SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效
    半导体器件及其制造方法

    公开(公告)号:US20100081247A1

    公开(公告)日:2010-04-01

    申请号:US12579642

    申请日:2009-10-15

    IPC分类号: H01L21/268

    摘要: A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film an a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.

    摘要翻译: 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜上或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下进行退火, 。 通过选择性地形成覆盖膜来形成具有薄膜晶体管的动态电路,同时获得漏电流低的晶体管和迁移率高的晶体管,即将成为有源层的半导体层 晶体管,然后通过其热结晶。

    FILM-FORMING APPARATUS, METHOD OF CLEANING THE SAME, AND METHOD OF MANUFACTURING A LIGHT-EMITTING DEVICE
    3.
    发明申请
    FILM-FORMING APPARATUS, METHOD OF CLEANING THE SAME, AND METHOD OF MANUFACTURING A LIGHT-EMITTING DEVICE 审中-公开
    成膜装置,清洗方法和制造发光装置的方法

    公开(公告)号:US20100159124A1

    公开(公告)日:2010-06-24

    申请号:US12686624

    申请日:2010-01-13

    IPC分类号: B05D5/06 B05D5/12

    摘要: A cleaning method of removing a vapor-deposition material adhering to equipments without exposure to the atmosphere is provided. A vapor-deposition material adhering to equipments (components of a film-forming apparatus) such as a substrate holder, a vapor-deposition mask, a mask holder, or an adhesion preventing shield provided in a film-forming chamber are subjected to heat treatment. Because of this, the adhering vapor-deposition material is re-sublimated, and removed by exhaust through a vacuum pump. By including such a cleaning method in the steps of manufacturing an electro-optical device, the manufacturing steps are shortened, and an electro-optical device with high reliability can be realized.

    摘要翻译: 提供了一种清除附着在不暴露于大气中的设备的气相沉积材料的方法。 将附着在设置在成膜室上的设备(成膜装置的部件)如基板保持器,蒸镀掩模,掩模保持器或防粘附屏蔽物的气相沉积材料进行热处理 。 因此,附着的气相沉积材料被重新升华,并通过真空泵被排气除去。 通过在制造电光装置的步骤中包括这种清洁方法,缩短了制造步骤,并且可以实现具有高可靠性的电光装置。

    FILM-FORMING APPARATUS, METHOD OF CLEANING THE SAME, AND METHOD OF MANUFACTURING A LIGHT-EMITTING DEVICE
    4.
    发明申请
    FILM-FORMING APPARATUS, METHOD OF CLEANING THE SAME, AND METHOD OF MANUFACTURING A LIGHT-EMITTING DEVICE 有权
    成膜装置,清洗方法和制造发光装置的方法

    公开(公告)号:US20120201955A1

    公开(公告)日:2012-08-09

    申请号:US13449396

    申请日:2012-04-18

    IPC分类号: C23C16/458

    摘要: A cleaning method of removing a vapor-deposition material adhering to equipments without exposure to the atmosphere is provided. A vapor-deposition material adhering to equipments (components of a film-forming apparatus) such as a substrate holder, a vapor-deposition mask, a mask holder, or an adhesion preventing shield provided in a film-forming chamber are subjected to heat treatment. Because of this, the adhering vapor-deposition material is re-sublimated, and removed by exhaust through a vacuum pump. By including such a cleaning method in the steps of manufacturing an electro-optical device, the manufacturing steps are shortened, and an electro-optical device with high reliability can be realized.

    摘要翻译: 提供了一种清除附着在不暴露于大气中的设备的气相沉积材料的方法。 将附着在设置在成膜室上的设备(成膜装置的部件)如基板保持器,蒸镀掩模,掩模保持器或防粘附屏蔽物的气相沉积材料进行热处理 。 因此,附着的气相沉积材料被重新升华,并通过真空泵通过排气除去。 通过在制造电光装置的步骤中包括这种清洁方法,缩短了制造步骤,并且可以实现具有高可靠性的电光装置。

    PROCESS FOR PRODUCTION OF SOI SUBSTRATE AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE
    5.
    发明申请
    PROCESS FOR PRODUCTION OF SOI SUBSTRATE AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE 有权
    用于生产SOI衬底的工艺和用于制造半导体器件的工艺

    公开(公告)号:US20080286940A1

    公开(公告)日:2008-11-20

    申请号:US12170663

    申请日:2008-07-10

    申请人: Takeshi FUKUNAGA

    发明人: Takeshi FUKUNAGA

    IPC分类号: H01L21/30

    摘要: A process for producing an adhered SOI substrate without causing cracking and peeling of a single-crystal silicon thin film. The process consists of selectively forming a porous silicon layer in a single-crystal semiconductor substrate, adding hydrogen into the single-crystal semiconductor substrate to form a hydrogen-added layer, adhering the single-crystal semiconductor substrate to a supporting substrate, separating the single-crystal semiconductor substrate at the hydrogen-added layer by thermal annealing, performing thermal annealing again to stabilize the adhering interface, and selectively removing the porous silicon layer to give single-crystal silicon layer divided into islands.

