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1.发明申请LIQUID-COOLED INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF LIQUID-COOLED INTEGRATED SUBSTRATE 有权液体冷却集成基板和液体冷却集成基板的制造方法公开(公告)号：US20120305292A1
公开(公告)日：2012-12-06
申请号：US13521928
申请日：2011-01-12
CPC分类号： H05K1/0201 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0058 , H01L2924/00
摘要： There is provide a liquid-cooled integrated substrate which has reduced material cost and processing cost, is reduced in warpage (shape deformation) as an integrated substrate, and has excellent strength and heat radiation performance, and a manufacturing method of the liquid-cooled integrated substrate. There is provided a liquid-cooled integrated substrate 1 in which a metal circuit board 15 made of aluminum or an aluminum alloy is bonded to one surface of a ceramic substrate 10, one surface of a plate-like metal base plate 20 made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate 10, and a liquid-cooling type radiator 30 composed of an extrusion material is bonded to another surface of the metal base plate 20, wherein a relation between a thickness t1 of the metal circuit board 15 and a thickness t2 of the metal base plate 20 satisfies t2/t1≧2 where the thickness t1 of the metal circuit board 15 is 0.4 to 3 mm and the thickness t2 of the metal base plate 20 is 0.8 to 6 mm.
摘要翻译： 提供了一种液体冷却的一体化基板，其具有降低的材料成本和加工成本，减少作为一体基板的翘曲（形状变形），并且具有优异的强度和散热性能，以及液冷集成的制造方法 基质。 提供了一种液体冷却集成基板1，其中由铝或铝合金制成的金属电路板15结合在陶瓷基板10的一个表面上，由铝制成的板状金属基板20的一个表面 将铝合金结合到陶瓷基板10的另一表面，将由挤出材料构成的液冷式散热器30接合到金属基板20的另一个表面，其中金属电路的厚度t1 板15和金属基板20的厚度t2满足t2 /t1≥2，其中金属电路板15的厚度t1为0.4〜3mm，金属基板20的厚度t2为0.8〜6mm。
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2.发明授权公开(公告)号：US09320129B2
公开(公告)日：2016-04-19
申请号：US13521928
申请日：2011-01-12
IPC分类号： H05K1/00 , H05K1/02 , H01L23/373 , H01L23/473 , H05K1/03 , H05K3/00
CPC分类号： H05K1/0201 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0058 , H01L2924/00
摘要： There is provided a liquid-cooled integrated substrate 1 in which a metal circuit board 15 made of aluminum or an aluminum alloy is bonded to one surface of a ceramic substrate 10, one surface of a plate-like metal base plate 20 made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate 10, and a liquid-cooling type radiator 30 composed of a porous pipe composed of an extrusion material is bonded to another flat surface of the metal base plate 20 by brazing, wherein a relation between a thickness t1 of the metal circuit board 15 and a thickness t2 of the metal base plate 20 satisfies t2/t1≧2 where the thickness t1 of the metal circuit board 15 is 0.4 to 3 mm and the thickness t2 of the metal base plate 20 is 0.8 to 6 mm.
摘要翻译： 提供了一种液体冷却集成基板1，其中由铝或铝合金制成的金属电路板15结合在陶瓷基板10的一个表面上，由铝制成的板状金属基板20的一个表面 将铝合金与陶瓷基板10的另一面接合，由挤压材料构成的多孔管构成的液冷式散热器30通过钎焊与金属基板20的另一平面接合， 在金属电路板15的厚度t1和金属基板20的厚度t2之间，金属电路板15的厚度t1为0.4〜3mm，金属基板的厚度t2为t2 /t1≥2， 20为0.8〜6mm。
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3.发明授权Fin-integrated substrate and manufacturing method of fin-integrated substrate 有权散热一体化基板和翅片集成基板的制造方法公开(公告)号：US08927873B2
公开(公告)日：2015-01-06
申请号：US13521922
申请日：2011-01-12
申请人： Hisashi Hori , Hideyo Osanai , Takayuki Takahashi
发明人： Hisashi Hori , Hideyo Osanai , Takayuki Takahashi
IPC分类号： H05K1/00 , H01L23/373 , H01L23/473 , H01L21/48
CPC分类号： H01L23/473 , H01L21/4878 , H01L23/3735 , H01L2924/0002 , Y10T29/49144 , H01L2924/00
摘要： There is provide a manufacturing method of a fin-integrated substrate capable of producing by simple process a fin-integrated substrate with heat radiating fins at fine pitches by a processing method in which warpage of a metal base plate and corrugation (wavy shape) of the heat radiating fins are suppressed. There is provided a manufacturing method of a fin-integrated substrate in which bonding of the metal circuit board to the ceramic substrate is performed by a molten metal bonding method, and formation of the plurality of heat radiating fins at a cut part that is a part of the metal base plate is performed by fixing by a jig to apply a tensile stress on a surface of the cut part where the heat radiating fins are to be formed, and performing grooving processing of forming a plurality of grooves by moving a multi-cutter composed of a plurality of stacked disc-shaped cutters, on the surface to which the tensile stress is applied, while rotating the multi-cutter.
