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    FUEL SUPPLY AMOUNT ADJUSTMENT FILM, PRINTED CIRCUIT BOARD, AND FUEL CELL
    4.
    发明申请
    FUEL SUPPLY AMOUNT ADJUSTMENT FILM, PRINTED CIRCUIT BOARD, AND FUEL CELL 审中-公开
    燃油供应量调整膜，印刷电路板和燃料电池

    公开(公告)号：US20120141840A1

    公开(公告)日：2012-06-07

    申请号：US13288519

    申请日：2011-11-03

    申请人： Shinichi INOUE ,  Hirofumi EBE

    发明人： Shinichi INOUE ,  Hirofumi EBE

    IPC分类号： H01M8/04 ,  H01M2/02 ,  H01M2/00

    CPC分类号： H01M8/04201 ,  H01M8/0239 ,  H01M8/0247 ,  H01M8/0269 ,  H01M8/04186 ,  H01M8/1011 ,  Y02E60/523

    摘要： A base insulating layer in an FPC board is used as a fuel supply amount adjustment film for a fuel cell. The base insulating layer in the FPC board has a plurality of anisotropic through pores. The anisotropic through pores respectively has openings on one surface and the other surface of the base insulating layer. The respective openings on the one surface and the other surface of the base insulating layer communicate with each other without diverging by a single communication path. The communication path has a shape that can specify a long axis and a short axis perpendicular to the long axis. The long axis extends in a direction intersecting the one surface and the other surface of the base insulating layer at a predetermined angle.

    摘要翻译： 作为燃料电池的燃料供给量调整膜，使用FPC基板的基底绝缘层。 FPC基板中的基底绝缘层具有多个各向异性通孔。 各向异性通孔分别在基体绝缘层的一个表面和另一个表面上具有开口。 基底绝缘层的一个表面和另一个表面上的相应开口彼此连通，而不会通过单个连通路径发散。 通信路径具有可以指定长轴和垂直于长轴的短轴的形状。 长轴在与基体绝缘层的一个表面和另一个表面相交的方向上以预定角度延伸。

    PRINTED CIRCUIT BOARD, FUEL CELL AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    5.
    发明申请
    PRINTED CIRCUIT BOARD, FUEL CELL AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板，燃料电池和制造印刷电路板的方法

    公开(公告)号：US20110281202A1

    公开(公告)日：2011-11-17

    申请号：US13097155

    申请日：2011-04-29

    申请人： Hiroyuki HANAZONO ,  Shinichi INOUE ,  Mineyoshi HASEGAWA ,  Keisuke OKUMURA ,  Hirofumi EBE

    发明人： Hiroyuki HANAZONO ,  Shinichi INOUE ,  Mineyoshi HASEGAWA ,  Keisuke OKUMURA ,  Hirofumi EBE

    IPC分类号： H01M8/04 ,  H05K1/00 ,  H05K3/10

    CPC分类号： H01M8/0269 ,  H01M8/1011 ,  H01M8/2465 ,  Y02E60/523 ,  Y02P70/56 ,  Y10T29/49155

    摘要： An FPC board, electrode films and a fuel accommodating chamber are accommodated in a casing. In the FPC board, a plurality of collector portions are joined onto a base insulating layer with an adhesive pattern sandwiched therebetween. The base insulating layer is made of porous ePTFE, and is air-permeable. Openings are formed in the collector portions. The adhesive pattern has the same shape as the plurality of collector portions. The FPC board is sandwiched by an upper surface portion and a lower surface portion of the casing while being bent along a bend portion. The electrode films are arranged between the plurality of collector portions of the FPC board. The fuel accommodating chamber is provided between the FPC board and the lower surface portion so as to come in contact with the base insulating layer. A liquid fuel is supplied to the fuel accommodating chamber.

    摘要翻译： FPC基板，电极膜和燃料容纳室容纳在壳体中。 在FPC基板中，将多个集电体部分接合到基底绝缘层上，其中夹有粘合剂图案。 基底绝缘层由多孔ePTFE制成，是透气的。 开口形成在收集器部分中。 粘合剂图案具有与多个集电体部分相同的形状。 FPC基板沿着弯曲部弯曲而夹在壳体的上表面部分和下表面部分之间。 电极膜配置在FPC基板的多个集电部之间。 燃料容纳室设置在FPC基板和下表面部分之间以与基底绝缘层接触。 液体燃料被供给到燃料容纳室。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号：US20090195998A1

    公开(公告)日：2009-08-06

    申请号：US12357714

    申请日：2009-01-22

    申请人： Yasuto ISHIMARU ,  Hirofumi EBE

    发明人： Yasuto ISHIMARU ,  Hirofumi EBE

    IPC分类号： H05K1/18 ,  H05K3/10

    CPC分类号： H05K3/303 ,  H01L23/3735 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K1/0269 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49162

    摘要： A mounting region having a rectangular shape is provided at an approximately center of one surface of an insulating layer. A plurality of conductive traces are formed so as to outwardly extend from the inside of the mounting region. A cover insulating layer is formed so as to cover the plurality of conductive traces in a periphery of the mounting region. An electronic component is mounted on the insulating layer so as to overlap with the mounting region. A metal layer is provided on the other surface of the insulating layer. Openings having a rectangular shape are formed in the metal layer along a pair of longer sides and a pair of shorter sides of the mounting region. The openings are opposite to part of terminals of the plurality of conductive traces, respectively, with the insulating layer sandwiched therebetween.

