Method and apparatus for processing JPEG data in mobile communication terminal
    1.
    发明申请
    Method and apparatus for processing JPEG data in mobile communication terminal 审中-公开
    用于处理移动通信终端中的JPEG数据的方法和装置

    公开(公告)号:US20060291730A1

    公开(公告)日:2006-12-28

    申请号:US11472584

    申请日:2006-06-21

    申请人: Ho Lee Jae Lee

    发明人: Ho Lee Jae Lee

    IPC分类号: G06K9/36

    CPC分类号: G09G5/391

    摘要: Provided is a device for resizing a JPEG image having a nonstandard size at a predetermined ratio to output the resized image on a display unit without distortion in a mobile communication terminal. A method for processing a JPEG image in a mobile communication terminal comprises extracting image sizes (X, Y) from JPEG data of a JPEG file stored in an image data storing unit, comparing display area sizes (dx, dy) of the display unit with the image sizes (X, Y), and resizing the image sizes (X, Y) while maintaining the ratio of width:length in consideration of the display area sizes (dx, dy) to output the resized image to the display unit.

    摘要翻译: 提供了一种用于在预定比例下调整具有非标准尺寸的JPEG图像的设备,以便在移动通信终端中在显示单元上输出调整大小的图像而不失真。 用于在移动通信终端中处理JPEG图像的方法包括从存储在图像数据存储单元中的JPEG文件的JPEG数据中提取图像尺寸(X,Y),将​​显示单元的显示区域大小(dx,dy)与 图像尺寸(X,Y),并且考虑到显示区域尺寸(dx,dy),同时保持宽度:长度的比例来调整图像尺寸(X,Y)的大小,以将调整大小的图像输出到显示单元。

    Non-aqueous electrolyte and lithium secondary battery using the same
    2.
    发明申请
    Non-aqueous electrolyte and lithium secondary battery using the same 有权
    非水电解质和锂二次电池使用相同

    公开(公告)号:US20070141475A1

    公开(公告)日:2007-06-21

    申请号:US10588481

    申请日:2004-02-10

    IPC分类号: H01M10/40 H01M4/58

    摘要: The present invention relates to a nonaqueous electrolyte solution containing new additives and a lithium secondary battery including the same. More particularly, the invention relates to a nonaqueous electrolyte solution containing a lithium salt, an electrolyte compound, a first additive compound with an oxidation initiation potential of more than 4.2 V, and a second additive compound with an oxidation initiation potential of more than 4.2 V, which is higher in oxidation initiation potential than the first additive, and deposits oxidative products or form a polymer film, in oxidation, as well as a lithium secondary battery including the same. The present invention can provide a lithium secondary battery excellent in both the battery performance and the battery safety in overcharge by the combined use of the first additive and the second battery as additives to the nonaqueous electrolyte solution.

    摘要翻译: 本发明涉及含有新添加剂的非水电解液和包含该添加剂的锂二次电池。 更具体地说,本发明涉及含有锂盐,电解质化合物,氧化起始电位大于4.2V的第一添加剂化合物和氧化起始电位大于4.2V的第二添加剂化合物的非水电解质溶液 ,其氧化起始电位高于第一添加剂,并且氧化产生氧化物或形成聚合物膜,以及包含其的锂二次电池。 本发明可以通过将第一添加剂和第二电池作为添加剂与非水电解质溶液的组合使用,提供在电池性能和电池安全性方面优异的锂二次电池。

    Apparatus and method for driving a plasma display panel
    3.
    发明申请
    Apparatus and method for driving a plasma display panel 审中-公开
    用于驱动等离子体显示面板的装置和方法

    公开(公告)号:US20050134532A1

    公开(公告)日:2005-06-23

    申请号:US10980823

    申请日:2004-11-04

    摘要: The present invention relates to a plasma display panel, and more particularly, to an apparatus and method for driving a plasma display panel. According to an embodiment of the present invention, the apparatus for driving the plasma display panel includes a temperature sensor that senses a temperature of the plasma display panel, an erase signal tilt control unit that controls a tilt of an erase signal for erasing charges within a cell of the plasma display panel depending on the sensed temperature, and a driving unit that supplies an initialization signal for initializing the cell, an address signal for selecting the cell and a sustain signal for generating a sustain discharge in the cell to the plasma display panel after the charges within the cell are erased using the erase signal. Accordingly, a stabilized discharge can be implemented in such a manner that an ambient temperature is sensed when the plasma display panel is driven, an erase signal is controlled according to the sensed ambient temperature, and the controlled erase signal is applied.

