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公开(公告)号：US10231369B2
公开(公告)日：2019-03-12
申请号：US15783053
申请日：2017-10-13
申请人： IBIDEN CO., LTD.
摘要： A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves, and a metal layer formed on a portion of the side wall portion such that the metal layer is interposed between the conductive film and the portion of the side wall portion. The side wall and ceiling portions are forming an accommodation space to accommodate an electronic component, and the metal layer is formed on a surface of the side wall portion on the opposite side of a surface of the side wall portion facing the ceiling portion and interposed between the conductive film and the side wall portion.
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公开(公告)号：US11277925B2
公开(公告)日：2022-03-15
申请号：US16887443
申请日：2020-05-29
申请人： IBIDEN CO., LTD.
摘要： A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer.
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公开(公告)号：US20190124765A1
公开(公告)日：2019-04-25
申请号：US16165743
申请日：2018-10-19
申请人： IBIDEN CO., LTD.
CPC分类号： H05K1/115 , H05K3/0038 , H05K3/424 , H05K3/429 , H05K3/4644 , H05K3/465 , H05K3/4661 , H05K2201/09827 , H05K2203/0723 , H05K2203/107
摘要： A printed wiring board includes: a core substrate having a core layer, conductor layers on the core layer, and through-hole conductors; a first build-up layer including an insulating layer on the substrate, an inner side conductor layer on the insulating layer, an outermost insulating layer on the inner side conductor layer, and an outermost conductor layer on the outermost insulating layer; and a second build-up layer including an insulating layer on the substrate, an inner side conductor layer on the insulating layer, an outermost insulating layer on the inner side conductor layer, and an outermost conductor layer on the outermost insulating layer. Each of the conductor layers, inner side conductor layers, and outermost conductor layers has a metal foil, a seed layer and an electrolytic plating film, and that each inner side conductor layer has the smallest thickness among the conductor layers, inner side conductor layers and outermost conductor layers.
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公开(公告)号：US10182518B2
公开(公告)日：2019-01-15
申请号：US15783330
申请日：2017-10-13
申请人： IBIDEN CO., LTD.
摘要： A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.
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公开(公告)号：US20180110164A1
公开(公告)日：2018-04-19
申请号：US15783330
申请日：2017-10-13
申请人： IBIDEN CO., LTD
CPC分类号： H05K9/0086 , H05K9/003 , H05K9/0084 , H05K9/0088 , H05K13/0084 , H05K2201/0338 , H05K2201/0707
摘要： A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.
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公开(公告)号：US10813232B2
公开(公告)日：2020-10-20
申请号：US15671451
申请日：2017-08-08
申请人： IBIDEN CO., LTD.
摘要： A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer.
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公开(公告)号：US10440823B2
公开(公告)日：2019-10-08
申请号：US16245396
申请日：2019-01-11
申请人： IBIDEN CO., LTD.
摘要： A printed wiring board includes a core substrate, a first build-up layer, and a second build-up layer. The core substrate includes a core layer, through-hole conductors and through-hole lands. Metal foils of the through-hole lands in the core substrate have mat surfaces at interfaces of the core layer in the core substrate, metal foils of via lands in the build-up layers have inner mat surfaces at interfaces of insulating layers, and metal foils of outermost conductor layers in the build-up layers have outermost mat surfaces at interfaces of outermost insulating layers. Ten-point average roughness (RzI1) of the inner first mat surface is smaller than each often-point average roughness (Rz1, Rz2) of the mat surfaces and ten-point average roughness (RzO1, RzO2) of the outermost mat surfaces. Ten-point average roughness (RzI2) of the inner second mat surface is smaller than each of the ten-point average roughness (Rz1, Rz2, RzO1, RzO2).
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公开(公告)号：US20190124766A1
公开(公告)日：2019-04-25
申请号：US16166392
申请日：2018-10-22
申请人： IBIDEN CO., LTD.
CPC分类号： H05K1/115 , H05K1/0298 , H05K1/16 , H05K3/4644 , H05K2201/09227 , H05K2201/09727 , H05K2201/09827 , H05K2203/107 , H05K2203/1572
摘要： A printed wiring board includes: a core substrate having a core layer and first and second conductor layers; a first build-up layer including a first insulating layer, an inner first conductor layer, an outermost first insulating layer, and an outermost first conductor layer; and a second build-up layer including a second insulating layer, an inner second conductor layer, an outermost second insulating layer, and an outermost second conductor layer. Each conductor layer includes metal foil, seed layer, and electrolytic plating film, t1/T1, t2/T2, u1/U1 and u2/U2 are smaller than 1, and s1/S1 and s2/S2 are larger than 1, where t1, t2, u1, u2, s1 and s2 are electrolytic plating film thicknesses of the first and second and outermost and inner first and second conductor layers, T1, T2, U1 , U2, S1 and S2 are metal foil thicknesses of the first and second and outermost and inner first and second conductor layers.
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公开(公告)号：US10194569B2
公开(公告)日：2019-01-29
申请号：US15782275
申请日：2017-10-12
申请人： IBIDEN CO., LTD.
摘要： A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The ceiling portion includes a resin material and a reinforcing material, and the cap member is formed such that the side wall portion and the ceiling portion are forming an accommodation space to accommodate an electronic component.
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公开(公告)号：US20180270951A1
公开(公告)日：2018-09-20
申请号：US15920594
申请日：2018-03-14
申请人： IBIDEN CO., LTD.
CPC分类号： H05K1/113 , H05K1/0206 , H05K1/0207 , H05K1/0373 , H05K3/061 , H05K3/14 , H05K3/18 , H05K3/24 , H05K3/424 , H05K3/429 , H05K3/4682 , H05K2201/09827 , H05K2203/0152 , H05K2203/0278 , H05K2203/0307 , H05K2203/0723 , H05K2203/107
摘要： A printed wiring board includes a first conductor layer forming an inner conductor layer, a second conductor layer forming a first outemiost conductor layer, a third conductor layer forming a second outermost conductor layer, insulating layers including first and second insulating layers, first via conductors connecting the first and second conductor layers, and second via conductors connecting the first and third conductor layers. The first conductor layer has thickness greater than thicknesses of the second and third conductor layers, the second conductor layer includes component mounting pads positioned to mount an electronic component on the second conductor layer and extending outside component mounting region corresponding to projection region of the component, and the first via conductors include a first set of the first via conductors formed directly underneath the component mounting region and a second set of the first via conductors formed on outer side of the component mounting region.
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