公开(公告)号：US08446583B2

公开(公告)日：2013-05-21

申请号：US12662650

申请日：2010-04-27

申请人： Hyun-Jong Kim ,  Chung-Sam Jun ,  Hwan-Shik Park

发明人： Hyun-Jong Kim ,  Chung-Sam Jun ,  Hwan-Shik Park

IPC分类号： G01J4/00

CPC分类号： G01J3/02 ,  G01J3/0208 ,  G01J3/0224 ,  G01N21/211 ,  G01N2021/213 ,  G01N2021/214

摘要： A light focusing unit and a spectrum measuring apparatus having the same are provided. The light focusing unit includes a light source section configured to emit light, a light guiding section configured to guide the light emitted from the light source section along multiple parallel light incidence paths, and a light focusing section configured to direct the light from the guiding section to be incident on a test position of a sample at different incidence angles.

摘要翻译： 提供了一种聚光单元和具有该聚光单元的光谱测量装置。 光聚焦单元包括被配置为发光的光源部分，被配置为沿着多个平行的光入射路径引导从光源部分发射的光的导光部分和被配置为引导来自引导部分的光的光聚焦部分 以不同的入射角入射到样品的测试位置。

公开(公告)号：US20100277729A1

公开(公告)日：2010-11-04

申请号：US12662650

申请日：2010-04-27

申请人： Hyun-Jong Kim ,  Chung-Sam Jun ,  Hwan-Shik Park

发明人： Hyun-Jong Kim ,  Chung-Sam Jun ,  Hwan-Shik Park

IPC分类号： G01J3/447 ,  F21V13/02

CPC分类号： G01J3/02 ,  G01J3/0208 ,  G01J3/0224 ,  G01N21/211 ,  G01N2021/213 ,  G01N2021/214

摘要： A light focusing unit and a spectrum measuring apparatus having the same are provided. The light focusing unit includes a light source section configured to emit light, a light guiding section configured to guide the light emitted from the light source section along multiple parallel light incidence paths, and a light focusing section configured to direct the light from the guiding section to be incident on a test position of a sample at different incidence angles.

摘要翻译： 提供了一种聚光单元和具有该聚光单元的光谱测量装置。 光聚焦单元包括被配置为发光的光源部分，被配置为沿着多个平行的光入射路径引导从光源部分发射的光的导光部分和被配置为引导来自引导部分的光的光聚焦部分 以不同的入射角入射到样品的测试位置。

公开(公告)号：US08747611B2

公开(公告)日：2014-06-10

申请号：US11805758

申请日：2007-05-24

申请人： Hyun-Jong Kim ,  Young-Ki Ahn

发明人： Hyun-Jong Kim ,  Young-Ki Ahn

IPC分类号： B05C11/02 ,  H01L21/30

CPC分类号： H01L21/6708

摘要： Provided are an injection head, and a substrate treatment apparatus and method using the same. The substrate treatment apparatus includes a rotatable spin head supporting a substrate, an injection head installed on the spin head to supply a fluid to a bottom surface of the substrate supported on the spin head, and a fluid supply unit supplying the fluid to the injection head. The injection head includes a body disposed below a center region of the substrate supported on the spin head to receive the fluid from the fluid supply unit and a injection member extending from the body to an edge region of the substrate supported on the spin head to inject the fluid supplied from the body to the bottom surface of the substrate, the injection member having first injection openings injecting the fluid to the edge region of the substrate and second injection openings injecting the fluid to a middle region disposed between the center region and the edge region, and a flow path through which the fluid is supplied to the first injection openings and then to the second injection openings.

摘要翻译： 提供了一种注射头，以及使用该注射头的基底处理装置和方法。 基板处理装置包括支撑基板的旋转旋转头，安装在旋转头上的喷射头，以将流体供应到支撑在旋转头上的基板的底面;以及流体供应单元，其将流体供应到喷射头 。 注射头包括：主体，其设置在支撑在旋转头上的基底的中心区域下方，以从流体供应单元接收流体;以及注射构件，其从主体延伸到支撑在旋转头上的基底的边缘区域以注射 所述流体从所述主体供应到所述基板的底表面，所述注射构件具有将所述流体注入到所述基板的边缘区域的第一注入开口，以及将所述流体注入到所述中心区域和所述边缘之间的中间区域的第二注入开口 以及流体通过其流体被供应到第一注射开口，然后被提供给第二注射开口的流动路径。

