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1.发明申请PRINTED CIRCUIT BOARD, FUEL CELL AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开印刷电路板，燃料电池和制造印刷电路板的方法公开(公告)号：US20110281202A1
公开(公告)日：2011-11-17
申请号：US13097155
申请日：2011-04-29
CPC分类号： H01M8/0269 , H01M8/1011 , H01M8/2465 , Y02E60/523 , Y02P70/56 , Y10T29/49155
摘要： An FPC board, electrode films and a fuel accommodating chamber are accommodated in a casing. In the FPC board, a plurality of collector portions are joined onto a base insulating layer with an adhesive pattern sandwiched therebetween. The base insulating layer is made of porous ePTFE, and is air-permeable. Openings are formed in the collector portions. The adhesive pattern has the same shape as the plurality of collector portions. The FPC board is sandwiched by an upper surface portion and a lower surface portion of the casing while being bent along a bend portion. The electrode films are arranged between the plurality of collector portions of the FPC board. The fuel accommodating chamber is provided between the FPC board and the lower surface portion so as to come in contact with the base insulating layer. A liquid fuel is supplied to the fuel accommodating chamber.
摘要翻译： FPC基板，电极膜和燃料容纳室容纳在壳体中。 在FPC基板中，将多个集电体部分接合到基底绝缘层上，其中夹有粘合剂图案。 基底绝缘层由多孔ePTFE制成，是透气的。 开口形成在收集器部分中。 粘合剂图案具有与多个集电体部分相同的形状。 FPC基板沿着弯曲部弯曲而夹在壳体的上表面部分和下表面部分之间。 电极膜配置在FPC基板的多个集电部之间。 燃料容纳室设置在FPC基板和下表面部分之间以与基底绝缘层接触。 液体燃料被供给到燃料容纳室。
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公开(公告)号：US20120061126A1
公开(公告)日：2012-03-15
申请号：US13221212
申请日：2011-08-30
申请人： Shinichi INOUE , Hiroyuki HANAZONO , Hirofumi EBE
发明人： Shinichi INOUE , Hiroyuki HANAZONO , Hirofumi EBE
CPC分类号： C08K5/3472 , C08G18/4219 , C08G18/8061 , C08G59/50 , C08G59/508 , C08K3/04 , C08K3/041 , C08K3/08 , C09D17/005 , C09D163/00 , C09D175/06 , H01M8/0206 , H01M8/0213 , H01M8/0221 , H01M8/0226 , H01M8/0247 , H01M8/1011 , H01M8/2475 , Y02E60/523 , C08L63/00
摘要： A conductor layer is formed on one surface of a base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and drawn-out conductor portions extending in long-sized shapes from the collector portions, respectively. Cover layers are formed on the base insulating layer to cover respective given portions of the conductor layer. A paste composition containing a compound represented by the formula (1) is used as a material for the cover layer.
摘要翻译： 在基底绝缘层的一个表面上形成导体层。 导体层由一对矩形集电体部分和从收集部分分别延伸成长形状的拉出导体部分组成。 覆盖层形成在基底绝缘层上以覆盖导体层的各个给定部分。 使用含有式（1）表示的化合物的糊剂组合物作为覆盖层的材料。
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公开(公告)号：US20110277321A1
公开(公告)日：2011-11-17
申请号：US13083097
申请日：2011-04-08
IPC分类号： H05K3/10
CPC分类号： H05K3/20 , H05K1/0393 , Y10T29/49117 , Y10T29/49144 , Y10T29/49155
摘要： A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured.
