公开(公告)号：US12232257B2

公开(公告)日：2025-02-18

申请号：US17456390

申请日：2021-11-24

Applicant: IBIDEN CO., LTD.

Inventor： Shunsuke Sakai ,  Shuto Iwata ,  Ikuya Terauchi ,  Takahiro Yamada

IPC: H05K1/11 ,  H05K1/18

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on the insulating layer and including a conductor pad having a rectangular planar shape, and a solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer formed on the insulating layer. The solder resist layer has an opening formed such that the opening is exposing 50% or more of an area of a surface of the conductor pad on the opposite side with respect to the insulating layer and exposing a side surface and the surface of the conductor pad at side portions of a peripheral edge of the conductor pad and that the solder resist layer is covering the side surface and the surface of the conductor pad at one or more of corner portions of the peripheral edge of the conductor pad.

公开(公告)号：US10070523B2

公开(公告)日：2018-09-04

申请号：US15084992

申请日：2016-03-30

Applicant: IBIDEN CO., LTD.

Inventor： Shunsuke Sakai ,  Toshiki Furutani ,  Kosuke Ikeda ,  Takema Adachi ,  Takayuki Katsuno

IPC: H05K1/11 ,  H05K3/40 ,  H01L21/48 ,  H01L23/498 ,  H01L23/14 ,  H01L23/12 ,  H05K3/36 ,  H05K3/20 ,  H05K3/38

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R2, and the first and second roughnesses R1, R2 satisfy R1>R2.

公开(公告)号：US09859221B2

公开(公告)日：2018-01-02

申请号：US14626085

申请日：2015-02-19

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka Shimabe ,  Toshiki Furutani ,  Shunsuke Sakai

IPC: H05K1/18 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L21/4857 ,  H01L21/568 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2924/153 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/09972 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayer wiring board with built-in electronic components includes a substrate including an insulating material and having multiple opening portions, a first conductor layer formed on a surface of the substrate and having an opening portion such that the substrate has the opening portions inside the opening portion of the first conductor layer, multiple electronic components positioned in the opening portions of the substrate, and an insulating layer formed on the substrate such that the insulating layer is formed on the electronic components and on the first conductor layer. The opening portions are formed in the substrate such that the opening portions include two opening portions and that the substrate has a partition wall formed between the two opening portions.

公开(公告)号：US09564392B2

公开(公告)日：2017-02-07

申请号：US14992197

申请日：2016-01-11

Applicant: IBIDEN CO., LTD.

Inventor： Toshiki Furutani ,  Shunsuke Sakai ,  Yasushi Inagaki

IPC: H01L23/498 ,  H05K1/03 ,  H01L23/31 ,  H01L23/055 ,  H01L25/065

CPC classification number: H01L23/49833 ,  H01L23/055 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H05K1/0313 ,  H05K3/007 ,  H05K3/205 ,  H01L2924/00014

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the conductor layer has a first surface exposed on a first surface side of the insulating layer, and a conductor post formed on a second surface of the conductor layer on the opposite side with respect to the first surface such that the conductor post has a side surface covered by the insulating layer. The conductor post has an end surface on the opposite with respect to the conductor layer such that the end surface of the conductor post is exposed on a second surface side of the insulating layer, and the conductor post has an end portion on a wiring conductor layer side such that the side surface in the end portion is a curved side surface which is bending outward increasingly toward from the conductor layer.

Abstract translation: 印刷电路板包括树脂绝缘层，布置在绝缘层中的布线导体层，使得导体层具有暴露在绝缘层的第一表面侧上的第一表面和形成在绝缘层的第二表面上的导体柱 导体层相对于第一表面在相对侧上，使得导体柱具有被绝缘层覆盖的侧表面。 所述导体柱相对于所述导体层具有相对的端面，使得所述导体柱的端面暴露在所述绝缘层的第二表面侧上，并且所述导体柱在布线导体层上具有端部 使得端部的侧面是从导体层向外侧朝外侧弯曲的弯曲侧面。

公开(公告)号：US10477682B2

公开(公告)日：2019-11-12

申请号：US16245336

申请日：2019-01-11

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Shunsuke Sakai

IPC: H05K1/14 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03

Abstract: A printed wiring board includes a build-up layer including an insulating layer and a first conductor layer including a component mounting pad, a covering layer formed on the build-up layer such that the covering layer is covering the insulating layer and has opening exposing the pad, a reinforcement layer formed on the covering layer and having cavity exposing the pad and the covering layer, a conductor layer formed on the reinforcement layer such that the conductor layer is on the opposite side of the covering layer on the build-up layer, and a via conductor formed in the reinforcement layer such that the via conductor electrically connects the first conductor layer and conductor layer on the reinforcement layer. The first conductor layer is embedded in the insulating layer forming a surface of the build-up layer such that the first conductor layer has surface exposed on the surface of the build-up layer.

公开(公告)号：US09119322B2

公开(公告)日：2015-08-25

申请号：US14510219

申请日：2014-10-09

Applicant: IBIDEN CO., LTD.

Inventor： Yukinobu Mikado ,  Shunsuke Sakai ,  Takashi Kariya ,  Toshiki Furutani

IPC: H05K1/18 ,  H05K3/30 ,  H01G2/06 ,  H05K1/11 ,  H05K3/32 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01G2/06 ,  H05K1/0207 ,  H05K1/115 ,  H05K3/30 ,  H05K3/32 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49146

Abstract: A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.

