公开(公告)号：US08057084B2

公开(公告)日：2011-11-15

申请号：US12397893

申请日：2009-03-04

申请人： Ho Young Song ,  Won Soo Ji ,  Won Ho Jung ,  Young Jin Cho ,  Hyun Kyung Kim

发明人： Ho Young Song ,  Won Soo Ji ,  Won Ho Jung ,  Young Jin Cho ,  Hyun Kyung Kim

IPC分类号： F21V17/00

CPC分类号： H01L33/486 ,  G02B6/0023 ,  G02B6/0046 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0091 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface.

摘要翻译： 侧视型发光器件包括封装体，第一引线框架和第二引线框架，发光二极管芯片，树脂覆盖部分和至少一个间隔件部分。 包装体具有设置为安装表面的第一表面，与第一表面相对的第二表面，位于第一表面和第二表面之间的侧表面，以及形成在与光对应的一个侧表面处的凹部 发射面。

公开(公告)号：US20100085772A1

公开(公告)日：2010-04-08

申请号：US12397893

申请日：2009-03-04

申请人： Ho Young Song ,  Won Soo Ji ,  Won Ho Jung ,  Young Jin Cho ,  Hyun Kyung Kim

发明人： Ho Young Song ,  Won Soo Ji ,  Won Ho Jung ,  Young Jin Cho ,  Hyun Kyung Kim

IPC分类号： H01L33/00 ,  F21V8/00

CPC分类号： H01L33/486 ,  G02B6/0023 ,  G02B6/0046 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0091 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface. The first and second lead frames are formed at the package body to be exposed to the bottom of the concave portion. The light emitting diode chip is mounted on the bottom of the concave portion to be electrically connected to each of the first and second lead frames. The resin covering portion is formed in the concave portion to enclose the light emitting diode chip. The spacer portion is formed at the side surface around the concave portion to maintain a constant distance from a light irradiation target without reducing the view angle of light emitted from the light emitting diode chip in the major-axis direction of the concave portion.

摘要翻译： 侧视型发光器件包括封装体，第一引线框架和第二引线框架，发光二极管芯片，树脂覆盖部分和至少一个间隔件部分。 包装体具有设置为安装表面的第一表面，与第一表面相对的第二表面，位于第一表面和第二表面之间的侧表面，以及形成在与光对应的一个侧表面处的凹部 发射面。 第一引线框架和第二引线框架形成在封装主体处以暴露于凹部的底部。 发光二极管芯片安装在凹部的底部，以电连接到第一引线框架和第二引线框架中的每一个。 树脂覆盖部分形成在凹部中以包围发光二极管芯片。 间隔部分形成在凹部周围的侧表面，以保持与光照射目标的距离恒定，而不会减小从凹部的长轴方向从发光二极管芯片发出的光的视角。

公开(公告)号：US08445166B2

公开(公告)日：2013-05-21

申请号：US12333566

申请日：2008-12-12

申请人： Ho Young Song ,  Dong You Kim ,  Won Ho Jung ,  Young Jin Cho ,  Young Chun Kim

发明人： Ho Young Song ,  Dong You Kim ,  Won Ho Jung ,  Young Jin Cho ,  Young Chun Kim

IPC分类号： G03F1/00 ,  G03F1/08 ,  G03F7/00

CPC分类号： G03F1/68 ,  G03F1/50 ,  G03F1/60

摘要： There is provided a method of fabricating a lithography mask, the method including: forming a transparent polymer layer on a surface of a first substrate where a convex-concave pattern is formed; separating the transparent polymer layer from the first substrate, the transparent polymer layer having a convex-concave surface formed by the convex-concave pattern of the first substrate transferred thereonto; depositing a metal thin film on the convex-concave surface; forming a viscous film on a second substrate; disposing the transparent polymer layer on the second substrate such that the viscous film and metal thin film are partially bonded together; and separating the transparent polymer layer from the second substrate such that a portion of the metal thin film bonded to the viscous film is removed, wherein a metal thin film pattern having the portion of the metal thin film removed therefrom is formed on the convex-concave surface.

摘要翻译： 提供一种制造光刻掩模的方法，该方法包括：在形成凸凹图案的第一基板的表面上形成透明聚合物层; 从所述第一基板分离所述透明聚合物层，所述透明聚合物层具有由其上转印有所述第一基板的凸凹图案形成的凸凹表面; 在所述凹凸表面上沉积金属薄膜; 在第二基板上形成粘性膜; 将所述透明聚合物层设置在所述第二基板上，使得所述粘性膜和金属薄膜部分地粘合在一起; 并且将透明聚合物层与第二基板分离，使得与粘性膜结合的金属薄膜的一部分被去除，其中从其上去除了金属薄膜部分的金属薄膜图案形成在凸凹 表面。

公开(公告)号：US20100015535A1

公开(公告)日：2010-01-21

申请号：US12333566

申请日：2008-12-12

申请人： Ho Young Song ,  Dong You Kim ,  Won Ho Jung ,  Young Jin Cho ,  Young Chun Kim

发明人： Ho Young Song ,  Dong You Kim ,  Won Ho Jung ,  Young Jin Cho ,  Young Chun Kim

IPC分类号： G03F1/00 ,  G03F7/20

CPC分类号： G03F1/68 ,  G03F1/50 ,  G03F1/60

摘要： There is provided a method of fabricating a lithography mask, the method including: forming a transparent polymer layer on a surface of a first substrate where a convex-concave pattern is formed; separating the transparent polymer layer from the first substrate, the transparent polymer layer having a convex-concave surface formed by the convex-concave pattern of the first substrate transferred thereonto; depositing a metal thin film on the convex-concave surface; forming a viscous film on a second substrate; disposing the transparent polymer layer on the second substrate such that the viscous film and metal thin film are partially bonded together; and separating the transparent polymer layer from the second substrate such that a portion of the metal thin film bonded to the viscous film is removed, wherein a metal thin film pattern having the portion of the metal thin film removed therefrom is formed on the convex-concave surface.