    摘要翻译： 在绝缘层的一个表面的大致中心处设置具有矩形形状的安装区域。 多个导电迹线被形成为从安装区域的内部向外延伸。 形成覆盖绝缘层，以覆盖安装区域周边的多个导电迹线。 电子部件安装在绝缘层上以与安装区域重叠。 在绝缘层的另一个表面上设置金属层。 具有矩形形状的开口沿着一对长边和安装区域的一对较短边形成在金属层中。 开口分别与多个导电迹线的端子的一部分相对，绝缘层夹在其间。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    7.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号：US20090277667A1

    公开(公告)日：2009-11-12

    申请号：US12426404

    申请日：2009-04-20

    申请人： Hirofumi EBE ,  Yasuto ISHIMARU

    发明人： Hirofumi EBE ,  Yasuto ISHIMARU

    IPC分类号： H05K1/09 ,  B05D5/12

    CPC分类号： H05K1/0271 ,  H01L23/3735 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0209 ,  H05K1/189 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10674

    摘要： A mounting region is provided at a substantially center of one surface of an insulating layer. A metal layer is provided on the other surface of the insulating layer. A slit is formed to cross a region (an opposite region) of the metal layer that coincides with the mounting region and to divide the metal layer. A plurality of regions (large regions) of the metal layer divided by the slit each include a partial region (small region) of the opposite region. The area of each large region is set corresponding to the area of the small region included therein. Specifically, the small region having the area of A [%] with respect to the whole area of the opposite region is included in the large region having the area of (A±δ) [%] with respect to the whole area of the metal layer. Here, δ is an acceptable error range, and the acceptable error range δ is not more than (A×0.3).

    摘要翻译： 安装区域设置在绝缘层的一个表面的大致中心处。 在绝缘层的另一个表面上设置金属层。 形成狭缝以与金属层的与安装区域重合的区域（相对区域）交叉并分割金属层。 由狭缝分割的金属层的多个区域（大区域）各自包括相对区域的部分区域（小区域）。 每个大区域的面积对应于其中包括的小区域的面积。 具体而言，相对于金属的整个面积，面积为（A±δ）[％]的面积相对于相对区域的整个面积的面积为A [％]的小区域被包含在 层。 这里，delta是可接受的误差范围，可接受的误差范围delta不大于（Ax0.3）。

    CONNECTION STRUCTURE BETWEEN PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT
    8.
    发明申请
    CONNECTION STRUCTURE BETWEEN PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT 有权
    印刷电路板与电子元件之间的连接结构

    公开(公告)号：US20090011617A1

    公开(公告)日：2009-01-08

    申请号：US12163062

    申请日：2008-06-27

    申请人： Hirofumi EBE ,  Yasuto ISHIMARU

    发明人： Hirofumi EBE ,  Yasuto ISHIMARU

    IPC分类号： H01R12/00

    CPC分类号： H05K1/111 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3473 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09727 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613

    摘要： Each wiring pattern is composed of a conductor layer and a tin plating layer, and includes a tip portion, a connection portion and a signal transmission portion. The width of the tip portion is equal to the width of the signal transmission portion, and the width of the connection portion is smaller than the widths of the tip portion and the signal transmission portion. The connection portions of wiring patterns and bumps of an electronic component are connected to one another, respectively, by heat-sealing when the electronic component is mounted. Respective distances A1, A2 are set to not less than 0.5 μm. Respective distances B1, B2 are set to not less than 20 μm. The thickness of the tin plating layer is set to not less than 0.07 μm and not more than 0.25 μm.

    摘要翻译： 每个布线图案由导体层和镀锡层组成，并且包括尖端部分，连接部分和信号传输部分。 前端部分的宽度等于信号传输部分的宽度，连接部分的宽度小于前端部分和信号传输部分的宽度。 电子部件的布线图案和凸块的连接部分分别通过在安装电子部件时进行热封而相互连接。 各距离A1，A2设定为不小于0.5μm。 各距离B1，B2设定为不小于20um。 镀锡层的厚度设定为0.07μm以上且0.25μm以下。