公开(公告)号：US08637948B2

公开(公告)日：2014-01-28

申请号：US13552594

申请日：2012-07-18

申请人： Hyun-Jong Kim ,  Czang-Ho Lee ,  Min Park ,  Kyoung-Jin Seo ,  Sang-Won Lee ,  Jun-Ki Hong ,  Byoung-Gook Jeong

发明人： Hyun-Jong Kim ,  Czang-Ho Lee ,  Min Park ,  Kyoung-Jin Seo ,  Sang-Won Lee ,  Jun-Ki Hong ,  Byoung-Gook Jeong

IPC分类号： H01L31/0232 ,  H01L21/00

CPC分类号： H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： A photovoltaic device including a semiconductor substrate having a first surface and a second surface, the second surface being opposite to the first surface; a first passivation layer on the first surface; and a second passivation layer on the second surface, wherein each of the first passivation layer and the second passivation layer comprises an aluminum-based compound, is disclosed. A method of preparing a photovoltaic device, the method including: forming a semiconductor substrate to have a first surface and a second surface, the second surface being opposite to the first surface; forming an emitter region and a back surface field (BSF) region at the second surface; and forming a first passivation layer on the first surface and a second passivation layer on the second surface, wherein the first passivation layer and the second passivation layer are formed concurrently, is also disclosed.

摘要翻译： 一种光电器件，包括具有第一表面和第二表面的半导体衬底，所述第二表面与所述第一表面相对; 第一表面上的第一钝化层; 以及在第二表面上的第二钝化层，其中第一钝化层和第二钝化层中的每一个包括铝基化合物。 一种制备光伏器件的方法，所述方法包括：形成具有第一表面和第二表面的半导体衬底，所述第二表面与所述第一表面相对; 在所述第二表面处形成发射极区域和后表面场（BSF）区域; 并且还公开了在第一表面上形成第一钝化层和第二表面上的第二钝化层，其中同时形成第一钝化层和第二钝化层。

公开(公告)号：US20120291863A1

公开(公告)日：2012-11-22

申请号：US13424674

申请日：2012-03-20

申请人： Dong-Chul SUH ,  Kyoung-Jin Seo ,  Hyun-Jong Kim ,  Byong-Gook Jeong ,  June-Hyuk Jung

发明人： Dong-Chul SUH ,  Kyoung-Jin Seo ,  Hyun-Jong Kim ,  Byong-Gook Jeong ,  June-Hyuk Jung

IPC分类号： H01L31/0216 ,  H01L31/0236 ,  C23C16/455 ,  H01L31/18

CPC分类号： H01L31/02167 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/1868 ,  Y02E10/547 ,  Y02P70/521

摘要： A solar cell includes a base substrate including a first surface and a second surface opposite the first surface, the base substrate being configured to have sunlight incident on the first surface, a doping layer on the first surface of the base substrate, a first passivation layer on the doping layer, the first passivation layer including hydrogen, a first capping layer on the first passivation layer, the first capping layer being configured to prevent discharge of hydrogen from the first passivation layer, a first electrode on the first capping layer, and a second electrode on the second surface of the base substrate.

摘要翻译： 太阳能电池包括：基底，其包括第一表面和与第一表面相对的第二表面，所述基底基底被配置为具有入射在所述第一表面上的阳光，所述基底基板的第一表面上的掺杂层，第一钝化层 在所述掺杂层上，所述第一钝化层包括氢，所述第一钝化层上的第一覆盖层，所述第一覆盖层被配置为防止氢从所述第一钝化层排出，所述第一覆盖层上的第一电极和 第二电极在基底基板的第二表面上。

公开(公告)号：US07934513B2

公开(公告)日：2011-05-03

申请号：US10574113

申请日：2004-10-07

申请人： Joung-Hyeon Lim ,  Jung-Keun Cho ,  Kyo-Woog Koo ,  In-Ho Bang ,  Woo-Young Kim ,  Man-Seok Oh ,  Hyun-Jong Kim

发明人： Joung-Hyeon Lim ,  Jung-Keun Cho ,  Kyo-Woog Koo ,  In-Ho Bang ,  Woo-Young Kim ,  Man-Seok Oh ,  Hyun-Jong Kim

IPC分类号： B08B3/00

CPC分类号： H01L21/67207 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67173 ,  H01L21/67745

摘要： A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes. After the wafers are transferred to a second process chamber being the other one of the process chambers to be subjected to the other processes, they are repositioned from a vertical state to a horizontal state. That is, the wafers are transferred along a loop shape to be processed.