摘要翻译： 提供一种制造光刻掩模的方法，该方法包括：在形成凸凹图案的第一基板的表面上形成透明聚合物层; 从所述第一基板分离所述透明聚合物层，所述透明聚合物层具有由其上转印有所述第一基板的凸凹图案形成的凸凹表面; 在所述凹凸表面上沉积金属薄膜; 在第二基板上形成粘性膜; 将所述透明聚合物层设置在所述第二基板上，使得所述粘性膜和金属薄膜部分地粘合在一起; 并且将透明聚合物层与第二基板分离，使得与粘性膜结合的金属薄膜的一部分被去除，其中从其上去除了金属薄膜部分的金属薄膜图案形成在凸凹 表面。

公开(公告)号：US20120153334A1

公开(公告)日：2012-06-21

申请号：US13327189

申请日：2011-12-15

申请人： Hun Yong PARK ,  Seong Deok Hwang ,  Won Ho Jung

发明人： Hun Yong PARK ,  Seong Deok Hwang ,  Won Ho Jung

IPC分类号： H01L33/58

CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  Y10S362/80 ,  H01L2924/00014

摘要： A light emitting diode (LED) package is provided. The LED package includes an LED, a plurality of lead frames electrically connected with the LED, a package body having a receiving groove exposed to receive the LED therein and including a plurality of supporting units provided to project from an inner side surface of the receiving groove, and a filling member having an engaging groove engaged with the supporting unit at a circumference of a side surface thereof, and included inside the receiving groove.

摘要翻译： 提供了一种发光二极管（LED）封装。 LED封装包括LED，与LED电连接的多个引线框架，封装体，其具有暴露以容纳LED的接收槽，并且包括多个支撑单元，所述支撑单元设置成从接收槽的内侧表面突出 以及填充构件，其具有在其侧表面的圆周处与所述支撑单元接合并且包括在所述接收槽内部的接合槽。

公开(公告)号：US08847270B2

公开(公告)日：2014-09-30

申请号：US13327189

申请日：2011-12-15

申请人： Hun Yong Park ,  Seong Deok Hwang ,  Won Ho Jung

发明人： Hun Yong Park ,  Seong Deok Hwang ,  Won Ho Jung

IPC分类号： H01L33/58 ,  H01L33/60 ,  H01L33/48

CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  Y10S362/80 ,  H01L2924/00014

摘要： A light emitting diode (LED) package is provided. The LED package includes an LED, a plurality of lead frames electrically connected with the LED, a package body having a receiving groove exposed to receive the LED therein and including a plurality of supporting units provided to project from an inner side surface of the receiving groove, and a filling member having an engaging groove engaged with the supporting unit at a circumference of a side surface thereof, and included inside the receiving groove.

摘要翻译： 提供了一种发光二极管（LED）封装。 LED封装包括LED，与LED电连接的多个引线框架，封装体，其具有暴露以容纳LED的接收槽，并且包括多个支撑单元，所述支撑单元设置成从接收槽的内侧表面突出 以及填充构件，其具有在其侧表面的圆周处与所述支撑单元接合并且包括在所述接收槽内部的接合槽。

公开(公告)号：US08435808B2

公开(公告)日：2013-05-07

申请号：US13281079

申请日：2011-10-25

申请人： Won Ho Jung ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

发明人： Won Ho Jung ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

IPC分类号： H01L21/00

CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.

摘要翻译： 提供一种制造发光二极管（LED）封装的方法。 该方法包括制备包装体，其包括形成有空腔的第一引线框架并且插入在该空腔的底表面的一侧上，以及插入另一侧的第二引线框架，将LED芯片安装在底表面上并电连接 所述LED芯片具有所述第一引线框架和所述第二引线框架，通过所述腔体中的模制树脂形成模制部分，将与所述模制部分相对应的第一模具连接到所述封装主体，并且包括具有内表面的通孔 将第二模具连接到第一模具的上表面，通过透明树脂在模制部分上形成透镜部分，并将第一模具和第二模具与包装体分离。

公开(公告)号：US07095166B2

公开(公告)日：2006-08-22

申请号：US10878116

申请日：2004-06-29

申请人： Won Ho Jung

发明人： Won Ho Jung

IPC分类号： H01J31/00

CPC分类号： H01J29/861 ,  H01J2229/862

摘要： Disclosed is a cathode ray tube, comprising a panel of which outer surface is substantially flat and inner surface has a designated radius of curvature, a funnel connected to the panel, an electron gun housed in the funnel, emitting electron beams, a deflection yoke for deflecting the electron beams, and a shadow mask for discriminating the electron beams in colors, wherein a ratio (%) of a corner portion of the panel to a thickness at a central portion of the panel is in a range of 150%˜230%, and design sizes of the panel satisfy a relation of CFT × USD IBRD × 100 ≤ 1100 ⁢ ⁢ mm (wherein, CFT denotes a thickness at the central portion of the panel, USD denotes a diagonal length of an effective surface of the panel, and IBRD denotes 2×a distance from the center of the panel to the center of a radius of curvature from the corner portion of the panel).

摘要翻译： 公开了一种阴极射线管，其包括外表面基本上平坦的面板，内表面具有指定的曲率半径，连接到面板的漏斗，容纳在漏斗中的电子枪，发射电子束，偏转线圈，用于 偏转电子束，以及用于鉴别电子束颜色的荫罩，其中面板的角部与该面板的中央部的厚度的比率（％）在150％〜230％的范围内 ，面板的设计尺寸满足