摘要翻译： 提供了一种翅片一体化基板的制造方法，其能够通过简单的工艺制造具有精细间距的散热翅片的翅片集成基板，其中金属基板的翘曲和波纹（波浪形） 散热片受到抑制。 提供了一种翅片一体化基板的制造方法，其中金属电路板与陶瓷基板的接合通过熔融金属接合方法进行，并且在作为部件的切割部分处形成多个散热片 通过夹具固定以在要形成散热片的切割部分的表面上施加拉伸应力，并且通过移动多切割器来进行形成多个凹槽的切槽加工 在多张切割器旋转的同时，在施加拉伸应力的表面上由多个堆叠的盘形切割器组成。
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4.发明申请公开(公告)号：US20120279761A1
公开(公告)日：2012-11-08
申请号：US13521922
申请日：2011-01-12
申请人： Hisashi Hori , Hideyo Osanai , Takayuki Takahashi
发明人： Hisashi Hori , Hideyo Osanai , Takayuki Takahashi
CPC分类号： H01L23/473 , H01L21/4878 , H01L23/3735 , H01L2924/0002 , Y10T29/49144 , H01L2924/00
摘要： There is provide a manufacturing method of a fin-integrated substrate capable of producing by simple process a fin-integrated substrate with heat radiating fins at fine pitches by a processing method in which warpage of a metal base plate and corrugation (wavy shape) of the heat radiating fins are suppressed. There is provided a manufacturing method of a fin-integrated substrate in which bonding of the metal circuit board to the ceramic substrate is performed by a molten metal bonding method, and formation of the plurality of heat radiating fins at a cut part that is a part of the metal base plate is performed by fixing by a jig to apply a tensile stress on a surface of the cut part where the heat radiating fins are to be formed, and performing grooving processing of forming a plurality of grooves by moving a multi-cutter composed of a plurality of stacked disc-shaped cutters, on the surface to which the tensile stress is applied, while rotating the multi-cutter.
摘要翻译： 提供了一种翅片一体化基板的制造方法，其能够通过简单的工艺制造具有精细间距的散热翅片的翅片集成基板，其中金属基板的翘曲和波纹（波浪形） 散热片受到抑制。 提供了一种翅片一体化基板的制造方法，其中金属电路板与陶瓷基板的接合通过熔融金属接合方法进行，并且在作为部件的切割部分处形成多个散热片 通过夹具固定以在要形成散热片的切割部分的表面上施加拉伸应力，并且通过移动多切割器来进行形成多个凹槽的切槽加工 在多张切割器旋转的同时，在施加拉伸应力的表面上由多个堆叠的盘形切割器组成。
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公开(公告)号：US20050084704A1
公开(公告)日：2005-04-21
申请号：US10969360
申请日：2004-10-19
IPC分类号： H01L23/12 , H01L23/13 , H01L23/14 , H01L23/373 , B32B15/04
CPC分类号： H01L23/142 , H01L23/13 , H01L23/3735 , H01L2924/0002 , Y10T428/12535 , Y10T428/12576 , Y10T428/12611 , Y10T428/24926 , H01L2924/00
摘要： There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and amethod for producing the same. Inametal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, at least part of the ceramic substrate 12 is embedded in the metal base plate 16. The ceramic substrate 12 is arranged substantially in parallel to the metal base member 16.
