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    STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF
    2.
    发明申请
    STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF 审中-公开

    公开(公告)号：US20180040798A1

    公开(公告)日：2018-02-08

    申请号：US15721743

    申请日：2017-09-30

    Applicant: Industrial Technology Research Institute

    Inventor： Li-Ling Liao ,  Ming-Ji Dai ,  Chun-Kai Liu ,  Cheng-Heng Kao ,  Cheng-Chieh Li ,  Jeffrey Snyder ,  Fivos Drymiotis

    IPC: H01L35/32 ,  H01L35/34

    CPC classification number: H01L35/32 ,  H01L35/08 ,  H01L35/34

    Abstract: A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials. A fabrication method of the foregoing thermoelectric module is also provided.

    ENCAPSULATION OF BACKSIDE ILLUMINATION PHOTOSENSITIVE DEVICE
    3.
    发明申请
    ENCAPSULATION OF BACKSIDE ILLUMINATION PHOTOSENSITIVE DEVICE 有权
    背光照明感光装置的封装

    公开(公告)号：US20140291790A1

    公开(公告)日：2014-10-02

    申请号：US13943810

    申请日：2013-07-17

    Applicant: Industrial Technology Research Institute

    Inventor： Zhi-Cheng Hsiao ,  Ming-Ji Dai ,  Cheng-Ta Ko

    IPC: H01L31/024 ,  H01L27/146

    CPC classification number: H01L31/024 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

    Abstract: An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.

    Abstract translation: 提供了包括电路子安装座，背面照明光敏装置，多个导电端子和散热结构的背面照明光敏装置的封装。 背面照明光敏装置包括互连层和感光器件阵列，其中互连层位于电路子座上，并且位于感光器件阵列和电路子座之间。 导电端子位于互连层和电路子座之间，以电连接互连层和电路子座。 散热结构位于互连层下方，散热结构和感光器件阵列分别位于互连层的两个相对侧。

    MEASUREMENT METHOD, MEASUREMENT APPARATUS, AND COMPUTER PROGRAM PRODUCT
    6.
    发明申请
    MEASUREMENT METHOD, MEASUREMENT APPARATUS, AND COMPUTER PROGRAM PRODUCT 有权
    测量方法，测量装置和计算机程序产品

    公开(公告)号：US20130276464A1

    公开(公告)日：2013-10-24

    申请号：US13854139

    申请日：2013-04-01

    Applicant: Industrial Technology Research Institute

    Inventor： Heng-Chieh Chien ,  Ming-Ji Dai ,  Sheng-Tsai Wu ,  Huey-Lin Hsieh ,  Jing-Yi Huang

    IPC: G01K7/00 ,  F25B21/04

    CPC classification number: G01K7/00 ,  F25B21/04 ,  G01K3/08 ,  H01L35/30 ,  H01L35/32

    Abstract: A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.

    Abstract translation: 提供了一种用于测量热电模块的测量方法，测量装置和计算机程序产品。 向热电模块提供温度。 向热电模块施加电流以将热电模块的两侧转变成热侧和冷侧。 热侧的温度高于冷侧的温度。 在不同的时间点测量热电模块的端电压，热侧的热侧温度和冷侧的冷侧温度。 根据端子电压，热侧温度和冷侧温度，获得端子电压与热侧温度与相应的冷侧温度之间的差异的热电关系。 根据热电关系估计热电模块的至少一个第一参数。

    METHOD AND APPARATUS FOR EQUIPMENT ANOMALY DETECTION
    8.
    发明公开
    METHOD AND APPARATUS FOR EQUIPMENT ANOMALY DETECTION 审中-公开

    公开(公告)号：US20230367306A1

    公开(公告)日：2023-11-16

    申请号：US18173093

    申请日：2023-02-23

    Applicant: Industrial Technology Research Institute

    Inventor： Po-Han Chang ,  An-Chun Luo ,  Tien I Kao ,  Ming-Ji Dai ,  Yi-Jen Lin ,  Po-Huan Chou

    IPC: G05B23/02 ,  G06N20/00

    CPC classification number: G05B23/0283 ,  G06N20/00

    Abstract: A method and an apparatus for equipment anomaly detection are provided. In the method, multiple signals of an equipment during normal operation or appearance images of the equipment when an appearance is not damaged are acquired in advance by using a data acquisition device to train a machine learning model stored in a storage device. A real-time signal of the equipment during a current operation or a current image of the appearance of the equipment is acquired by using the data acquisition device, and input to the trained machine learning model to output a detection result indicating a current operation state of the equipment or a current state of the appearance of the equipment.

    CLASSIFICATION DEVICE AND CLASSIFICATION METHOD BASED ON NEURAL NETWORK
    9.
    发明申请
    CLASSIFICATION DEVICE AND CLASSIFICATION METHOD BASED ON NEURAL NETWORK 有权

    公开(公告)号：US20220114419A1

    公开(公告)日：2022-04-14

    申请号：US17121763

    申请日：2020-12-15

    Applicant: Industrial Technology Research Institute

    Inventor： Yu-Shan Deng ,  An-Chun Luo ,  Po-Han Chang ,  Chun-Ju Lin ,  Ming-Ji Dai

    IPC: G06N3/04

    Abstract: A classification device and a classification method based on a neural network are provided. A heterogeneous integration module includes a convolutional layer, a data normalization layer, a connected layer and a classification layer. The convolutional layer generates a first feature map according to a first image data. The data normalization layer normalizes a first numerical data to generate a first normalized numerical data. The first numerical data corresponds to the first image data. The connected layer generates a first feature vector according to the first feature map and the first normalized numerical data. The classification layer generates a first classification result corresponding to a first time point according to the first feature vector. The heterogeneous integration module generates a second classification result corresponding to a second time point. A recurrent neural network generates a third classification result according to the first classification result and the second classification result.

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