摘要翻译： 用于清洁诸如半导体晶片的基板的设备包括装载/卸载部分，其中晶片从水平状态重新定位到垂直状态的对准部分，执行晶片的蚀刻处理，漂洗和干燥处理的清洁部件，并且具有 多个处理室堆叠，以及界面部分，其中设置传送槽以在处理室之间传送晶片。 当晶片在处理室之间转移时，转移浴用去离子水（DI水）填充，以防止它们暴露于空气中。 从加载/非拉伸部分引出的晶片从水平状态重新定位到垂直状态，并被转移到作为处理室之一进行一部分处理的第一处理室。 在将晶片转移到作为要进行其它处理的另一个处理室的第二处理室之后，它们从垂直状态重新定位到水平状态。 也就是说，晶片沿着要被处理的环形传送。

公开(公告)号：US20130175648A1

公开(公告)日：2013-07-11

申请号：US13552594

申请日：2012-07-18

申请人： Hyun-Jong Kim ,  Czang-Ho Lee ,  Min Park ,  Kyoung-Jin Seo ,  Sang-Won Lee ,  Jun-Ki Hong ,  Byoung-Gook Jeong

发明人： Hyun-Jong Kim ,  Czang-Ho Lee ,  Min Park ,  Kyoung-Jin Seo ,  Sang-Won Lee ,  Jun-Ki Hong ,  Byoung-Gook Jeong

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： A photovoltaic device including a semiconductor substrate having a first surface and a second surface, the second surface being opposite to the first surface; a first passivation layer on the first surface; and a second passivation layer on the second surface, wherein each of the first passivation layer and the second passivation layer comprises an aluminum-based compound, is disclosed. A method of preparing a photovoltaic device, the method including: forming a semiconductor substrate to have a first surface and a second surface, the second surface being opposite to the first surface; forming an emitter region and a back surface field (BSF) region at the second surface; and forming a first passivation layer on the first surface and a second passivation layer on the second surface, wherein the first passivation layer and the second passivation layer are formed concurrently, is also disclosed.

摘要翻译： 一种光电器件，包括具有第一表面和第二表面的半导体衬底，所述第二表面与所述第一表面相对; 第一表面上的第一钝化层; 以及在第二表面上的第二钝化层，其中第一钝化层和第二钝化层中的每一个包括铝基化合物。 一种制备光伏器件的方法，所述方法包括：形成具有第一表面和第二表面的半导体衬底，所述第二表面与所述第一表面相对; 在所述第二表面处形成发射极区域和后表面场（BSF）区域; 并且还公开了在第一表面上形成第一钝化层和第二表面上的第二钝化层，其中同时形成第一钝化层和第二钝化层。

公开(公告)号：US20070275562A1

公开(公告)日：2007-11-29

申请号：US11805758

申请日：2007-05-24

申请人： Hyun-Jong Kim ,  Young-Ki Ahn

发明人： Hyun-Jong Kim ,  Young-Ki Ahn

IPC分类号： B05C11/02 ,  H01L21/302

CPC分类号： H01L21/6708

摘要： Provided are an injection head, and a substrate treatment apparatus and method using the same. The substrate treatment apparatus includes a rotatable spin head supporting a substrate, an injection head installed on the spin head to supply a fluid to a bottom surface of the substrate supported on the spin head, and a fluid supply unit supplying the fluid to the injection head. The injection head includes a body disposed below a center region of the substrate supported on the spin head to receive the fluid from the fluid supply unit and a injection member extending from the body to an edge region of the substrate supported on the spin head to inject the fluid supplied from the body to the bottom surface of the substrate, the injection member having first injection openings injecting the fluid to the edge region of the substrate and second injection openings injecting the fluid to a middle region disposed between the center region and the edge region, and a flow path through which the fluid is supplied to the first injection openings and then to the second injection openings.