摘要翻译： 提供了具有提高的热循环可靠性的金属/陶瓷接合基板及其制造方法。 将陶瓷基板12的一侧的电路形成用金属板14与散热用金属基板16接合的其他陶瓷接合基板10的另一侧，至少部分陶瓷基板12嵌入 金属基板16.陶瓷基板12大致平行于金属基体16配置。
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公开(公告)号：US07073703B2
公开(公告)日：2006-07-11
申请号：US10673993
申请日：2003-09-29
CPC分类号： B32B15/20 , B32B15/04 , B32B18/00 , B32B2309/02 , B32B2309/022 , B32B2309/62 , B32B2311/24 , B32B2315/02 , C04B37/021 , C04B37/026 , C04B2235/658 , C04B2235/6581 , C04B2235/72 , C04B2235/96 , C04B2237/121 , C04B2237/128 , C04B2237/32 , C04B2237/343 , C04B2237/366 , C04B2237/402 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at a temperature of 620 to 650° C. in an inert gas to bond the aluminum plate 12 directly to the ceramic substrate 10.
摘要翻译： 使纯度为99.5％以上，优选为99.9％以上的铝板12与620〜650℃的加热氮化铝或氧化铝的陶瓷基板10的至少一面接触。 在惰性气体中将铝板12直接接合到陶瓷基板10上。
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公开(公告)号：US09713253B2
公开(公告)日：2017-07-18
申请号：US14006546
申请日：2011-03-29
IPC分类号： B21D39/00 , H05K1/05 , H05K3/02 , H01L23/373 , H01L21/48 , B22D19/00 , B22D19/04 , H05K1/03 , H05K3/00
CPC分类号： H05K1/053 , B22D19/0081 , B22D19/04 , H01L21/481 , H01L21/4871 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/022 , H05K2201/09136 , H05K2201/2009 , H05K2203/128 , Y10T428/12618 , Y10T428/2457 , Y10T428/2462 , Y10T428/24942 , H01L2924/00
摘要： A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.
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公开(公告)号：US20140057131A1
公开(公告)日：2014-02-27
申请号：US14006546
申请日：2011-03-29
CPC分类号： H05K1/053 , B22D19/0081 , B22D19/04 , H01L21/481 , H01L21/4871 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/022 , H05K2201/09136 , H05K2201/2009 , H05K2203/128 , Y10T428/12618 , Y10T428/2457 , Y10T428/2462 , Y10T428/24942 , H01L2924/00
摘要： A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.
摘要翻译： 金属/陶瓷接合基板包括：陶瓷基板; 直接结合在陶瓷基板的一侧的金属板; 金属基板直接结合到陶瓷基板的另一侧; 所述加强构件具有比所述金属基板高的强度，所述加强构件被布置成从所述金属基板的两个端面之一延伸到所述另一端面，而不会中断所述金属基板延伸 在金属基板与陶瓷基板的接合面与其相对面之间。
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公开(公告)号：US07122243B2
公开(公告)日：2006-10-17
申请号：US10969360
申请日：2004-10-19
CPC分类号： H01L23/142 , H01L23/13 , H01L23/3735 , H01L2924/0002 , Y10T428/12535 , Y10T428/12576 , Y10T428/12611 , Y10T428/24926 , H01L2924/00
摘要： There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and a method for producing the same. In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, at least part of the ceramic substrate 12 is embedded in the metal base plate 16. The ceramic substrate 12 is arranged substantially in parallel to the metal base member 16.
摘要翻译： 提供了具有提高热循环可靠性的金属/陶瓷接合基板及其制造方法。 在其中将电路形成金属板14接合到陶瓷基板12的一侧的金属/陶瓷接合基板10和散热金属基板16的另一侧接合，至少部分陶瓷基板12被嵌入 在金属基板16中。 陶瓷基板12被布置成基本上平行于金属基件16。
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公开(公告)号：US07189449B2
公开(公告)日：2007-03-13
申请号：US10964426
申请日：2004-10-12
CPC分类号： H01L23/3735 , H01L2924/0002 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate 12 to the metal base plate 16. The difference in level is provided by forming at least one of a rising portion 16a and a groove portion 116b on and in the metal base plate 16.
摘要翻译： 在其中将电路形成金属板14接合到陶瓷基板12的一侧的金属/陶瓷接合基板10和散热金属基板16的另一侧接合，沿着整个圆周设置有水平差 陶瓷基板12的接合表面与金属基板16的接合面。通过在金属基板16上形成上升部分16a和凹槽部分116b中的至少一个来提供液位差。
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