SEMICONDUCTOR MEMORY DEVICE HAVING RESISTIVE MEMORY CELLS AND METHOD OF TESTING THE SAME
    1.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE HAVING RESISTIVE MEMORY CELLS AND METHOD OF TESTING THE SAME 有权
    具有电阻记忆体的半导体存储器件及其测试方法

    公开(公告)号:US20140022836A1

    公开(公告)日:2014-01-23

    申请号:US13945007

    申请日:2013-07-18

    IPC分类号: G11C29/10 G11C11/16

    摘要: A semiconductor memory device includes a memory cell array, a mode register set and a test circuit. The memory cell array includes a plurality of wordlines, a plurality of bitlines, and a plurality of spin-transfer torque magneto-resistive random access memory (STT-MRAM) cells, and each STT-MRAM cell disposed in a cross area of each wordline and bitline, and the STT-MRAM cell includes a magnetic tunnel junction (MTJ) element and a cell transistor. The MTJ element includes a free layer, a barrier layer and a pinned layer. A gate of the cell transistor is coupled to a wordline, a first electrode of the cell transistor is coupled to a bitline via the MTJ element, and a second electrode of the cell transistor is coupled to a source line. The mode register set is configured to set a test mode, and the test circuit is configured to perform a test operation by using the mode register set.

    摘要翻译: 半导体存储器件包括存储单元阵列,模式寄存器组和测试电路。 存储单元阵列包括多个字线,多个位线和多个自旋转移转矩磁阻随机存取存储器(STT-MRAM)单元,每个STT-MRAM单元设置在每个字线的交叉区域 和位线,并且STT-MRAM单元包括磁隧道结(MTJ)元件和单元晶体管。 MTJ元件包括自由层,阻挡层和钉扎层。 单元晶体管的栅极耦合到字线,单元晶体管的第一电极通过MTJ元件耦合到位线,并且单元晶体管的第二电极耦合到源极线。 模式寄存器组被配置为设置测试模式,并且测试电路被配置为通过使用模式寄存器集执行测试操作。

    RESISTANCE RANDOM ACCESS MEMORY HAVING COMMON SOURCE LINE
    2.
    发明申请
    RESISTANCE RANDOM ACCESS MEMORY HAVING COMMON SOURCE LINE 有权
    具有普通源线的电阻随机存取存储器

    公开(公告)号:US20080175036A1

    公开(公告)日:2008-07-24

    申请号:US11964142

    申请日:2007-12-26

    IPC分类号: G11C11/21

    摘要: A resistance random access memory (RRAM) having a source line shared structure and an associated data access method. The RRAM, in which a write operation of writing data of first state and second state to a selected memory cell is performed through first and second write paths having mutually opposite directions, includes word lines, bit lines, a memory cell array and a plurality of source lines. The memory cell array includes a plurality of memory cells each constructed of an access transistor coupled to a resistive memory device. The memory cells are disposed in a matrix of rows and columns and located at each intersection of a word line and a bit line. Each of the plurality of source lines is disposed between a pair of word lines and in the same direction as the word lines. A positive voltage is applied to a source line in a memory cell write operation. Through the source line shared structure, occupied chip area is reduced and, in a write operating mode, a bit line potential can be determined within a positive voltage level range.

    摘要翻译: 具有源线共享结构的电阻随机存取存储器(RRAM)和相关联的数据存取方法。 其中通过具有相互相反方向的第一和第二写入路径来执行将第一状态和第二状态的数据写入所选存储单元的写入操作,包括字线,位线,存储单元阵列和多个 源线。 存储单元阵列包括多个存储单元,每个存储单元由耦合到电阻存储器件的存取晶体管构成。 存储单元被布置成行和列的矩阵并且位于字线和位线的每个交叉点处。 多个源极线中的每一个被设置在一对字线之间并且在与字线相同的方向上。 在存储单元写入操作中,将正电压施加到源极线。 通过源极线共享结构,占用的芯片面积减小,并且在写入操作模式中,可以在正电压电平范围内确定位线电位。