摘要翻译： 在由载体层和导体层构成的两层基材的导体层上形成抗蚀剂膜。 接下来，将抗蚀剂膜曝光和显影，从而形成抗蚀剂图案。 通过蚀刻除去未被抗蚀剂图案覆盖的露出的导体层的区域。 通过去除抗蚀剂图案形成导体图案。 然后，在包括导体图案的上表面的整个表面上施加粘合剂层前体。 粘合剂层前体被曝光和显影，使得在导体图案上形成粘合剂图案。 之后，将基底绝缘层接合到导体图案上，其中夹有粘合剂图案。 最后，将载体层与导体图案分离，从而制造FPC基板。
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公开(公告)号：US20110189508A1
公开(公告)日：2011-08-04
申请号：US13019460
申请日：2011-02-02
申请人： Shinichi INOUE , Hiroyuki HANAZONO
发明人： Shinichi INOUE , Hiroyuki HANAZONO
摘要： Collector portions, connection conductor portions and drawn-out conductor portions are formed on one surface of a base insulting layer of an FPC board. The collector portions, the connection conductor portions and the drawn-out conductor portions are covered with cover layers. The cover layers contain a resin composition. The resin composition has moisture permeability of not more than 150 g/(m2·24 h) in an environment at a temperature of 40° C. and with a relative humidity of 90%. The resin composition has a glass transition temperature of not less than 80° C.
摘要翻译： 集电体部分，连接导体部分和引出导体部分形成在FPC基板的基底绝缘层的一个表面上。 集电体部分，连接导体部分和引出导体部分被覆盖层覆盖。 覆盖层含有树脂组合物。 在40℃，相对湿度90％的环境下，树脂组合物的透湿度不超过150g /（m2·24h）。 树脂组合物的玻璃化转变温度不低于80℃
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公开(公告)号：US20120024581A1
公开(公告)日：2012-02-02
申请号：US13094941
申请日：2011-04-27
CPC分类号： H05K1/034 , H01B3/445 , H05K1/0393 , H05K3/06 , H05K3/108 , H05K3/28 , H05K2201/0116 , H05K2201/015
摘要： A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 μm and not more than 1.0 μm.
摘要翻译： 在由多孔ePTFE制成的多孔基底绝缘层上形成多个导体迹线。 每个导体迹线具有种子层和导体层的层叠结构。 覆盖绝缘层形成在基底绝缘层上以覆盖每个导体迹线。 用作多孔基底绝缘层的ePTFE具有连续的孔。 ePTFE的平均孔径不小于0.05μm且不大于1.0μm。
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公开(公告)号：US20120024574A1
公开(公告)日：2012-02-02
申请号：US13187830
申请日：2011-07-21
CPC分类号： H05K3/108 , H05K1/0274 , H05K1/0393 , H05K3/28 , H05K2201/0116 , H05K2201/2054
摘要： A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the base insulating layer has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region from 400 nm to 800 nm.
摘要翻译： 印刷电路板包括由多孔膜形成的基底绝缘层。 在由多孔膜形成的基底绝缘层上形成导体迹线。 在绝缘绝缘层上形成覆盖导体迹线的覆盖绝缘层。 用作基底绝缘层的多孔膜对于在400nm至800nm的波长区域中的至少一部分波长的光具有不小于50％的反射率。
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公开(公告)号：US20110076522A1
公开(公告)日：2011-03-31
申请号：US12884763
申请日：2010-09-17
申请人： Hiroyuki HANAZONO , Shinichi INOUE
发明人： Hiroyuki HANAZONO , Shinichi INOUE
CPC分类号： H05K1/0326 , H01M8/006 , H01M8/0269 , H01M8/1011 , H01M8/1097 , H05K1/0393 , H05K2201/0141 , Y02E60/523
摘要： An FPC board includes a base insulating layer. The base insulating layer is composed of a first insulating portion and a second insulating portion. A bend portion is provided in the first insulating portion. A conductor layer is formed on one surface of the base insulating layer. The conductor layer is composed of a collector portion and a drawn-out conductor portion. A cover layer is formed to cover the conductor layer. A liquid crystal polymer is used as a material for the base insulating layer.
