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1.发明授权Integrated circuit package system with flexible substrate and recessed package 有权集成电路封装系统，具有柔性基板和凹槽封装公开(公告)号：US08050047B2
公开(公告)日：2011-11-01
申请号：US12136002
申请日：2008-06-09
CPC分类号： H01L25/105 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
摘要翻译： 集成电路封装系统包括：提供具有折叠的柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的凹入封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。
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2.发明申请INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND MOUNDED PACKAGE 有权集成电路封装系统，具有灵活的基板和密封的封装公开(公告)号：US20090016033A1
公开(公告)日：2009-01-15
申请号：US12136007
申请日：2008-06-09
IPC分类号： H05K1/18
CPC分类号： H05K1/189 , H01L23/49816 , H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/105 , H01L25/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/06579 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/141 , H05K1/147 , H05K3/284 , H05K3/3436 , H05K2201/042 , H05K2201/056 , H05K2201/10515 , H05K2201/1053 , H05K2203/1316 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/45099
摘要： An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
摘要翻译： 集成电路封装系统包括：提供柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的堆叠封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。
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3.发明授权Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides 有权半导体堆叠封装组件，其在上侧和下侧具有暴露的衬底表面公开(公告)号：US07372141B2
公开(公告)日：2008-05-13
申请号：US11395529
申请日：2006-03-31
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/552 , H01L24/73 , H01L25/03 , H01L25/105 , H01L25/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/85013 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/19106 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One package is inverted in relation to the other, that is, the die attach sides of the package substrates face one another, and the “land” sides of the substrates face away from one another. Z-interconnection of the packages is by wire bonds connecting the first and second package substrates. The assembly is encapsulated in such a way that both the second package substrate (one side of the assembly) and a portion of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made. One or more additional components may be stacked over the land side of the first package substrate.
摘要翻译： 堆叠的封装组件包括第一和第二堆叠封装，每个封装具有至少一个管芯，该裸管固定到封装衬底的管芯附着侧并与其电连接。 一个封装相对于另一个封装反转，即，封装基板的管芯附接面彼此面对，并且基板的“焊盘”侧面彼此背离。 封装的Z-互连是通过连接第一和第二封装衬底的引线键合。 组件以这样的方式封装，使得第二封装衬底（组件的一侧）和第一封装衬底的一部分（在组件的相对侧）被暴露，使得第二级互连和互连 可以制造组件。 一个或多个附加部件可以堆叠在第一封装基板的接地侧上。
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公开(公告)号：US06861288B2
公开(公告)日：2005-03-01
申请号：US10676736
申请日：2003-09-30
CPC分类号： H01L25/0657 , H01L24/73 , H01L25/03 , H01L25/105 , H01L25/16 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2225/06582 , H01L2225/1005 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A method for fabricating a stacked semiconductor package includes providing a substrate and mounting a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is then mounted on the interposer.
摘要翻译： 一种用于制造堆叠半导体封装的方法，包括提供衬底并将第一半导体器件安装在衬底上。 插入器被支撑在与衬底相对的第一半导体器件的上方。 插入器电连接到基板。 然后将第二半导体器件安装在插入器上。
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5.发明授权Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof 有权具有密封腔内的部件的集成电路封装系统及其制造方法公开(公告)号：US08309397B2
公开(公告)日：2012-11-13
申请号：US13235755
申请日：2011-09-19
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/3135 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L31/0203 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/01067 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating an encapsulant cavity integrated circuit package system includes: providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity.
摘要翻译： 一种用于制造密封腔的集成电路封装系统的方法，包括：提供插入器; 形成第一集成电路封装，其具有具有封装腔的反向底部端子和所述插入件; 以及将组件附接到所述密封剂腔中的所述插入件上。
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6.发明申请INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND RECESSED PACKAGE 有权集成电路封装系统，具有灵活的基板和封装公开(公告)号：US20090016032A1
公开(公告)日：2009-01-15
申请号：US12136002
申请日：2008-06-09
IPC分类号： H05K1/18
CPC分类号： H01L25/105 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
摘要翻译： 集成电路封装系统包括：提供具有折叠的柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的凹入封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。
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7.发明授权公开(公告)号：US07364945B2
公开(公告)日：2008-04-29
申请号：US11306628
申请日：2006-01-04
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/3135 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L31/0203 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/01067 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
摘要翻译： 一种密封腔集成电路封装系统，包括形成第一集成电路封装，其具有具有封装空腔和插入件的反向底部端子，并将组件附接在封装腔中的插入件上。
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公开(公告)号：US20070108568A1
公开(公告)日：2007-05-17
申请号：US11382983
申请日：2006-05-12
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/49555 , H01L23/3107 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2924/00014 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package to package stacking system is provided including providing a first integrated circuit package, having a configured leadframe, providing a second integrated circuit package, having the configured leadframe, and forming an integrated circuit package pair by electrically connecting the configured leadframe of the first integrated circuit package to the configured leadframe of the second integrated circuit package.
摘要翻译： 提供集成电路封装到封装堆叠系统，包括提供第一集成电路封装，具有构造的引线框架，提供具有所配置的引线框架的第二集成电路封装，以及通过电连接所配置的引线框，形成集成电路封装对 第一集成电路封装到第二集成电路封装的配置的引线框架。
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9.发明授权Integrated circuit package system with flexible substrate and mounded package 有权集成电路封装系统，具有柔性基板和堆叠封装公开(公告)号：US08031475B2
公开(公告)日：2011-10-04
申请号：US12136007
申请日：2008-06-09
CPC分类号： H05K1/189 , H01L23/49816 , H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/105 , H01L25/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2225/0651 , H01L2225/06579 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/141 , H05K1/147 , H05K3/284 , H05K3/3436 , H05K2201/042 , H05K2201/056 , H05K2201/10515 , H05K2201/1053 , H05K2203/1316 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/45099
摘要： An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
摘要翻译： 集成电路封装系统包括：提供柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的堆叠封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。
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10.发明申请ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF FABRICATION THEREOF 有权集成电路集成电路封装系统及其制造方法公开(公告)号：US20110018084A1
公开(公告)日：2011-01-27
申请号：US12892907
申请日：2010-09-28
IPC分类号： H01L31/0203 , H01L21/56 , H01L31/18
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/3135 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L31/0203 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/01067 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating an encapsulant cavity integrated circuit package system includes: forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
摘要翻译： 一种用于制造密封腔的集成电路封装系统的方法，包括：形成第一集成电路封装，其具有具有封装腔和反射器的倒置底端，并且将组件附着在封装腔中的插入件上。
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