公开(公告)号：US20050227064A1

公开(公告)日：2005-10-13

申请号：US10815420

申请日：2004-04-01

Applicant: Hwail Jin

Inventor： Hwail Jin

IPC: C09J7/00 ,  C09J7/02 ,  C09J113/00 ,  C09J163/00 ,  H01L21/58 ,  H01L21/68 ,  B32B7/12

CPC classification number: H01L21/6836 ,  C09J7/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/351 ,  Y10T428/28 ,  H01L2924/00

Abstract: A dicing die bonding adhesive film for disposition between a semiconductor silicon wafer and a dicing support tape comprises a Layer-1 adhesive, which comes in contact with the dicing tape, and a Layer-2 adhesive, which comes in contact with the silicon semiconductor wafer, in which the adhesion of Layer 2 to the silicon wafer is higher than the adhesion of Layer 1 to the dicing tape by at least 0.1 N/cm.

Abstract translation: 用于配置在半导体硅晶片和切割支撑带之间的切割芯片粘结粘合剂膜包括与切割带接触的第一层粘合剂和与硅半导体晶片接触的二层粘合剂 ，其中层2对硅晶片的粘附比层1对切割带的粘附力高至少0.1N / cm。

公开(公告)号：US20070003758A1

公开(公告)日：2007-01-04

申请号：US11514556

申请日：2006-08-31

Applicant: Hwail Jin

Inventor： Hwail Jin

IPC: B32B7/12

CPC classification number: H01L24/29 ,  C09J7/10 ,  C09J7/20 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2409/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2857 ,  Y10T428/287 ,  H01L2924/00 ,  H01L2224/27

Abstract: A dicing die bonding adhesive film for disposition between a semiconductor silicon wafer and a dicing support tape comprises a Layer-1 adhesive, which comes in contact with the dicing tape, and a Layer-2 adhesive, which comes in contact with the silicon semiconductor wafer, in which the adhesion of Layer 2 to the silicon wafer is higher than the adhesion of Layer 1 to the dicing tape by at least 0.1 N/cm.

Abstract translation: 用于在半导体硅晶片和切割支撑带之间配置的切割芯片粘合粘合剂膜包括与切割带接触的层-1粘合剂和与硅半导体晶片接触的层-2粘合剂 ，其中层2对硅晶片的粘附比层1对切割带的粘附力高至少0.1N / cm。

公开(公告)号：US20100279469A1

公开(公告)日：2010-11-04

申请号：US12777388

申请日：2010-05-11

Applicant: Hwail Jin

Inventor： Hwail Jin

IPC: H01L21/56 ,  B32B38/10 ,  C08L63/00 ,  C08L83/04 ,  C08L39/04

CPC classification number: C09J163/00 ,  C08G59/4253 ,  C08G59/5033 ,  C08G77/14 ,  C08G77/20 ,  C08K5/54 ,  C09J7/10 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2421/00 ,  C09J2463/00 ,  C09J2479/08 ,  H01L2224/2919 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/00

Abstract: This invention is a low-voiding adhesive film prepared from a composition. The composition comprises a toughening polymer, a curable resin, a curing agent for the curable resin, a void reduction compound, and a curing agent for the void reduction compound. The void reduction compound has at least two Si—O moieties contiguous with each other and at least one reactive functionality. Additional embodiments of this invention are described, including a process for producing the low-voiding die attach film, a method for reducing voids in a semiconductor package using the film of this invention, and a semiconductor package assembled with the film of this invention.

