Structure for and method of manufacturing a semiconductor device by the
master slice method
    2.
    发明授权
    Structure for and method of manufacturing a semiconductor device by the master slice method 失效
    通过主切片方法制造半导体器件的结构和方法

    公开(公告)号:US4388755A

    公开(公告)日:1983-06-21

    申请号:US207737

    申请日:1980-11-17

    摘要: A structure and method for manufacturing semiconductor devices by the master slice method, in which various kinds of semiconductor devices are manufactured through utilization of a common master pattern and a plurality of different kinds of selective wiring patterns. A number of bipolar transistors each having plural emitter regions, is formed in a predetermined region, or portion, of a semiconductor substrate by employing a common master pattern, and the plural emitter regions of the respective bipolar transistors are selectively connected by the associated wiring patterns of each thereof to form corresponding bipolar transistors of different, predetermined D.C. characteristics. When manufacturing many different kinds of semiconductor devices by the master slice method, the area which would be wasted on the semiconductor substrate by prior art techniques is greatly reduced, thus providing for enhanced area efficiency.

    摘要翻译: 通过主切片方法制造半导体器件的结构和方法,其中通过利用公共主图和多种不同种类的选择性布线图来制造各种半导体器件。 每个具有多个发射极区域的多个双极晶体管通过采用公共主图案形成在半导体衬底的预定区域或部分中,并且各个双极晶体管的多个发射极区域通过相关布线图案选择性地连接 以形成具有不同的预定DC特性的相应双极晶体管。 当通过主分片方法制造许多不同种类的半导体器件时,通过现有技术将浪费在半导体衬底上的区域大大减少,从而提供增强的面积效率。