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77 条记录 (耗时 0.03 秒)

    Light emitting device and lighting instrument including the same
    1.
    发明授权
    Light emitting device and lighting instrument including the same 有权
    发光装置和照明器具等

    公开(公告)号：US08552452B2

    公开(公告)日：2013-10-08

    申请号：US13213767

    申请日：2011-08-19

    申请人： Hwan Hee Jeong ,  Sang Youl Lee ,  Young kyu Jeong ,  Chung song Kim ,  June O Song ,  Kwang Ki Choi ,  Eun Joo Kim

    发明人： Hwan Hee Jeong ,  Sang Youl Lee ,  Young kyu Jeong ,  Chung song Kim ,  June O Song ,  Kwang Ki Choi ,  Eun Joo Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L33/387 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed is a light emitting device including, a second electrode layer, a light emitting structure that includes a second conductive semiconductor layer, an active layer and a first conductive semiconductor layer and that is provided on the second electrode layer, a first electrode layer that includes a pad part and an electrode part connected to the pad part and that is provided on the light emitting structure, and a current blocking layer arranged between the second electrode layer and the light emitting structure in such a way that a part of the current block layer overlaps to correspond to the first electrode layer, wherein a width of the current blocking layer corresponding to the electrode part is different depending upon a clearance with the pad part.

    摘要翻译： 公开了一种发光器件，包括第二电极层，发光结构，其包括第二导电半导体层，有源层和第一导电半导体层，并且设置在第二电极层上，第一电极层包括 焊盘部分和连接到焊盘部分并且设置在发光结构上的电极部分以及布置在第二电极层和发光结构之间的电流阻挡层，使得当前阻挡层的一部分 重叠以对应于第一电极层，其中对应于电极部分的电流阻挡层的宽度根据与焊盘部分的间隙而不同。

    Light emitting device
    2.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号：US08324649B2

    公开(公告)日：2012-12-04

    申请号：US13216932

    申请日：2011-08-24

    申请人： Sang Youl Lee ,  Hwan Hee Jeong ,  Ji Hyung Moon ,  Young Kyu Jeong ,  Kwang Ki Choi ,  June O Song

    发明人： Sang Youl Lee ,  Hwan Hee Jeong ,  Ji Hyung Moon ,  Young Kyu Jeong ,  Kwang Ki Choi ,  June O Song

    IPC分类号： H01L33/00

    CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/145 ,  H01L33/22 ,  H01L33/382 ,  H01L33/46 ,  H01L2224/48247 ,  H01L2924/12032 ,  H01L2924/00

    摘要： A light emitting device is provided that includes a light emitting structure (including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer), a conductive layer, an insulation layer, and a current blocking layer. The conductive layer may have a first conductive portion that passes through the second conductive type semiconductor layer and the active layer to contact the first conductive type semiconductor layer. The insulation layer may have a first insulation portion that surrounds the first conductive portion of the conductive layer. The current blocking layer may substantially surround the first insulation portion of the insulation layer, the first insulation portion provided between the current blocking layer and the first conductive portion.

    摘要翻译： 提供一种发光器件，其包括发光结构（包括第一导电类型半导体层，有源层和第二导电类型半导体层），导电层，绝缘层和电流阻挡层。 导电层可以具有穿过第二导电类型半导体层和有源层以接触第一导电类型半导体层的第一导电部分。 绝缘层可以具有围绕导电层的第一导电部分的第一绝缘部分。 电流阻挡层可以基本上围绕绝缘层的第一绝缘部分，设置在电流阻挡层和第一导电部分之间的第一绝缘部分。

    Light emitting device, method of manufacturing the same, light emitting device package, and illumination system
    3.
    发明授权
    Light emitting device, method of manufacturing the same, light emitting device package, and illumination system 有权
    发光器件，其制造方法，发光器件封装和照明系统

    公开(公告)号：US08179039B2

    公开(公告)日：2012-05-15

    申请号：US13028686

    申请日：2011-02-16

    申请人： Hwan Hee Jeong ,  Sang Youl Lee ,  Ji Hyung Moon ,  June O Song ,  Kwang Ki Choi

    发明人： Hwan Hee Jeong ,  Sang Youl Lee ,  Ji Hyung Moon ,  June O Song ,  Kwang Ki Choi

    IPC分类号： H05B33/00 ,  F21V1/00

    CPC分类号： H01L33/62 ,  H01L33/08 ,  H01L33/20 ,  H01L33/42 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and an illumination system. The light emitting device includes a transmissive substrate, an ohmic layer on the transmissive substrate, a light emitting structure on the ohmic layer and including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second semiconductor layers, a electrode layer on a bottom surface of the transmissive substrate, and a conductive via electrically connecting the light emitting structure with the electrode layer through the transmissive substrate wherein an area of the transmissive substrate is increased toward an upper portion thereof from a lower portion.

    摘要翻译： 公开了发光器件，其制造方法，发光器件封装和照明系统。 发光器件包括透射衬底，透射衬底上的欧姆层，欧姆层上的发光结构，并且包括第一和第二半导体层之间的第一导电半导体层，第二导电半导体层和有源层 ，透射基板的底面上的电极层，以及通过透射基板将发光结构与电极层电连接的导电通孔，其中透射基板的面积从下部向其上部增加。