cell that is a programming target. And a voltage of 0 V (a ground voltage) is applied to the control gate of a memory cell that is not a programming target and that does not belong to the row in which of the programming target memory cell is located. As a result, it is ensured that the memory cell that is not the programming target is non-conductive, and that the drain-substrate electrical field of the memory cell that is the programming target is reduced.
摘要:
A semiconductor device includes a P-type semiconductor substrate, an N-type well region formed on the surface of the substrate, a P-type well region formed in the N-type well region and a MOSFET as a flash memory element formed in the P-type well region. Upon erasure of the information in the flash memory, a high voltage is temporarily charged to the P-type and N-type well regions, in such a manner that a first high voltage pulse of a predetermined width is charged to the N-type well region, a second high voltage pulse having a pulse width narrower than the pulse width of the first pulse is charged to the P-type well region in a period between the initiation end and the termination end of the first pulse.
摘要:
A redundant address memory circuit is used in a memory element exchange circuit associated to a memory matrix composed of FAMOS memory cells and provided with a redundant memory array composed of FAMOS memory cells. The redundant address memory circuit comprises a FAMOS memory cell for storing a defective address, and an output circuit connected to the defective address storing FAMOS memory cell for generating an output signal corresponding to the content of the defective address storing FAMOS memory cell. In addition, there is provided a circuit connected to the defective address storing FAMOS memory cell and to the output circuit for receiving the content of the defective address storing FAMOS memory cell through the output circuit so as to write the content of the defective address storing FAMOS memory cell into the defective address storing FAMOS memory cell when a new data is written to the memory matrix.
摘要:
A semiconductor device with technology for externally deciding if the stress test was performed or not. A semiconductor device includes a stress test circuit and a stress test decision circuit. The stress test circuit outputs control signals for executing the stress test to the stress test decision circuit and the object for testing. The stress test decision circuit then outputs the decision results if the stress test was performed, based on the control signals.
摘要:
A conventional layout of power supply protective element cannot sufficiently protect an internal circuit against a surge current that flows into a narrow branch line that branches off from a thick main wiring line. A semiconductor device according to an embodiment of the present invention includes a power supply protective element connected around a terminal; a main wiring line connected with a VCC pad or a GND pad; a branch line that branches off from the main wiring line and applies a power supply potential or a ground potential to a functional block of the semiconductor device; a branching portion at which the branch line branches off from the main wiring line; and an internal power supply protective element connected with the branch line.