    摘要翻译: 等离子体显示面板技术领域本发明涉及等离子体显示面板,更具体地,涉及一种用于驱动等离子体显示面板的装置和方法。 根据本发明的实施例,用于驱动等离子体显示面板的装置包括:感测等离子体显示面板的温度的温度传感器;擦除信号倾斜控制单元,其控制擦除信号的倾斜,以擦除等离子体显示面板内的电荷 等离子体显示面板的单元,以及提供用于初始化单元的初始化信号的驱动单元,用于选择单元的地址信号和用于在单元中产生维持放电的维持信号到等离子体显示面板 在使用擦除信号擦除单元内的电荷之后。 因此,可以以这样的方式实现稳定的放电,即当驱动等离子体显示面板时感测到环境温度,根据感测到的环境温度控制擦除信号,并施加受控的擦除信号。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20080079086A1

    公开(公告)日:2008-04-03

    申请号:US11831069

    申请日:2007-07-31

    IPC分类号: H01L21/336 H01L27/085

    CPC分类号: H01L21/823807

    摘要: A semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device includes a semiconductor substrate in which PMOS transistor regions and NMOS transistor regions are formed, a PMOS transistor including P-type source and drain regions and a gate electrode, and an NMOS transistor formed on an Si channel region between N-type source and drain regions. The PMOS transistor is formed in each PMOS transistor region, and the gate electrode is formed on a high-dielectric gate insulating film formed on an SiGe channel region between the P-type source and drain regions. Further, the NMOS transistor includes a high-dielectric gate insulating film and a gate electrode formed on the gate insulating film, and the NMOS transistor is formed in each NMOS transistor region.

    摘要翻译: 一种半导体器件和半导体器件的制造方法,其中半导体器件包括其中形成有PMOS晶体管区域和NMOS晶体管区域的半导体衬底,包括P型源极和漏极区域的PMOS晶体管和栅极电极,以及 形成在N型源区和漏区之间的Si沟道区上的NMOS晶体管。 PMOS晶体管形成在每个PMOS晶体管区域中,并且栅电极形成在形成在P型源区和漏区之间的SiGe沟道区上的高电介质栅极绝缘膜上。 此外,NMOS晶体管包括高电介质栅极绝缘膜和形成在栅极绝缘膜上的栅电极,并且NMOS晶体管形成在每个NMOS晶体管区域中。

    Methods of fabricating semiconductor devices using a plasma process with non-silane gas including deuterium
    5.
    发明授权
    Methods of fabricating semiconductor devices using a plasma process with non-silane gas including deuterium 有权
    使用包括氘的非硅烷气体的等离子体处理制造半导体器件的方法

    公开(公告)号:US08741710B2

    公开(公告)日:2014-06-03

    申请号:US12248431

    申请日:2008-10-09

    IPC分类号: H01L21/8238 H01L21/336

    摘要: Semiconductor devices are fabricated using a plasma process with a non-silane gas that includes deuterium, and which may result in improved device reliability and/or other improved device operational characteristics. One such method can include forming a gate oxide layer on a transistor region, which is defined on a substrate, and forming a gate electrode on the gate oxide layer. An etch stop layer is formed on the gate oxide layer and the gate electrode. A plasma process is performed on the interface between the gate oxide layer and the substrate using a non-silane treatment gas including deuterium. An interlayer dielectric layer is formed on the etch stop layer. A bottom metal line is formed on the interlayer dielectric layer.

    摘要翻译: 使用包括氘的非硅烷气体的等离子体工艺制造半导体器件,并且其可以导致改进的器件可靠性和/或其他改进的器件操作特性。 一种这样的方法可以包括在限定在衬底上的晶体管区域上形成栅极氧化层,并在栅极氧化物层上形成栅电极。 在栅极氧化物层和栅电极上形成蚀刻停止层。 使用包括氘的非硅烷处理气体在栅极氧化物层和衬底之间的界面上进行等离子体处理。 在蚀刻停止层上形成层间电介质层。 底层金属线形成在层间电介质层上。

    Semiconductor devices having faceted channels and methods of fabricating such devices
    7.
    发明授权
    Semiconductor devices having faceted channels and methods of fabricating such devices 有权
    具有小平面通道的半导体器件和制造这种器件的方法

    公开(公告)号:US07671420B2

    公开(公告)日:2010-03-02

    申请号:US11281599

    申请日:2005-11-18

    摘要: Disclosed are processes and techniques for fabricating semiconductor substrates for the manufacture of semiconductor devices, particularly CMOS devices, that include selectively formed, high quality single crystal or monocrystalline surface regions exhibiting different crystal orientations. At least one of the surface regions will incorporate at least one faceted epitaxial semiconductor structure having surfaces that exhibit a crystal orientation different than the semiconductor region on which the faceted epitaxial semiconductor structure is formed. According, the crystal orientation in the channel regions of the NMOS and/or PMOS devices may be configured to improve the relative performance of at least one of the devices and allow corresponding redesign of the semiconductor devices fabricated using such a process.

