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公开(公告)号:US11036370B2
公开(公告)日:2021-06-15
申请号:US16141219
申请日:2018-09-25
Applicant: Intel Corporation
Inventor: Fatema Adenwala , Ankitha Chandran , Nageen Himayat , Florence Pon , Divya Vijayaraghavan
IPC: H04W4/44 , G06F3/0484 , G07C5/00 , H04W4/21 , H04W4/46 , G06F3/0481 , H04W4/02 , G05D1/00 , G05D1/02
Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.
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公开(公告)号:US20230359336A1
公开(公告)日:2023-11-09
申请号:US18352224
申请日:2023-07-13
Applicant: Intel Corporation
Inventor: Fatema Adenwala , Ankitha Chandran , Nageen Himayat , Florence Pon , Divya Vijayaraghavan
IPC: G07C5/00 , H04W4/02 , H04W4/21 , H04W4/46 , G06F3/04842 , G06F3/0481 , H04W4/44
CPC classification number: G06F3/04842 , G06F3/0481 , G07C5/008 , H04W4/026 , H04W4/21 , H04W4/44 , H04W4/46 , G05D1/0088 , G05D2201/0213
Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.
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公开(公告)号:US11704007B2
公开(公告)日:2023-07-18
申请号:US17315672
申请日:2021-05-10
Applicant: Intel Corporation
Inventor: Fatema Adenwala , Ankitha Chandran , Nageen Himayat , Florence Pon , Divya Vijayaraghavan
IPC: H04W4/46 , H04W4/44 , G06F3/04842 , G07C5/00 , H04W4/21 , G06F3/0481 , H04W4/02 , G05D1/00 , G05D1/02
CPC classification number: G06F3/04842 , G06F3/0481 , G07C5/008 , H04W4/026 , H04W4/21 , H04W4/44 , H04W4/46 , G05D1/0088 , G05D1/0287 , G05D2201/0213
Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.
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公开(公告)号:US20190047462A1
公开(公告)日:2019-02-14
申请号:US16141710
申请日:2018-09-25
Applicant: Intel Corporation
Inventor: Divya Vijayaraghavan , Nageen Himayat , Florence Pon , Fatema Adenwala , Ankitha Chandran
Abstract: In embodiments, a computer-assisted or autonomous driving (CA/AD) vehicle includes a docking platform to receive one or more unmanned aerial vehicles (UAVs) of different types to dock with the CA/AD vehicle, each UAV to include at least one sensor directed to a configurable specific use of the CA/AD vehicle, and a UAV interface to communicate with the one or more docked UAVs, including to receive sensor data obtained by the one or more UAVs. In embodiments, the CA/AD vehicle is configured to a specific use, based at least in part on the one or more UAVs docked with the CA/AD vehicle.
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公开(公告)号:US20210303137A1
公开(公告)日:2021-09-30
申请号:US17315672
申请日:2021-05-10
Applicant: Intel Corporation
Inventor: Fatema Adenwala , Ankitha Chandran , Nageen Himayat , Florence Pon , Divya Vijayaraghavan
IPC: G06F3/0484 , G07C5/00 , H04W4/21 , H04W4/46 , G06F3/0481 , H04W4/44 , H04W4/02
Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.
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公开(公告)号:US10942562B2
公开(公告)日:2021-03-09
申请号:US16146454
申请日:2018-09-28
Applicant: Intel Corporation
Inventor: Shekoufeh Qawami , Nageen Himayat , Chaitanya Sreerama , Hassnaa Moustafa , Rita Wouhaybi , Linda Hurd , Nadine L Dabby , Van Le , Gayathri Jeganmohan , Ankitha Chandran
IPC: G06F1/00 , G06F1/3296 , G06F1/3212 , G06F1/324 , G06T15/00 , G06K9/00 , G06N5/04 , G06N20/00 , G06F1/3234 , G06F1/3206
Abstract: Methods and apparatus to manage operation of variable-state computing devices using artificial intelligence are disclosed. An example computing device includes a hardware platform. The example computing device also includes an artificial intelligence (AI) engine to: determine a context of the device; and adjust an operation of the hardware platform based on an expected change in the context of the device. The adjustment modifies at least one of a computational efficiency of the device, a power efficiency of the device, or a memory response time of the device.
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7.
公开(公告)号:US20190050049A1
公开(公告)日:2019-02-14
申请号:US16146454
申请日:2018-09-28
Applicant: Intel Corporation
Inventor: Shekoufeh Qawami , Nageen Himayat , Chaitanya Sreerama , Hassnaa Moustafa , Rita Wouhaybi , Linda Hurd , Nadine L Dabby , Van Le , Gayathri Jeganmohan , Ankitha Chandran
Abstract: Methods and apparatus to manage operation of variable-state computing devices using artificial intelligence are disclosed. An example computing device includes a hardware platform. The example computing device also includes an artificial intelligence (AI) engine to: determine a context of the device; and adjust an operation of the hardware platform based on an expected change in the context of the device. The adjustment modifies at least one of a computational efficiency of the device, a power efficiency of the device, or a memory response time of the device.
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公开(公告)号:US11348909B2
公开(公告)日:2022-05-31
申请号:US16146445
申请日:2018-09-28
Applicant: Intel Corporation
Inventor: Maruti Gupta Hyde , Nageen Himayat , Linda Hurd , Min Suet Lim , Van Le , Gayathri Jeganmohan , Ankitha Chandran
IPC: H01L25/18 , H01L23/538 , H01L23/367 , G06N3/08 , G06N3/063 , G06N3/04 , G06F1/3203 , H01L25/10 , G06F1/3296 , G06F1/3237 , G06F1/324 , H01L25/16 , G06F1/20 , G06F1/3206 , G06F1/3225 , G06F1/3287
Abstract: Methods and apparatus to implement efficient memory storage in multi-die packages are disclosed. An example multi-die package includes a multi-die stack including a first die and a second die. The second die is stacked on the first die. The multi-die package further includes a third die adjacent the multi-die stack. The multi-die package also includes a silicon-based connector to communicatively couple the multi-die stack and the third die. The silicon-based connector includes at least one of a logic circuit or a memory circuit.
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公开(公告)号:US20190079659A1
公开(公告)日:2019-03-14
申请号:US16141219
申请日:2018-09-25
Applicant: Intel Corporation
Inventor: Fatema Adenwala , Ankitha Chandran , Nageen Himayat , Florence Pon , Divya Vijayaraghavan
IPC: G06F3/0484 , G07C5/00 , H04W4/21 , H04W4/46 , H04W4/44 , G06F3/0481
Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.
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公开(公告)号:US20190051642A1
公开(公告)日:2019-02-14
申请号:US16146445
申请日:2018-09-28
Applicant: Intel Corporation
Inventor: Maruti Gupta Hyde , Nageen Himayat , Linda Hurd , Min Suet Lim , Van Le , Gayathri Jeganmohan , Ankitha Chandran
IPC: H01L25/18 , H01L23/538 , H01L23/367 , G06F1/32 , G06N3/063 , G06N3/04 , G06N3/08
Abstract: Methods and apparatus to implement efficient memory storage in multi-die packages are disclosed. An example multi-die package includes a multi-die stack including a first die and a second die. The second die is stacked on the first die. The multi-die package further includes a third die adjacent the multi-die stack. The multi-die package also includes a silicon-based connector to communicatively couple the multi-die stack and the third die. The silicon-based connector includes at least one of a logic circuit or a memory circuit.
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