摘要翻译： 提供了一种注射头，以及使用该注射头的基底处理装置和方法。 基板处理装置包括支撑基板的旋转旋转头，安装在旋转头上的喷射头，以将流体供应到支撑在旋转头上的基板的底面;以及流体供应单元，其将流体供应到喷射头 。 注射头包括：主体，其设置在支撑在旋转头上的基底的中心区域下方，以从流体供应单元接收流体;以及注射构件，其从主体延伸到支撑在旋转头上的基底的边缘区域以注射 所述流体从所述主体供应到所述基板的底表面，所述注射构件具有将所述流体注入到所述基板的边缘区域的第一注入开口，以及将所述流体注入到所述中心区域和所述边缘之间的中间区域的第二注入开口 以及流体通过其流体被供应到第一注射开口，然后被提供给第二注射开口的流动路径。

公开(公告)号：US20070224820A1

公开(公告)日：2007-09-27

申请号：US10574113

申请日：2004-10-07

申请人： Joung-Hyeon Lim ,  Jung-Keun Cho ,  Kyo-Woog Koo ,  In-Ho Bang ,  Woo-Young Kim ,  Man-Seok Oh ,  Hyun-Jong Kim

发明人： Joung-Hyeon Lim ,  Jung-Keun Cho ,  Kyo-Woog Koo ,  In-Ho Bang ,  Woo-Young Kim ,  Man-Seok Oh ,  Hyun-Jong Kim

IPC分类号： H01L21/302

CPC分类号： H01L21/67207 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67173 ,  H01L21/67745

摘要： A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes. After the wafers are transferred to a second process chamber being the other one of the process chambers to be subjected to the other processes, they are repositioned from a vertical state to a horizontal state. That is, the wafers are transferred along a loop shape to be processed.

摘要翻译： 用于清洁诸如半导体晶片的基板的设备包括装载/卸载部分，其中晶片从水平状态重新定位到垂直状态的对准部分，执行晶片的蚀刻处理，漂洗和干燥处理的清洁部件，并且具有 多个处理室堆叠，以及界面部分，其中设置传送槽以在处理室之间传送晶片。 当晶片在处理室之间转移时，转移浴用去离子水（DI水）填充，以防止它们暴露于空气中。 从加载/非拉伸部分引出的晶片从水平状态重新定位到垂直状态，并被转移到作为处理室之一进行一部分处理的第一处理室。 在将晶片转移到作为要进行其它处理的另一个处理室的第二处理室之后，它们从垂直状态重新定位到水平状态。 也就是说，晶片沿着要被处理的环形传送。

公开(公告)号：US20130112252A1

公开(公告)日：2013-05-09

申请号：US13528790

申请日：2012-06-20

申请人： Kyoung-Jin Seo ,  Czang-Ho Lee ,  Hyun-Jong Kim ,  Min Park ,  Jun-Ki Hong ,  Byong-Gook Jeong

发明人： Kyoung-Jin Seo ,  Czang-Ho Lee ,  Hyun-Jong Kim ,  Min Park ,  Jun-Ki Hong ,  Byong-Gook Jeong

IPC分类号： H01L31/0352 ,  H01L31/18 ,  H01L31/065

CPC分类号： H01L31/02167 ,  H01L31/03529 ,  H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： A solar cell including a first conductive type semiconductor substrate; a first conductive type first semiconductor layer on a back surface of the semiconductor substrate; a second conductive type second semiconductor layer on the back surface of the semiconductor substrate at a height different from the first semiconductor layer, the second semiconductor layer being separated from the first semiconductor layer; and a passivation layer on the back surface of the semiconductor substrate. The passivation layer covers at least a portion of the first semiconductor layer and at least a portion of the second semiconductor layer. The passivation layer includes impurities.

摘要翻译： 一种太阳能电池，包括第一导电型半导体衬底; 在所述半导体衬底的背面上的第一导电型第一半导体层; 在与第一半导体层不同的高度的半导体衬底的背表面上的第二导电类型的第二半导体层，第二半导体层与第一半导体层分离; 以及半导体衬底的背面上的钝化层。 钝化层覆盖第一半导体层的至少一部分和第二半导体层的至少一部分。 钝化层包括杂质。