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    MICRO-WIRE PATTERN FOR ELECTRODE CONNECTION
    2.
    发明申请
    MICRO-WIRE PATTERN FOR ELECTRODE CONNECTION 有权
    用于电极连接的微型图案

    公开(公告)号：US20140209357A1

    公开(公告)日：2014-07-31

    申请号：US13751443

    申请日：2013-01-28

    申请人： JOHN ANDREW LEBENS ,  David Paul Trauernicht ,  Yongcai Wang ,  Ronald Steven Cok

    发明人： JOHN ANDREW LEBENS ,  David Paul Trauernicht ,  Yongcai Wang ,  Ronald Steven Cok

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0296 ,  G06F3/041 ,  G06F2203/04112 ,  H05K2201/0108 ,  H05K2201/10136 ,  H05K2201/10151

    摘要： Micro-wires are arranged to form an electrical conductor connected to an electrode structure. The electrical conductor includes a plurality of spaced-apart first micro-wires extending in a first direction, wherein one of the first micro-wires is a connection micro-wire. A plurality of spaced-apart second micro-wires extends in a second direction different from the first direction. At least two adjacent second micro-wires are spaced apart by a distance greater than the spacing between at least two adjacent first micro-wires. Each second micro-wire is electrically connected to at least two first micro-wires. The electrode structure includes a plurality of electrically connected third micro-wires electrically connected to the connection micro-wire at spaced-apart connection locations and at least some of the adjacent connection locations are separated by a distance greater than any of the distances separating the second micro-wires.

    摘要翻译： 微线布置成形成连接到电极结构的电导体。 电导体包括沿第一方向延伸的多个间隔开的第一微细线，其中第一微线中的一个是连接微线。 多个间隔开的第二微细线沿与第一方向不同的第二方向延伸。 至少两个相邻的第二微细线彼此隔开距离大于至少两个相邻的第一微细线之间的距离。 每个第二微线电连接到至少两个第一微线。 电极结构包括多个电连接的第三微线，其在间隔开的连接位置处电连接到连接微线，并且至少一些相邻的连接位置被隔开一段距离，该距离大于将第二 微线。

    MAKING IMPRINTED THIN-FILM ELECTRONIC SENSOR STRUCTURE
    3.
    发明申请
    MAKING IMPRINTED THIN-FILM ELECTRONIC SENSOR STRUCTURE 有权
    制造薄膜薄膜电子传感器结构

    公开(公告)号：US20160047772A1

    公开(公告)日：2016-02-18

    申请号：US14460589

    申请日：2014-08-15

    申请人： John Andrew Lebens ,  Ronald Steven Cok ,  Yongcai Wang

    发明人： John Andrew Lebens ,  Ronald Steven Cok ,  Yongcai Wang

    IPC分类号： G01N27/403

    CPC分类号： G01N27/403 ,  B05D5/12 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K3/0011 ,  H05K3/107 ,  H05K3/42 ,  H05K3/46 ,  H05K3/467

    摘要： A method of making an imprinted electronic sensor structure on a substrate for sensing an environmental factor includes coating, imprinting, and curing a curable layer on the substrate to form a plurality of spatially separated micro-channels extending from the layer surface into the cured layer. First and second layers are located in each micro-channel to form a multi-layer micro-wire. Either the first layer is a cured electrical conductor forming a conductive layer located only within the micro-channel and the second layer is a reactive layer or the first layer is a reactive layer and the second layer is a cured electrical conductor forming a conductive layer located only within the micro-channel. The reactive layer is exposed to the environmental factor and at least a portion of the reactive layer responds to the environmental factor.

    摘要翻译： 在感测环境因素的基板上制作印刷电子传感器结构的方法包括在基板上涂覆，压印和固化可固化层，以形成从层表面延伸到固化层中的多个空间分离的微通道。 第一和第二层位于每个微通道中以形成多层微线。 第一层是固化电导体，其形成仅位于微通道内的导电层，第二层是反应层，或者第一层是反应层，第二层是形成导电层的固化电导体 只在微通道内。 反应层暴露于环境因素，并且反应层的至少一部分响应环境因素。

    Making imprinted multi-layer structure
    4.
    发明授权
    Making imprinted multi-layer structure 有权
    制作印刷多层结构

    公开(公告)号：US09186698B1

    公开(公告)日：2015-11-17

    申请号：US14526603

    申请日：2014-10-29

    申请人： Yongcai Wang ,  John Andrew Lebens ,  Ronald Steven Cok

    发明人： Yongcai Wang ,  John Andrew Lebens ,  Ronald Steven Cok

    IPC分类号： B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  B05D3/00 ,  H01J37/32 ,  B29C59/00 ,  B29K101/12 ,  B29K105/00

    CPC分类号： G03F7/0002 ,  B05D3/007 ,  B29C59/005 ,  B29K2101/12 ,  B29K2105/0011 ,  B29K2995/0005 ,  C03C17/3405 ,  C03C2218/328 ,  H01J37/32009

    摘要： A method of making an imprinted multi-layer structure includes providing a support and locating a first curable layer including a first material on or over the support. A second curable layer including a second material different from the first material is located on or over the first curable layer. The first curable layer and the second curable layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second curable layer. The first curable layer and the second curable layer are cured in a single step to form a first cured layer and a second cured layer. The imprinting stamp is removed to form an imprinted multi-layer structure with a depth greater than the thickness of the second cured layer.

    摘要翻译： 一种制造压印多层结构的方法包括提供支撑件并将包括第一材料的第一可固化层定位在支撑体上或上方。 包含与第一材料不同的第二材料的第二可固化层位于第一可固化层上或上方。 第一可固化层和第二可固化层用一个具有深度大于第二可固化层的厚度的结构的压印印模在一个步骤中印刷。 第一可固化层和第二可固化层在一个步骤中固化以形成第一固化层和第二固化层。 去除压印印模以形成深度大于第二固化层厚度的印刷多层结构。