摘要:
A method and apparatus for underfilling a gap between a multi-sided die and a substrate with an encapsulant material. The die and/or the substrate is heated non-uniformly by a heat source to generate a temperature gradient therein. The heated one of the die and the substrate transfers heat energy in proportion to the temperature gradient to the encapsulant material moving in the gap. The differential heat transfer steers, guides or otherwise directs the movement of the encapsulant material in the gap. The temperature gradient may be established with heat transferred from the heat source to the die and/or the substrate by conduction, convection, or radiation. The temperature gradient may be dynamically varied as the encapsulant material moves into the gap.
摘要:
A jetting dispenser has a dispenser body with a fluid channel and a fluid channel outlet within the fluid channel. A valve member is movable within the fluid channel for selective contact with a valve seat near the fluid channel outlet. A jetting nozzle is adapted to be coupled to the dispenser body, adjacent the channel outlet, and has a nozzle body with a plurality of nozzle outlets in fluid communication with the channel outlet via a plurality of fluid passages through the nozzle body. The valve member is moved by a valve driver to contact the valve seat and impart momentum to liquid material supplied to the dispenser such that a plurality of droplets of liquid material are simultaneously jetted from the plurality of nozzle outlets.
摘要:
A method is provided for forming at least one continuous line of viscous material between two components of an electronic assembly forming two substrates. The method includes the steps of depositing a plurality of spaced apart dots of the viscous material onto a surface of a first one of the substrates and bringing a second one of the substrates into contact with the dots causing the dots to merge together to form at least one continuous line of the viscous material between the two substrates.
摘要:
Systems and methods for dispensing or jetting a viscous material. The systems include an electronic controller and a jetting dispenser operatively coupled with the electronic controller. The systems further include at least one sensor that senses a system dispensing parameter and communicates an output signal representing the sensed parameter to the electronic controller for controlling system operation. In pneumatically-actuated jetting dispensers, a sensor may sense the fluid pressure in the air cavity of the pneumatic actuator. In jetting dispensers with a movable needle valve, a sensor may sense the displacement of the needle shaft. In other jetting dispensers, a sensor may sense the vibration of the jetting dispenser.
摘要:
Apparatus and methods for preapplying discrete amounts of underfill material of a component on a component substrate before the solder bumps of the component are joined by reflow with a packaging substrate to create a microelectronics package. The underfill material is preferably applied by a noncontact dispensing technique as discrete amounts at interstitial areas on an active surface of the component substrate defined between nearest-neighbor solder bumps. The underfill material forms a continuous meniscus of underfill material across the interstitial areas not occupied by the solder bumps and forms a collar encircling each of the solder bumps. The cured underfill material strengthens and improves the reliability of the solder joints formed by the bump reflow.
摘要:
Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.
摘要:
A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.
摘要:
A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.
摘要:
Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.
摘要:
A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.