摘要翻译： FPC基板包括基底绝缘层。 基极绝缘层由第一绝缘部和第二绝缘部构成。 弯曲部分设置在第一绝缘部分中。 在基底绝缘层的一个表面上形成导体层。 导体层由集电部和拉出导体部构成。 形成覆盖层以覆盖导体层。 使用液晶聚合物作为基底绝缘层的材料。
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公开(公告)号：US20110111264A1
公开(公告)日：2011-05-12
申请号：US12912113
申请日：2010-10-26
申请人： Hiroyuki HANAZONO
发明人： Hiroyuki HANAZONO
CPC分类号： H05K1/16 , H01M8/0269 , H01M8/1011 , H05K1/0272 , H05K1/0393 , H05K3/244 , H05K2201/056 , H05K2201/09063 , H05K2201/09481 , Y02E60/523
摘要： A rectangular collector portion is formed on each of a first insulating portion and a second insulating portion. A cover layer is provided on the first insulating portion to cover the collector portion, and a cover layer is provided on the second insulating portion to cover the collector portion. A seal region is provided on the first insulating portion to surround the cover layer. A seal region is provided on the second insulating portion to surround the cover layer. Rectangular drawn-out conductor portions are formed on the back surface of the base insulating layer. The collector portion and the drawn-out conductor portion are electrically connected to each other, and the collector portion and the drawn-out conductor portion are electrically connected to each other.
摘要翻译： 在第一绝缘部分和第二绝缘部分中的每一个上形成矩形收集部分。 覆盖层设置在第一绝缘部分上以覆盖集电器部分，并且覆盖层设置在第二绝缘部分上以覆盖集电器部分。 密封区域设置在第一绝缘部分上以包围覆盖层。 密封区域设置在第二绝缘部分上以包围覆盖层。 矩形拉出导体部分形成在基底绝缘层的背面上。 集电体部分和引出导体部分彼此电连接，并且集电极部分和引出导体部分彼此电连接。
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公开(公告)号：US20100047653A1
公开(公告)日：2010-02-25
申请号：US12544254
申请日：2009-08-20
CPC分类号： H01M8/1011 , H01M8/0234 , H01M8/0239 , H01M8/0243 , H01M8/0245 , H01M8/2475 , H01M2250/30 , H05K1/028 , H05K1/0393 , H05K3/249 , H05K3/28 , H05K2201/0191 , Y02B90/18 , Y02E60/523
摘要： A pair of rectangular collector portions and extraction conductor portions that each extend in a long-sized shape from the respective collector portions are formed on one surface of a base insulating layer. A carbon containing layer is formed on the base insulating layer to cover the collector portion and the extraction conductor portion excluding a tip. A carbon containing layer and a solder resist layer are formed on the base insulating layer to cover the collector portion and the extraction conductor portion excluding a tip. The solder resist layer is formed to cover a portion of the extraction conductor portion above a bend portion.
摘要翻译： 在基底绝缘层的一个表面上形成一对矩形集电体部分和提取导体部分，每个矩形收集器部分和提取导体部分各自从各个集电部分延伸成长形状。 在基底绝缘层上形成含碳层，以覆盖除了尖端之外的集电体部分和提取导体部分。 在基底绝缘层上形成含碳层和阻焊层，以覆盖不包括尖端的集电体部分和提取导体部分。 阻焊层形成为覆盖在弯曲部分上方的提取导体部分的一部分。
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公开(公告)号：US20070272434A1
公开(公告)日：2007-11-29
申请号：US11751054
申请日：2007-05-21
申请人： Mitsuru HONJO , Hiroyuki HANAZONO
发明人： Mitsuru HONJO , Hiroyuki HANAZONO
IPC分类号： H05K1/00
CPC分类号： H05K3/382 , H05K1/0242 , H05K1/028 , H05K3/108 , H05K3/28 , H05K3/281 , H05K3/383 , H05K3/385 , H05K2201/0397
摘要： A printed circuit board has a bending portion and a non-bending portion. A base insulating layer is provided over the bending portion and the non-bending portion. A plurality of conductor patterns are formed on the insulating layer. A cover insulating layer is formed on the insulating layer to cover the plurality of conductor patterns. A surface region of the plurality of conductor patterns in the bending portion is roughened.
摘要翻译： 印刷电路板具有弯曲部分和非弯曲部分。 在弯曲部和非弯曲部上设置有基底绝缘层。 在绝缘层上形成多个导体图形。 在绝缘层上形成覆盖绝缘层以覆盖多个导体图案。 弯曲部中的多个导体图案的表面区域被粗糙化。
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