    摘要翻译: 公开了用于制造用于制造半导体器件,特别是CMOS器件的半导体衬底的工艺和技术,其包括具有不同晶体取向的选择性地形成的高质量单晶或单晶表面区域。 表面区域中的至少一个将结合至少一个具有不同于其上形成有刻面外延半导体结构的半导体区域的晶体取向的表面的分面外延半导体结构。 根据,NMOS和/或PMOS器件的沟道区域中的晶体取向可以被配置为改善至少一个器件的相对性能,并允许对使用这种工艺制造的半导体器件进行相应的重新设计。

    Methods of selectively forming epitaxial semiconductor layer on single crystalline semiconductor and semiconductor devices fabricated using the same
    8.
    发明授权
    Methods of selectively forming epitaxial semiconductor layer on single crystalline semiconductor and semiconductor devices fabricated using the same 有权
    在使用其制造的单晶半导体和半导体器件上选择性地形成外延半导体层的方法

    公开(公告)号:US07611973B2

    公开(公告)日:2009-11-03

    申请号:US11154236

    申请日:2005-06-16

    IPC分类号: H01L21/20 H01L21/36

    摘要: In methods of selectively forming an epitaxial semiconductor layer on a single crystalline semiconductor and semiconductor devices fabricated using the same, a single crystalline epitaxial semiconductor layer and a non-single crystalline epitaxial semiconductor layer are formed on a single crystalline semiconductor and a non-single crystalline semiconductor pattern respectively, using a main semiconductor source gas and a main etching gas. The non-single crystalline epitaxial semiconductor layer is removed using a selective etching gas. The main gases and the selective etching gas are alternately and repeatedly supplied at least two times to selectively form an elevated single crystalline epitaxial semiconductor layer having a desired thickness only on the single crystalline semiconductor. The selective etching gas suppresses formation of an epitaxial semiconductor layer on the non-single crystalline semiconductor pattern.

    摘要翻译: 在单晶半导体上选择性地形成外延半导体层的方法和使用其制造的半导体器件的方法中,单晶外延半导体层和非单晶外延半导体层形成在单晶半导体和非单晶 半导体图案,分别使用主半导体源气体和主蚀刻气体。 使用选择性蚀刻气体去除非单晶外延半导体层。 主要气体和选择性蚀刻气体交替地和重复地供应至少两次以选择性地形成仅在单晶半导体上具有期望厚度的升高的单晶外延半导体层。 选择性蚀刻气体抑制在非单晶半导体图案上形成外延半导体层。

    METHODS OF FABRICATING DIFFERENT THICKNESS SILICON-GERMANIUM LAYERS ON SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES FABRICATED THEREBY
    9.
    发明申请
    METHODS OF FABRICATING DIFFERENT THICKNESS SILICON-GERMANIUM LAYERS ON SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES FABRICATED THEREBY 有权
    在半导体集成电路器件和半导体集成电路器件上制造不同厚度的硅 - 锗层的方法

    公开(公告)号:US20090258463A1

    公开(公告)日:2009-10-15

    申请号:US12419698

    申请日:2009-04-07

    IPC分类号: H01L21/20 H01L21/768

    摘要: Methods of fabricating semiconductor integrated circuit devices are provided. A substrate is provided with gate patterns formed on first and second regions. Spaces between gate patterns on the first region are narrower than spaces between gate patterns on the second region. Source/drain trenches are formed in the substrate on opposite sides of the gate patterns on the first and second regions. A first silicon-germanium (SiGe) epitaxial layer is formed that partially fills the source/drain trenches using a first silicon source gas. A second SiGe epitaxial layer is formed directly on the first SiGe epitaxial layer to further fill the source/drain trenches using a second silicon source gas that is different from the first silicon source gas.

    摘要翻译: 提供制造半导体集成电路器件的方法。 基板设置有形成在第一和第二区域上的栅极图案。 第一区域上的栅极图案之间的间隔比第二区域上的栅极图案之间的空间窄。 源极/漏极沟槽在第一和第二区域上的栅极图案的相对侧上的衬底中形成。 形成第一硅锗(SiGe)外延层,其使用第一硅源气体部分地填充源极/漏极沟槽。 直接在第一SiGe外延层上形成第二SiGe外延层,以使用不同于第一硅源气体的第二硅源气体来进一步填充源/漏沟槽。

    SEMICONDUCTOR DEVICE HAVING A LOCALLY BURIED INSULATION LAYER
    10.
    发明申请
    SEMICONDUCTOR DEVICE HAVING A LOCALLY BURIED INSULATION LAYER 审中-公开
    具有局部绝缘绝缘层的半导体器件

    公开(公告)号:US20090224287A1

    公开(公告)日:2009-09-10

    申请号:US12400408

    申请日:2009-03-09

    IPC分类号: H01L29/80

    摘要: A semiconductor device having a locally buried insulation layer and a method of manufacturing a semiconductor device having the same are provided, in which a gate electrode is formed on a substrate, and oxygen ions are implanted into an active region to form a locally buried insulation layer. An impurity layer is formed on the locally buried insulation layer to form a source/drain. A silicide layer is formed on the source/drain and on the gate electrode. The locally buried insulation layer can prevent junction leakage, decrease junction capacitance and prevent a critical voltage of an MOS transistor from increasing due to body bias, thereby to improve characteristics of the device.

    摘要翻译: 提供了具有局部掩埋绝缘层的半导体器件及其制造方法,其中在基板上形成栅电极,并将氧离子注入有源区以形成局部掩埋的绝缘层 。 在局部掩埋的绝缘层上形成杂质层以形成源极/漏极。 在源极/漏极和栅电极上形成硅化物层。 局部埋入绝缘层可以防止结漏电,降低结电容,并防止MOS晶体管的临界电压由于体偏压而增加,从而改善器件的特性。