    MEMORY CELL OF A RESISTIVE SEMICONDUCTOR MEMORY DEVICE, A RESISTIVE SEMICONDUCTOR MEMORY DEVICE HAVING A THREE-DIMENSIONAL STACK STRUCTURE, AND RELATED METHODS
    3.
    发明申请
    MEMORY CELL OF A RESISTIVE SEMICONDUCTOR MEMORY DEVICE, A RESISTIVE SEMICONDUCTOR MEMORY DEVICE HAVING A THREE-DIMENSIONAL STACK STRUCTURE, AND RELATED METHODS 有权
    电阻半导体存储器件的存储单元,具有三维堆叠结构的电阻半导体存储器件及相关方法

    公开(公告)号:US20080175031A1

    公开(公告)日:2008-07-24

    申请号:US12015624

    申请日:2008-01-17

    IPC分类号: G11C5/02 G11C11/21

    摘要: A memory cell of a resistive semiconductor memory device, a resistive semiconductor memory device having a three-dimensional stack structure, and related methods are provided. The memory cell of a resistive semiconductor memory device includes a twin cell, wherein the twin cell stores data values representing one bit of data. The twin cell includes a main unit cell connected to a main bit line and a word line, and a sub unit cell connected to a sub bit line and the word line. Also, the main unit cell includes a first variable resistor and a first diode, and the sub unit cell includes a second variable resistor and a second diode.

    摘要翻译: 提供了电阻半导体存储器件的存储单元,具有三维堆叠结构的电阻半导体存储器件及相关方法。 电阻半导体存储器件的存储单元包括双胞胎,其中双胞胎存储表示一位数据的数据值。 双胞胎单元包括连接到主位线和字线的主单元,以及连接到子位线和字线的子单元。 此外,主单元包括第一可变电阻器和第一二极管,并且子单元电池包括第二可变电阻器和第二二极管。

    LAYOUT STRUCTURE IN SEMICONDUCTOR MEMORY DEVICE COMPRISING GLOBAL WORD LINES, LOCAL WORD LINES, GLOBAL BIT LINES AND LOCAL BIT LINES
    4.
    发明申请
    LAYOUT STRUCTURE IN SEMICONDUCTOR MEMORY DEVICE COMPRISING GLOBAL WORD LINES, LOCAL WORD LINES, GLOBAL BIT LINES AND LOCAL BIT LINES 有权
    包含全球字线,本地字线,全球位线和本地位线的半导体存储器件中的布局结构

    公开(公告)号:US20090291522A1

    公开(公告)日:2009-11-26

    申请号:US12509617

    申请日:2009-07-27

    IPC分类号: H01L21/06 G11C5/02

    摘要: A line layout structure and method in a semiconductor memory device having a hierarchical structure are provided. In a semiconductor memory device having a global word line and a local word line, and a global bit line and a local bit line, and individually disposing all of the global word line, the local word line, the global bit line and the local bit line at conductive layers among at least three layers; at least two of the global word line, the local word line, the global bit line and the local bit line are together disposed in parallel on one conductive layer. Signal lines constituting a semiconductor memory device are disposed in a hierarchical structure, whereby a semiconductor memory device advantageously having high integration, high speed and high performance may be obtained.

    摘要翻译: 提供了具有层次结构的半导体存储器件中的线路布局结构和方法。 在具有全局字线和本地字线以及全局位线和局部位线的半导体存储器件中,并且单独地布置全局全局字线,局部字线,全局位线和局部位 在至少三层中的导电层上线; 全局字线,本地字线,全局位线和局部位线中的至少两个在一个导电层上一并设置。 构成半导体存储器件的信号线以分层结构设置,从而可以获得有利地具有高集成度,高速度和高性能的半导体存储器件。

    RESISTANCE RANDOM ACCESS MEMORY HAVING COMMON SOURCE LINE
    5.
    发明申请
    RESISTANCE RANDOM ACCESS MEMORY HAVING COMMON SOURCE LINE 审中-公开
    具有普通源线的电阻随机存取存储器

    公开(公告)号:US20110103134A1

    公开(公告)日:2011-05-05

    申请号:US13004251

    申请日:2011-01-11

    IPC分类号: G11C11/40

    摘要: A method writes data to a resistance random access memory (RRAM) memory cell through first and second write paths, and includes; applying a positive source voltage to a selected source line, applying a word line drive voltage to a selected word line, and applying a voltage at least twice the level of the positive source voltage to a selected bit line via the first write path when writing data having the first state in the memory cell, and applying a ground voltage to the selected bit line via the second write path when writing data having the second state in the memory cell.

