Abstract:
A transparent display system including a display panel, a data acquisition module and a computation module is provided. The data acquisition is adapted to capture a field luminance of a field where the display panel is located and a display information luminance of display information of the display panel. The computation module determines whether a luminance contrast of the display information falls within a range from a lower boundary to an upper boundary, wherein the luminance contrast of the display information equals to the field luminance plus the display information luminance and then divided by the field luminance. If it is determined that the luminance contrast of the display information does not fall within the range from the lower boundary to the upper boundary, a luminance contrast optimization procedure is performed. An operation method of the transparent display system is also provided.
Abstract:
A driving assistance system and a driving assistance method are provided. The driving assistance system includes a physiological information sensing system, an external physical symptom detection system, and a processing device. The physiological information sensing system is configured to sense physiological information of a driver. The external physical symptom detection system is configured to detect an external physical symptom of the driver. The processing device is coupled to the physiological information sensing system and the external physical symptom detection system. When the physiological information of the driver and the external physical symptom of the driver are abnormal, the processing device initiates an emergency procedure.
Abstract:
A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.
Abstract:
A protective structure includes an impact resistant structure and an anti-scratch structure. The impact resistant structure includes a plurality of buffer structures and a plurality of filling structures located around the buffer structures. The anti-scratch structure is located over the impact resistant structure. The anti-scratch structure includes a hard coat layer which covers the impact resistant structure, and a surface anti-scratch layer which covers the hard coat layer.
Abstract:
A foldable display and an image processing method thereof are disclosed. The foldable display comprises a display module, a memory, a sensor module, and a processing unit. The sensor module senses a bending state of the display module. The processing unit generates adjusted images according to an image signal, and stores those adjusted images to a plurality of memory addresses of the memory. The processing unit selects a reading address from those memory addresses according the bending state. The processing unit selects a corresponding adjusted image from the memory according to the reading address and outputs the corresponding adjusted image to the display module.
Abstract:
A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.
Abstract:
A chip package structure and a manufacturing method thereof are provided. The chip package structure includes a frame disposed around a chip, a filling material filled in the space between the chip and the frame, and a protection layer covering the chip, the frame, and the filling material. The Young's modulus of the filling material is respectively smaller than the Young's modulus of the chip, the Young's modulus of the frame, and the Young's modulus of the protection layer.
Abstract:
A protective structure includes an impact resistant structure and an anti-scratch structure. The impact resistant structure includes a plurality of buffer structures and a plurality of filling structures located around the buffer structures. The anti-scratch structure is located over the impact resistant structure. The anti-scratch structure includes a hard coat layer which covers the impact resistant structure, and a surface anti-scratch layer which covers the hard coat layer.
Abstract:
An optical film structure includes a first substrate having a first surface and a second surface, an optical component includes a micro-lens array and disposed on the first surface of the first substrate, a micro-lens array including a plurality of micro-lens units each of which has a round concentrated area with a projected radius R formed on the first surface, a planarization layer disposed on the optical component, a light absorbing layer disposed on the planarization layer and including a plurality of light absorbing units each of which has a width W. Light incident from the second surface of the first substrate and passing through the micro-lens array is focused on the light absorbing units. The micro-lens array and the planarization layer have a difference in refractive index greater than or equal to 0.2; and W is less than or equal to R/2.
Abstract:
A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.