公开(公告)号：US09538642B2

公开(公告)日：2017-01-03

申请号：US14202324

申请日：2014-03-10

Applicant: IBIDEN CO., LTD.

Inventor： Kosuke Ikeda

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  H05K3/38

CPC classification number: H05K1/0298 ,  H05K1/0296 ,  H05K1/0373 ,  H05K3/381 ,  H05K3/4644 ,  H05K3/4676 ,  H05K3/4682 ,  Y10T29/49117

Abstract: A wiring board includes a core structure including a core substrate, and a buildup structure formed on the core structure and including an interlayer insulating layer and a conductive layer. The interlayer insulating layer does not contain inorganic fiber and includes a resin and an inorganic filler, and the conductive layer is formed on the interlayer insulating layer such that the inorganic filler in the interlayer insulating layer is not in contact with the conductive layer.

Abstract translation: 布线基板包括芯结构，该芯结构包括芯基板和形成在芯结构上并包括层间绝缘层和导电层的堆积结构。 层间绝缘层不含无机纤维，并且包括树脂和无机填料，并且在层间绝缘层上形成导电层，使得层间绝缘层中的无机填料不与导电层接触。

公开(公告)号：US11729912B2

公开(公告)日：2023-08-15

申请号：US17388134

申请日：2021-07-29

Applicant: IBIDEN CO., LTD.

Inventor： Kosuke Ikeda

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/38 ,  H05K3/10

CPC classification number: H05K1/119 ,  H05K3/381 ,  H05K1/0373 ,  H05K3/108 ,  H05K2201/0344

Abstract: A wiring substrate includes an insulating layer including inorganic fillers and resin, and a conductor layer formed on a surface of the insulating layer and having a conductor pattern. The surface of the insulating layer has an arithmetic average roughness Ra in the range of 0.05 μm to 0.5 μm, the conductor layer includes a metal film formed on the surface of the insulating layer, and the inorganic fillers include a first inorganic filler including particles such that each of the particles has a portion of a surface separated from the resin and forming a gap with respect to the resin of the insulating layer and that the metal film of the conductor layer includes part formed in the gap between the first inorganic filler and the resin.

公开(公告)号：US10070523B2

公开(公告)日：2018-09-04

申请号：US15084992

申请日：2016-03-30

Applicant: IBIDEN CO., LTD.

Inventor： Shunsuke Sakai ,  Toshiki Furutani ,  Kosuke Ikeda ,  Takema Adachi ,  Takayuki Katsuno

IPC: H05K1/11 ,  H05K3/40 ,  H01L21/48 ,  H01L23/498 ,  H01L23/14 ,  H01L23/12 ,  H05K3/36 ,  H05K3/20 ,  H05K3/38

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R2, and the first and second roughnesses R1, R2 satisfy R1>R2.

公开(公告)号：US09775237B2

公开(公告)日：2017-09-26

申请号：US15153884

申请日：2016-05-13

Applicant: IBIDEN CO., LTD.

Inventor： Kosuke Ikeda

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/46 ,  H05K3/40

CPC classification number: H05K1/0298 ,  H05K1/0204 ,  H05K1/0373 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4038 ,  H05K3/4652 ,  H05K3/4661 ,  H05K3/4673 ,  H05K3/4697 ,  H05K2201/0183 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/10416

Abstract: A wiring substrate includes a core substrate, and a build-up layer including conductor layers and insulating layers alternately laminated on the substrate and via conductors formed in the insulating layers, each insulating layer having a coating layer and a support layer stacked on the coating layer such that the support layer has surface on which a conductor layer is laminated and the coating layer is covering a conductor layer, each via conductor connecting two conductor layers through an insulating layer. The coating layer has a thickness greater than that of the support layer and includes inorganic filler at content rate of 65 to 85% by mass, and the support layer includes inorganic filler at different content rate such that thermal expansion coefficient of the coating layer is smaller than that of the support layer and the coefficients of the coating and support layers have difference of 30 ppm/° C. or less.