    摘要翻译: 一种方法通过第一和第二写入路径将数据写入电阻随机存取存储器(RRAM)存储单元,并且包括: 对所选择的源极线施加正的源极电压,将字线驱动电压施加到所选择的字线,并且当写入数据时,通过第一写入路径将正的源极电压的电平至少两倍的电压施加到所选择的位线 在存储单元中具有第一状态,并且当在存储单元中写入具有第二状态的数据时,经由第二写入路径将接地电压施加到所选择的位线。

    NONVOLATILE MEMORY DEVICE HAVING TWIN MEMORY CELLS
    6.
    发明申请
    NONVOLATILE MEMORY DEVICE HAVING TWIN MEMORY CELLS 有权
    具有两个存储单元的非易失存储器件

    公开(公告)号:US20080273365A1

    公开(公告)日:2008-11-06

    申请号:US12107985

    申请日:2008-04-23

    IPC分类号: G11C5/02

    摘要: A nonvolatile memory device includes multiple first bit lines extending in a first direction, multiple word lines formed on the first bit lines and extending in a second direction different from the first direction, and multiple second bit lines, formed on the word lines and extending in the first direction. The nonvoliative memory device also includes multiple twin memory cells, each of which includes a first memory cell coupled between a first bit line and a word line and a second memory cell coupled between the word line and a second bit line. The first and second memory cells store different data.

    摘要翻译: 非易失性存储器件包括沿第一方向延伸的多个第一位线,形成在第一位线上并在与第一方向不同的第二方向上延伸的多个字线以及形成在字线上并在字线上延伸的多个第二位线 第一个方向。 非易失性存储器件还包括多个双存储器单元,每个存储单元包括耦合在第一位线和字线之间的第一存储器单元和耦合在字线和第二位线之间的第二存储单元。 第一和第二存储单元存储不同的数据。

    RESISTANCE SEMICONDUCTOR MEMORY DEVICE HAVING THREE-DIMENSIONAL STACK AND WORD LINE DECODING METHOD THEREOF
    7.
    发明申请
    RESISTANCE SEMICONDUCTOR MEMORY DEVICE HAVING THREE-DIMENSIONAL STACK AND WORD LINE DECODING METHOD THEREOF 有权
    具有三维堆叠的电阻半导体存储器件及其线解码方法

    公开(公告)号:US20080180981A1

    公开(公告)日:2008-07-31

    申请号:US12020237

    申请日:2008-01-25

    IPC分类号: G11C5/02 G11C8/10 G11C11/36

    摘要: A resistance semiconductor memory device of a three-dimensional stack structure, and a word line decoding method thereof, are provided. In the resistance semiconductor memory device of a three-dimensional stack structure, in which a plurality of word line layers and a plurality of bit line layers are disposed alternately and perpendicularly, and in which a plurality of memory cell layers are disposed between the word line layers and the bit line layers; the resistance semiconductor memory device includes a plurality of bit lines disposed on each of the bit line layers in a first direction as a length direction; a plurality of sub word lines disposed on each of the word line layers in a second direction as a length direction, intersected to the first direction; a plurality of memory cells disposed on the memory cell layers; and a plurality of main word lines individually disposed on a main word line layer specifically adapted over the bit line layers and the word line layers, in the second direction as a length direction, each one of the plurality of main word lines being shared by a predetermined number of sub word lines. An efficient word line decoding adequate to high integration can be achieved.

