公开(公告)号：US09941652B2

公开(公告)日：2018-04-10

申请号：US14973543

申请日：2015-12-17

Applicant: INTEL CORPORATION

Inventor： Nachiket R. Raravikar ,  James C. Matayabas, Jr. ,  Akshay Mathkar ,  Dingying Xu

IPC: G01R31/28 ,  H01R43/20 ,  G01R1/073

CPC classification number: H01R43/20 ,  G01R1/07378

Abstract: Space transformer including a substrate and a perforated plate disposed on the substrate. The substrate includes conductive traces and an array of conductive probe pins extend outwardly from anchor points on the substrate. The pins are electrically coupled to at least one of the conductive traces on the substrate as an interface between an E-testing apparatus and a DUT. The perforated plate may be affixed to a surface of the substrate and includes an array of perforations through which the conductive pins may pass. The perforated plate may provide one or more of lateral pin support and protection to the underlying substrate and/or traces. The perforated plate may include a metal sheet. A polymeric material may be disposed on at least a sidewall of the perforations to electrically isolate the metal sheet from the conductive probe pins.

公开(公告)号：US10586779B2

公开(公告)日：2020-03-10

申请号：US15792569

申请日：2017-10-24

Applicant: Intel Corporation

Inventor： Nachiket R. Raravikar ,  James C. Matayabas, Jr. ,  Akshay Mathkar

IPC: H01L25/00 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  B23K35/22 ,  B23K35/26 ,  B23K35/36 ,  B23K35/30 ,  B23K35/02 ,  B23K101/40

Abstract: Embodiments describe high aspect ratio and fine pitch interconnects for a semiconductor package, such as a package-on-package structure. In an embodiment, the interconnects are formed with a no-slump solder paste. In an embodiment, the no-slump solder paste is printed in an uncured state, and is then cured with a liquid phase sintering process. After being cured, the no-slump solder paste will not reflow at typical processing temperatures, such as those below approximately 400° C. According to embodiments, the no-slump solder paste includes Cu particles or spheres, a solder matrix component, a polymeric delivery vehicle, and a solvent. In an embodiment, the liquid phase sintering produces a shell of intermetallic compounds around the Cu spheres. In an embodiment, the sintering process builds a conductive metallic network through the no-slump solder paste.

公开(公告)号：US09831206B2

公开(公告)日：2017-11-28

申请号：US14229785

申请日：2014-03-28

Applicant: INTEL CORPORATION

Inventor： Nachiket R. Raravikar ,  James C. Matayabas, Jr. ,  Akshay Mathkar

IPC: H01L23/488 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L23/532 ,  B23K35/22 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L24/17 ,  B23K35/22 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments describe high aspect ratio and fine pitch interconnects for a semiconductor package, such as a package-on-package structure. In an embodiment, the interconnects are formed with a no-slump solder paste. In an embodiment, the no-slump solder paste is printed in an uncured state, and is then cured with a liquid phase sintering process. After being cured, the no-slump solder paste will not reflow at typical processing temperatures, such as those below approximately 400° C. According to embodiments, the no-slump solder paste includes Cu particles or spheres, a solder matrix component, a polymeric delivery vehicle, and a solvent. In an embodiment, the liquid phase sintering produces a shell of intermetallic compounds around the Cu spheres. In an embodiment, the sintering process builds a conductive metallic network through the no-slump solder paste.