Abstract translation: 布线板包括具有开口部分的基板，位于基板的开口部分中的电子部件，并且包括第一和第二电子部件，以及形成在基板和第一和第二部件上的绝缘层。 第一部件具有在第一部件的侧面具有侧部的第一电极和第二电极，第二部件具有第一部件和第二电极，第一部件的第一电极和第二电极具有在第二部件的侧面上的侧面部分，第一部件的第一电极和第一部件的第一电极 第二部件被设定为具有大致相同的电位，并且第一部件和第二部件位于基板的开口部分中，使得第一部件的第一电极的侧部位于第二部件的侧部 第二部件的第一电极。

公开(公告)号：US20190215958A1

公开(公告)日：2019-07-11

申请号：US16245336

申请日：2019-01-11

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Shunsuke Sakai

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03

Abstract: A printed wiring board includes a build-up layer including an insulating layer and a first conductor layer including a component mounting pad, a covering layer formed on the build-up layer such that the covering layer is covering the insulating layer and has opening exposing the pad, a reinforcement layer formed on the covering layer and having cavity exposing the pad and the covering layer, a conductor layer formed on the reinforcement layer such that the conductor layer is on the opposite side of the covering layer on the build-up layer, and a via conductor formed in the reinforcement layer such that the via conductor electrically connects the first conductor layer and conductor layer on the reinforcement layer. The first conductor layer is embedded in the insulating layer forming a surface of the build-up layer such that the first conductor layer has surface exposed on the surface of the build-up layer.

公开(公告)号：US09282635B2

公开(公告)日：2016-03-08

申请号：US14669329

申请日：2015-03-26

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka Shimabe ,  Shunsuke Sakai

IPC: H05K7/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0284 ,  H01L21/568 ,  H01L24/19 ,  H01L24/25 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2924/15313 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0344 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A multilayer wiring board with a built-in electronic component includes a substrate, a conductor layer formed on surface of the substrate, one or more electronic components positioned in a cavity formed through the substrate, an insulating layer formed on the substrate such that the insulating layer is formed on the component in the cavity, and a wiring layer formed on the insulating layer. The conductor layer has an opening formed such that the cavity is formed in the opening of the conductor layer and that the conductor layer has a first side in the opening and a second side in the opening on the opposite side across the cavity, and the cavity is formed in the opening of the conductor layer such that width between the cavity and the first side of the conductor layer is greater than width between the cavity and the second side of the conductor layer.

Abstract translation: 具有内置电子部件的多层布线基板包括基板，形成在基板的表面上的导体层，位于通过基板形成的空腔中的一个或多个电子部件，形成在基板上的绝缘层， 在空腔中的部件上形成层，以及形成在绝缘层上的布线层。 导体层具有形成为使得空腔形成在导体层的开口中并且导体层在开口中具有第一侧的开口，并且在开口中的相对于空腔的开口中的第二侧，并且空腔 形成在导体层的开口中，使得空腔和导体层的第一侧之间的宽度大于导体层的空腔和第二侧之间的宽度。

公开(公告)号：US20160044783A1

公开(公告)日：2016-02-11

申请号：US14821961

申请日：2015-08-10

Applicant: IBIDEN CO., LTD.

Inventor： Toshiki Furutani ,  Shunsuke Sakai ,  Yasushi Inagaki

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4007 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/48091 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/068 ,  H01L2924/00014

Abstract: A printed wiring board includes a wiring conductor layer having a first surface, conductor posts formed on a second surface of the wiring conductor layer on the opposite side with respect to the first surface, and a resin insulating layer embedding the wiring conductor layer such that the first surface of the wiring conductor layer is recessed with respect to a first surface of the resin insulating layer and exposed on the first surface of the resin insulating layer and covering side surfaces of the conductor posts such that an end surface of each of the conductor posts is protruding from a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer.

Abstract translation: 印刷电路板包括具有第一表面的布线导体层，形成在相对于第一表面的相对侧的布线导体层的第二表面上的导体柱，以及嵌入布线导体层的树脂绝缘层， 布线导体层的第一表面相对于树脂绝缘层的第一表面凹陷，并且暴露在树脂绝缘层的第一表面上并覆盖导体柱的侧表面，使得每个导体柱的端表面 从树脂绝缘层的与树脂绝缘层的第一表面相反的一侧的第二表面突出。

公开(公告)号：US20150245492A1

公开(公告)日：2015-08-27

申请号：US14626085

申请日：2015-02-19

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka SHIMABE ,  Toshiki Furutani ,  Shunsuke Sakai

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H01L23/5389 ,  H01L21/4857 ,  H01L21/568 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2924/153 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/09972 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayer wiring board with built-in electronic components includes a substrate including an insulating material and having multiple opening portions, a first conductor layer formed on a surface of the substrate and having an opening portion such that the substrate has the opening portions inside the opening portion of the first conductor layer, multiple electronic components positioned in the opening portions of the substrate, and an insulating layer formed on the substrate such that the insulating layer is formed on the electronic components and on the first conductor layer. The opening portions are formed in the substrate such that the opening portions include two opening portions and that the substrate has a partition wall formed between the two opening portions.

Abstract translation: 具有内置电子部件的多层布线基板包括具有绝缘材料并具有多个开口部的基板，形成在基板的表面上的具有开口部的第一导体层，使得基板在开口部内部具有开口部 第一导体层的一部分，位于基板的开口部的多个电子部件和形成在基板上的绝缘层，使得绝缘层形成在电子部件上和第一导体层上。 开口部形成在基板上，使得开口部分包括两个开口部分，并且基板具有形成在两个开口部之间的分隔壁。