    摘要翻译: 提供三维堆栈结构的电阻半导体存储器件及其字线解码方法。 在三维堆叠结构的电阻半导体存储器件中,其中多个字线层和多个位线层交替和垂直地布置,并且其中多个存储单元层设置在字线 层和位线层; 电阻半导体存储器件包括沿着第一方向设置在每个位线层上的多个位线作为长度方向; 在与第一方向相交的长度方向的第二方向上配置在每个字线层上的多个子字线; 设置在所述存储单元层上的多个存储单元; 以及多个主字线分别设置在主字线层上,特别适用于位线层和字线层,在第二方向上作为长度方向,多个主字线中的每一条由 预定数量的子字线。 可以实现足够高集成度的有效的字线解码。

    METHOD OF TESTING PRAM DEVICE
    8.
    发明申请
    METHOD OF TESTING PRAM DEVICE 有权
    测试设备的方法

    公开(公告)号:US20080144363A1

    公开(公告)日:2008-06-19

    申请号:US11953146

    申请日:2007-12-10

    IPC分类号: G11C11/00 G11C29/00 G11C8/00

    CPC分类号: G11C29/08 G11C13/0004

    摘要: A method of testing PRAM devices is disclosed. The method simultaneously writes input data to a plurality of memory banks by writing set data to a first group of memory banks and writing reset data to a second group of memory banks, performs a write operation test by comparing data read from the plurality of memory banks with corresponding input data, and determines a fail cell in relation to the test results.

    摘要翻译: 公开了一种测试PRAM设备的方法。 该方法通过将设置数据写入第一组存储体并将复位数据写入第二组存储体,同时将输入数据写入多个存储体,通过比较从多个存储体读取的数据执行写操作测试 与相应的输入数据相关,并确定与测试结果相关的故障单元。

    METHOD OF TESTING PRAM DEVICE
    9.
    发明申请
    METHOD OF TESTING PRAM DEVICE 有权
    测试伪装置的方法

    公开(公告)号:US20100232218A1

    公开(公告)日:2010-09-16

    申请号:US12787571

    申请日:2010-05-26

    IPC分类号: G11C11/00 G11C29/00 G11C8/00

    CPC分类号: G11C29/08 G11C13/0004

    摘要: A method of testing PRAM devices is disclosed. The method simultaneously writes input data to a plurality of memory banks by writing set data to a first group of memory banks and writing reset data to a second group of memory banks, performs a write operation test by comparing data read from the plurality of memory banks with corresponding input data, and determines a fail cell in relation to the test results.

    摘要翻译: 公开了一种测试PRAM设备的方法。 该方法通过将设置数据写入第一组存储体并将复位数据写入第二组存储体,同时将输入数据写入多个存储体,通过比较从多个存储体读取的数据执行写操作测试 与相应的输入数据相关,并确定与测试结果相关的故障单元。

    STACKED MRAM DEVICE AND MEMORY SYSTEM HAVING THE SAME
    10.
    发明申请
    STACKED MRAM DEVICE AND MEMORY SYSTEM HAVING THE SAME 有权
    堆叠的MRAM器件和存储器系统

    公开(公告)号:US20130044538A1

    公开(公告)日:2013-02-21

    申请号:US13586976

    申请日:2012-08-16

    IPC分类号: H01L29/82 G11C11/16

    摘要: Provided is a stacked magnetic random access memory (MRAM) in which memory cell arrays having various characteristics or functions are included in memory cell layers. The stacked MRAM device includes a semiconductor substrate and at least one memory cell layers. The semiconductor substrate includes a first memory cell array. Each of the memory cell layers includes a memory cell array having a different function from the first memory cell array and is stacked on the first memory cell array. As a result, the stacked MRAM device has high density, high performance, and high reliability.

    摘要翻译: 提供了一种堆叠磁性随机存取存储器(MRAM),其中具有各种特性或功能的存储单元阵列被包括在存储单元层中。 层叠MRAM器件包括半导体衬底和至少一个存储单元层。 半导体衬底包括第一存储单元阵列。 每个存储单元层包括具有与第一存储单元阵列不同的功能并且堆叠在第一存储单元阵列上的存储单元阵列。 结果,堆叠的MRAM器件具有高密度,高性能和高可靠性。