Abstract translation: 本发明是由组合物制备的低空隙粘合剂膜。 该组合物包括增韧聚合物，可固化树脂，用于固化树脂的固化剂，空隙还原化合物和用于空隙还原化合物的固化剂。 空隙还原化合物具有至少两个彼此相邻的Si-O部分和至少一个反应性官能团。 对本发明的其他实施方式进行了说明，包括制造低空芯片贴膜的方法，使用本发明的薄膜来减少半导体封装中的空隙的方法以及与本发明的薄膜组装的半导体封装。

公开(公告)号：US07326754B2

公开(公告)日：2008-02-05

申请号：US11248490

申请日：2005-10-12

Applicant: Nikola A. Nikolic ,  Ruzhi Zhang ,  Osama M. Musa ,  Hwail Jin ,  Bing Wu ,  David Shenfield

Inventor： Nikola A. Nikolic ,  Ruzhi Zhang ,  Osama M. Musa ,  Hwail Jin ,  Bing Wu ,  David Shenfield

IPC: C08F136/56 ,  C08F136/02 ,  C08F236/56 ,  C08F236/10

CPC classification number: C08F267/10 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2455/00

Abstract: This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

Abstract translation: 本发明是由包含聚合物体系，成膜橡胶化合物和用于聚合物体系的固化剂的粘合剂组合物制备的薄膜粘合剂。 聚合物体系包括基础聚合物和电子给体和电子受体官能团。

公开(公告)号：US20090311520A1

公开(公告)日：2009-12-17

申请号：US12279932

申请日：2005-12-15

Applicant: Hwail Jin

Inventor： Hwail Jin

IPC: B32B25/00 ,  B32B5/00 ,  B32B27/38 ,  B32B27/00

CPC classification number: B32B27/08 ,  B32B27/32 ,  B32B2367/00 ,  B32B2405/00 ,  C08L23/36 ,  C08L2666/14 ,  C09J7/10 ,  C09J109/02 ,  C09J123/36 ,  C09J2201/36 ,  C09J2409/00 ,  H01L24/27 ,  H01L24/28 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/83885 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15747 ,  Y10T428/265 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31721 ,  Y10T428/31855 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An adhesive film for die stacking at least two neighboring semiconductor dies containing metal wire bonds, comprises (a) Layer-1 adhesive, which comes in contact with the first semiconductor die and is capable of flowing around the metal wire bonds of that first semiconductor die at die attach temperatures, and (b) Layer-2 adhesive, which comes in contact with the second semiconductor die, in which Layer-2 adhesive comprises 30-85 weight % thermoplastic rubber with a glass transition temperature of less than 25° C. and a weight average molecular weight of greater than 100,000.

Abstract translation: 一种用于芯片堆叠至少两个相邻的包含金属线接合的相邻半导体管芯的粘合膜，包括（a）与第一半导体管芯接触并且能够围绕该第一半导体管芯的金属线接合流动的第一层粘合剂 （b）与第二半导体管芯接触的2层粘合剂，其中层2粘合剂包含30-85重量％的玻璃化转变温度低于25℃的热塑性橡胶。 重均分子量大于100,000。

公开(公告)号：US20060030672A1

公开(公告)日：2006-02-09

申请号：US11248490

申请日：2005-10-12

Applicant: Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu

Inventor： Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu

IPC: C08F267/10 ,  C08F32/00

CPC classification number: C08F267/10 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2455/00

Abstract: This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

公开(公告)号：US20050137340A1

公开(公告)日：2005-06-23

申请号：US11044374

申请日：2005-01-27

Applicant: Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu ,  David Shenfield

Inventor： Nikola Nikolic ,  Ruzhi Zhang ,  Osama Musa ,  Hwail Jin ,  Bing Wu ,  David Shenfield

IPC: C09J7/00 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J109/02 ,  C09J125/08 ,  C09J133/00 ,  C09J133/20 ,  C09J157/00 ,  C09J201/00 ,  C09J201/02 ,  C08L1/00

CPC classification number: C08F267/10 ,  C08L25/00 ,  C08L33/00 ,  C08L55/00 ,  C09J5/10 ,  C09J11/06 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2455/00

Abstract: This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

Abstract translation: 本发明是由包含聚合物体系，成膜橡胶化合物和用于聚合物体系的固化剂的粘合剂组合物制备的薄膜粘合剂。 聚合物体系包括基础聚合物和电子给体和电子受体官能团。