    摘要翻译: 一种制造粘附的SOI衬底而不会引起单晶硅薄膜的破裂和剥离的方法。 该方法包括在单晶半导体衬底中选择性地形成多孔硅层,向单晶半导体衬底中加入氢以形成加氢层,将单晶半导体衬底粘附到支撑衬底上, 通过热退火在氢添加层的晶体半导体衬底,再次进行热退火以稳定粘合界面,并且选择性地除去多孔硅层,得到分成岛的单晶硅层。

    PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE
    8.
    发明申请
    PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的工艺

    公开(公告)号:US20090075460A1

    公开(公告)日:2009-03-19

    申请号:US12269294

    申请日:2008-11-12

    IPC分类号: H01L21/20

    摘要: A process for fabricating a semiconductor device comprising the steps of introducing into an amorphous silicon film, a metallic element which accelerates the crystallization of the amorphous silicon film; applying heat treatment to the amorphous silicon film to obtain a crystalline silicon film; irradiating a laser beam or an intense light to the crystalline silicon film; and heat treating the crystalline silicon film irradiated with a laser beam or an intense light.

    摘要翻译: 一种制造半导体器件的方法,包括以下步骤:向非晶硅膜引入加速非晶硅膜结晶的金属元素; 对非晶硅膜进行热处理以获得结晶硅膜; 向结晶硅膜照射激光束或强光; 并对用激光束或强光照射的结晶硅膜进行热处理。

    PROCESS FOR PRODUCTION OF SOI SUBSTRATE AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE
    9.
    发明申请
    PROCESS FOR PRODUCTION OF SOI SUBSTRATE AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE 失效
    用于生产SOI衬底的工艺和用于制造半导体器件的工艺

    公开(公告)号:US20100144111A1

    公开(公告)日:2010-06-10

    申请号:US12705994

    申请日:2010-02-16

    申请人: Takeshi FUKUNAGA

    发明人: Takeshi FUKUNAGA

    IPC分类号: H01L21/762

    摘要: A process for producing an adhered SOI substrate without causing cracking and peeling of a single-crystal silicon thin film. The process consists of selectively forming a porous silicon layer in a single-crystal semiconductor substrate, adding hydrogen into the single-crystal semiconductor substrate to form a hydrogen-added layer, adhering the single-crystal semiconductor substrate to a supporting substrate, separating the single-crystal semiconductor substrate at the hydrogen-added layer by thermal annealing, performing thermal annealing again to stabilize the adhering interface, and selectively removing the porous silicon layer to give single-crystal silicon layer divided into islands.

    摘要翻译: 一种制造粘附的SOI衬底而不会引起单晶硅薄膜的破裂和剥离的方法。 该方法包括在单晶半导体衬底中选择性地形成多孔硅层,向单晶半导体衬底中加入氢以形成加氢层,将单晶半导体衬底粘附到支撑衬底上, 通过热退火在氢添加层的晶体半导体衬底,再次进行热退火以稳定粘合界面,并且选择性地除去多孔硅层,得到分成岛的单晶硅层。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 失效
    半导体器件及其制造方法

    公开(公告)号:US20060145153A1

    公开(公告)日:2006-07-06

    申请号:US11275850

    申请日:2006-01-31

    IPC分类号: H01L31/0376

    摘要: A semiconductor device having a CMOS structure, wherein, in manufacturing a CMOS circuit, an impurity element which imparts p-type conductivity to the active layer of the p-channel type semiconductor device is added before forming the gate insulating film. Then, by applying thermal oxidation treatment to the active layer, the impurity element is subjected to redistribution, and the concentration of the impurity element in the principal surface of the active layer is minimized. The precise control of threshold voltage is enabled by the impurity element that is present in a trace quantity.

    摘要翻译: 具有CMOS结构的半导体器件,其中在制造CMOS电路时,在形成栅极绝缘膜之前添加赋予P沟道型半导体器件的有源层p型导电性的杂质元素。 然后,通过对有源层进行热氧化处理,对杂质元素进行再分配,使有源层主表面的杂质元素的浓度最小化。 阈值电压的精确控制由痕量存在的杂质元素使能。